GBPC5010

GBPC5002 thru GBPC5010 Document Number: GBPC5002 thru GBPC5010 www. Jan.28, 2011 1 smsemi.com Glass Passivated Single Phase Bridge Rectifiers Reverse Voltage 200 to 1000V Forward Current 50 Amp Features y Glass passivated die construction y Integrally molded heatsink provides Very low thermal resistance for Maximum heat dissipation y The plastic material used carries UL flammability recognition 94V-0 y High surge current capability y High temperature soldering guaranteed: 260℃ /10 seconds, 0.375” (9.5mm) lead length, 5lbs. (2.3kg) tension Circuit - + ~ ~ Mechanical Data Case: Molded plastic case Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Marked on Body Mounting Position: Any Module Type TYPE VRRM VRSM GBPC5002 GBPC5004 GBPC5006 GBPC5008 GBPC5010 200V 400V 600V 800V 1000V 300V 500V 700V 900V 1100V Maximum Ratings and Thermal Characteristics (TA = 25℃ unless otherwise noted) Symbol Conditions Values Units IF(AV) Maximum average forward output rectified current Tc =55℃ 50 A IFSM Peak forward surge current single half sine-wave superimposed on rated load (JEDEC Method) 450 A i2t Rating for fusing (t<8.3ms) 840 A2s Visol a.c.50HZ;r.m.s.;1min 2500 V RθJC Maximum thermal resistance per leg(1) 1.4 ℃/W Tj, TSTG Operating Junction and storage temperature range -55 to +150 ℃ Weight Approximate Weight 15 g Electrical Characteristics (TA = 25℃ unless otherwise noted) Symbol Conditions Values Units VF Maximum Instantaneous Forward Voltage per leg IFM =25A 1.1 V IR Maximum DC reverse current at rated TA = 25℃ DC blocking voltage per leg TA = 125℃ 5.0 500 µA Notes: (1) Unit case mounted on Al plate heatsink (2) Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with M5 screw GBPC5002 thru GBPC5010 Document Number: GBPC5002 thru GBPC5010 www. Jan.28, 2011 2 smsemi.com Performance Curves 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig.2 Typical Forward Characteristics (per element) 100 10 1.0 0.1 0.01 I F, IN S TA N TA N E O U S F O R W A R D C U R R E N T (A ) 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Fig.5 Typical Reverse Characteristics (per element) 10 1.0 0.1 0.01 I