RDA5850_datasheet_v22

Copyright © RDA Microelectronics Inc. 2012. All rights are reserved. The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. RDA5850 BLUETOOTH SINGLE CHIP SOLUTION WITH MULTI-MEDIA Rev.2.2 General Description RDA5850 is a highly integrated single-chip turnkey Bluetooth radio transceiver and baseband processor with multi-media capability. Bluetooth feature is compliant with Bluetooth 2.1 + EDR specification and provides an optimal solution for data and music application. 1.1 Multi-media Feature z External SPI Flash interface z Multi-media Support ♦ SBC ♦ MP3 ♦ WMA ♦ WAV z Stereo audio line input z Supports Serial LCD interface/ LEDs z Power management ♦ Power on reset control ♦ Integrated Battery charger ♦ Integrated all internal voltage supply from VBAT z Audio ♦ Integrated 1W audio speaker driver z User Interface ♦ supports 3x3 keypad matrix detection ♦ Real-time clock ♦ I2C z FM Receiver Integrated z MMC/SD support z USB1.2 device only z IR decode z Voice record z Bluetooth profiles ♦ HFP/HSP ♦ OPP ♦ A2DP ♦ AVRCP 1.2 Bluetooth Feature z CMOS single-chip fully-integrated radio and baseband z Compliant with Bluetooth 2.1 + EDR specification z Bluetooth Piconet and Scatternet support z Meet class2 and class3 transmitting power requirement z Provides +7dbm transmitting power z NZIF receiver with -80dBm sensitivity z Support DCXO with internal oscillator circuit z Low power consumption z ECHO cancel for hands-free RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 2 of 16 2 Table of Contents General Description ......................................................................................................................................... 1  1.1  Multi-media Feature .......................................................................................................................... 1  1.2  Bluetooth Feature ............................................................................................................................... 1  2  Table of Contents ..................................................................................................................................... 2  3  Multi-Media SOC Features ..................................................................................................................... 3  3.1  Analog Module ................................................................................................................................... 3  3.2  PMU .................................................................................................................................................... 3  3.3  FM Tuner ............................................................................................................................................ 3  3.4  System CPU (XCPU) ......................................................................................................................... 4  3.5  Keypad ................................................................................................................................................ 4  3.6  SD/MMC Card Controller ................................................................................................................ 4  3.7  IR Controller ...................................................................................................................................... 4  3.8  LCD Controller .................................................................................................................................. 4  4  Bluetooth Section Features ................................................................................................................... 5  4.1  Radio ................................................................................................................................................... 5  4.2  Bluetooth Stack .................................................................................................................................. 5  5  Electrical Characteristics ....................................................................................................................... 6  6  Bluetooth Section Radio Characteristics .......................................................................................... 7  7  Pins Description ..................................................................................................................................... 10  8  Physical Dimension ............................................................................................................................... 15  9  Change List .............................................................................................................................................. 16  RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 3 of 16 3 Multi-Media SOC Features Integrating all essential electronic components, including power management, FM receiver onto a single system on chip, RDA5850 offers best in class bill of material, space requirement and cost/feature ratio for complete Bluetooth enabled multi-media system. Built around a cost effective 32-bit XCPU RISC core running at up to 312MHz with 4k of Instruction cache and 4k of Data cache, RDA5850 offers plenty of processing power for multimedia applications. A high performance proprietary 16/32-bit digital signal processing engine can further improve overall performance and user experience when performing complex multimedia tasks. It is also packed with impressive connectivity for easy scalability of the system, including SDMMC Memory Cards, Serial LCD and USB (slave, full speed). 3.1 Analog Module z Differential 13 bit Audio ADC and 16 bit stereo DAC z 1W stereo loudspeaker amplifier z Audio line in z Full Speed USB PHY 1.1 3.2 PMU z Complete integrated power management system z Integrated LDO voltage regulators z Implement both LCD back light and keypad LED drivers 3.3 FM Tuner z Support worldwide frequency band 65-108MHz z Digital low-IF tuner z Fully integrated digital frequency synthesizer z Autonomous search tuning z Digital auto gain control (AGC) z Digital adaptive noise cancellation z Programmable de-emphasis (50/75 ms) z Receive signal strength indicator (RSSI) z Bass boost z Volume control RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 4 of 16 3.4 System CPU (XCPU) z RDA RISC Core ♦ 32x32 bits Multiplier Accumulator (MAC) ♦ 16/32 bit instruction set z 4 kByte Instruction Cache z 4 kByte Data Cache 3.5 Keypad z 3x3 matrix support with de-bouncing and interrupt generation z Key On input with de-bouncing and interrupt generation 3.6 SD/MMC Card Controller z SD Card specification Version 2.0 z SDIO Version 1.10 z MMC specification Version 3.1 3.7 IR Controller z Support NEC protocol z User code and key code programmable 3.8 LCD Controller z SPI interface for LCM z Max size 128x64 RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 5 of 16 4 Bluetooth Section Features 4.1 Radio ♦ Build-in TX/RX switch ♦ Fully integrated synthesizer without any external component ♦ Class2 and class3 transmit output power supported and over 30dB dynamic control range ♦ Supports π/4 DQPSK and 8DPSK modulation ♦ High performance in receiver sensitivity and over 80dB dynamic range ♦ Integrated channel filter ♦ Support eSCO and AFH ♦ Support up to Bluetooth v2.1 + EDR 4.2 Bluetooth Stack ♦ Compliant with Bluetooth 2.1 + EDR specification ♦ Profile included AVRCP, A2DP, OPP, HSP/HFP RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 6 of 16 5 Electrical Characteristics Table 5-1 DC Electrical Specification (Recommended Operation Conditions): SYMBOL DESCRIPTION MIN TYP MAX UNIT Tamb Ambient Temperature -20 27 +50 ℃ VIL CMOS Low Level Input Voltage 0 0.3*VIO V VIH CMOS High Level Input Voltage 0.7*VIO VIO V VTH CMOS Threshold Voltage 0.5*VIO V Notes: 1. VIO=1.8~3.3V Table 5-2 DC Electrical Specification (Absolute Maximum Ratings): SYMBOL DESCRIPTION MIN TYP MAX UNIT Tamb Ambient Temperature -20 +50 °C IIN Input Current -10 +10 mA VIN Input Voltage -0.3 VIO+0.3 V Vlna LNA Input Level +5 dBm DC Charger 5 7 V Notes: 1. VIO=1.8~3.3V Table 5-3 DC Electrical Specification (Power Supply): SYMBOL DESCRIPTION MIN TYP MAX UNIT VBAT 3.8 4.2 V VCORE 1.2 1.4 V V_BUCK_2V4 2.4 V ADD_2V4 2.4 V V_BOOST_4V3 4.3 V V_RTC 1.2 V V_USB 3.3 V V_PAD, V_SPIMEM, V_LCD, V_MMC 2.8 3.0 V Notes: 1. VIO=1.8~3.3V RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 7 of 16 6 Bluetooth Section Radio Characteristics Table 6-1 Receiver Characteristics ------ Basic Data Rate (VBAT = 4.0 V, TA = 27°C, unless otherwise specified) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT General specifications Sensitivity @0.1% BER / -80 / dBm Maximum received signal@0.1% BER 0 / / dBm C/I c-channel / +10 / dB Adjacent channel selectivity C/I F=F0 + 1MHz / / -5 dB F=F0 - 1MHz / / 0 dB F=F0 + 2MHz / / -33 dB F=F0 - 2MHz / / -30 dB F=F0 + 3 MHz / / -45 dB F=F0 - 3MHz / / -40 dB Adjacent channel selectivity C/I F=Fimage / / 0 dB Out-of-band blocking performance 30MHz–2000MHz -10 / / dBm 2000MHz–2400MHz -27 / / dBm 2500MHz–3000MHz -27 / / dBm 3000MHz–12.5GHz -10 / / dBm Intermodulation -35 / / dBm Spurious output level -150 / / dBm/Hz Notes: Table 6-2 Transmit Characteristics ------ Basic Data Rate (VBAT = 4.0V, TA = 27 °C, unless otherwise specified) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT General specifications Maximum RF transmit power / +4 7 dBm RF power control range 25 / / dB 20dB band width / 0.9 / MHz Adjacent channel transmit power F=F0 + 1MHz / -20 / dBm F=F0 - 1MHz / -20 / dBm F=F0 + 2MHz / -35 / dBm F=F0 - 2MHz / -35 / dBm F=F0 + 3MHz / -40 / dBm F=F0 - 3MHz / -40 / dBm F=F0 + >3MHz / / -46 dBm RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 8 of 16 F=F0 - >3MHz -46 / / dBm △f1avg Maximum modulation / 164 / kHz △f2max Minimum modulation / 145 / kHz △f2avg△/ f1avg 0.80 / / / ICFT / +4 / kHz Drift rate / 0.1 / kHz/50us Drift (1 slot packet) / -2 / kHz Drift (5 slot packet) / -2 / kHz Notes: Table 6-3 Receiver Characteristics ------ Enhanced Data Rate (VBAT = 4.0 V, TA = 27°C, unless otherwise specified) PARAMETER CONDITIONS MIN TYP MAX UNIT π/4 DQPSK Sensitivity @0.01% BER / -80 / dBm Maximum received signal@0.1% BER 0 / / dBm C/I c-channel / / +13 dB Adjacent channel selectivity C/I F=F0 + 1MHz / / +5 dB F=F0 - 1MHz / / 0 dB F=F0 + 2MHz / / -20 dB F=F0 - 2MHz / / -20 dB F=F0 + 3MHz / / -40 dB F=F0 - 3MHz / / -40 dB Adjacent channel selectivity C/I F=Fimage / / -7 dB 8DPSK Sensitivity @0.01% BER / -80 / dBm Maximum received signal@0.1% BER 0 / / dBm C/I c-channel / / +18 dB Adjacent channel selectivity C/I F=F0 + 1MHz / / +5 dB F=F0 - 1MHz / / +5 dB F=F0 + 2MHz / / -20 dB F=F0 - 2MHz / / -20 dB F=F0 + 3MHz / / -35 dB F=F0 - 3MHz / / -35 dB Adjacent channel selectivity C/I F=Fimage / / 0 dB Notes: RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 9 of 16 Table 6-4 Transmit Characteristics ------ Enhanced Data Rate (VBAT = 4.0 V, TA = 27°C, unless otherwise specified) PARAMETER CONDITIONS MIN TYP MAX UNIT General specifications Maximum RF transmit power / +2 / dBm Relative transmit control / -1.6 / dB kHz π/4 DQPSK max w0 / +7.4 / kHz π/4 DQPSK max wi / +6.7 / kHz π/4 DQPSK max |wi + w0| / +2.4 / kHz 8DPSK max w0 / +7.1 / kHz 8DPSK max wi / +4.4 / kHz 8DPSK max |wi + w0| / +2.7 / kHz π/4 DQPSK Modulation Accuracy RMS DEVM / 4.7 / % 99% DEVM / / 30 % Peak DEVM / 8.8 / % 8DPSK Modulation Accuracy RMS DEVM / 4.6 / % 99% DEVM / / 20 % Peak DEVM / 11.3 / % In-band spurious emissions F=F0 + 1MHz / -25.0 / dBm F=F0 - 1MHz / -25.0 / dBm F=F0 + 2MHz / -25.0 / dBm F=F0 - 2MHz / -25.0 / dBm F=F0 + 3MHz / -30.0 / dBm F=F0 - 3MHz / -30.0 / dBm F=F0 +/- > 3MHz / / -32 dBm EDR Differential Phase Coding / 100 / % Notes: RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 10 of 16 7 Pins Description Figure7-1. RDA5850 BGA Ball map (bottom view) RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 11 of 16 Table 7-1 RDA5850 Pins Description Pin Name I/O Type Usage Power Domain Ball No LCD Parallel Interface LCD_DATA_0 I/O D Data Bus LCD K1 LCD_DATA_1 I/O D Data Bus LCD J4 LCD_RS O D Register Select LCD J5 LCD_RD O D Read Strobe LCD K5 LCD_CS1 O D Chip Select LCD G5 External Memory Controller M_SPI_CLK O D CLK for SPI flash MEM A12 M_SPI_D0 I/O D Data0 for SPI flash MEM B12 M_SPI_D1 I/O D Data1 for SPI flash MEM A11 M_SPI_D2 I/O D Data2 for SPI flash MEM B11 M_SPI_D3 I/O D Data3 for SPI flash MEM B13 M_SPI_CS O D Chip Select 0 for SPI flash MEM C12 I2C2 I2C2_SCL I/O D I2C2 Clock STD N17 I2C2_SDA I/O D I2C2 Data STD P16 Memory Card Interface SSD_CLK O D SD Clock MMC K10 SSD_CMD I/O D SD Command MMC M8 SDAT_0 I/O D SD data bit 0 MMC K9 SDAT_1 I/O D SD data bit 1 MMC J9 SDAT_2 I/O D SD data bit 2 MMC J10 SDAT_3 I/O D SD data bit 3 MMC H10 Debug Host HST_RXD I D Host data receive. STD K12 HST_TXD O D Host data transmit. STD J11 KEYPAD KEYIN_0 I D Key matrix input line 0 STD F2 KEYIN_1 I D Key matrix input line 1 STD F5 KEYIN_2 I D Key matrix input line 2 STD G4 KEYIN_3 I D Key matrix input line 3 STD E4 KEYOUT_0 O D Key matrix output line 0 STD D4 KEYOUT_1 O D Key matrix output line 1 STD E5 KEYOUT_2 O D Key matrix output line 2 STD F4 KEYOUT_3 O D Key matrix output line 3 STD D5 KEYOUT_4 O D Key matrix output line 4 STD F3 RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 12 of 16 General Purpose I/O GPIO_1 I/O D GPIO 1 STD N12 GPIO_3 I/O D GPIO 3 STD N11 GPIO_4 I/O D GPIO 4 STD B10 GPIO_7 I/O D GPIO 7 STD H5 General Purpose Output GPO_0 O D GPO 0 STD P12 GPO_3 O D GPO 3 STD J2 GPO_5 O D GPO 5 STD M10 Miscellaneous Pins TST_H ID D Test Mode ANALOG H11 PLL_TEST O D Digital CLK output for test ANALOG L3 USB USB_DM I/O A USB D- ANALOG M3 USB_DP I/O A USB D+ ANALOG M2 AUDIO AU_MIC_P I A MIC input ANALOG N6 AU_MIC_N I A MIC input ANALOG P5 AU_HPL O A Headset output L ANALOG N3 AU_HPR O A Headset output R ANALOG P3 LINE_IN_L I A Stereo Line input ANALOG N9 LINE_IN_R I A Stereo Line input ANALOG P8 AU_LSL_P O A Loudspeaker Left Out + ANALOG P7 AU_LSL_N O A Loudspeaker Left Out - ANALOG N8 AU_LSR_P O A Loudspeaker Right Out + ANALOG P6 AU_LSR_N O A Loudspeaker Right Out - ANALOG N7 VCOM_BAT I A Common mode voltage ANALOG P1 AU_VCOM I A Common mode voltage ANALOG N2 FM FM_LINEOUT_R O A FM audio analog signal output R channel FM G2 FM_LINEOUT_L O A FM audio analog signal output L channel FM H1 FMIN I A FM RF differential input FM M16 FMIP I A FM RF differential input FM N15 BT BT_RF O A Bluetooth RFIO BT P17 BT_DVDD O A Bluetooth DVDD BT L15 BT_VOUT18 O A Bluetooth VOUT18 BT M15 Power Management Control RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of RDA. Page 13 of 16 IN_STROBE O A Analog IN for Test TEST G11 IP O A Analog IP for Test TEST G12 QP_RXTXEN I A For chip test TEST E12 QN_RXTXDATA I A For chip test TEST E13 XVR_XTAL1 I A 26MHz Crystal port Input TEST P15 XVR_XTAL2 O A 26MHz Crystal port Output TEST P14 ANA_TEST_EN I A XVR test mode TEST F12 XVR_AUXCLK_OUT O A CLK out test pint TEST L16 POWERKEY I A Power-on switch enable signal. Active High. PMU C10 AC_R I A Input from the AC charger or USB inlet PMU F10 GDRV O A Charger drive PMU C8 IS_CHG I A Current Sens for Charger Control PMU C7 VBAT_SENSE I A Battery voltage ADC detect PMU E10 TS I A Battery connection detect PMU C9 SW_BUCK O A DC/DC control PMU A9 SW_BUCK2 O A DC/DC control PMU A8 VSPIM_SEL I A Selects V_MEM power supply ('0':2.8V, '1':1.8V). PMU C13 PROG_EFUSE I A High voltage input for OTP/EFUSE programming PMU E11 LED Drivers LED1 I A LED driver current sink PMU C2 LED2 I A LED driver current sink PMU C3 POWER VBAT_ABB I A Analog Battery Power Supply ANALOG N1 AVDD_2V4 O A Supplies BT PMU A10 VBAT_PMU1 I A PMU Battery Power Supply PMU A1 VBAT_PMU2 I A PMU Battery Power Supply PMU A2 V_CORE O A Supplies Core. Out for decoupling / debug / backup PMU B9 VBUCK2_2V4 O A DCDC power supply PMU B8 V_SPIMEM O A Supplies external SPI flash PMU A13 V_ANA O A Out for decoupling / debug / backup PMU L1 V_PAD O A Supplies Standard PADs I/O ring. Out for decoupling / debug / backup PMU P10 RDA Microelectronics, Inc. RDA5850 Datasheet V2.2 The information contained herein is th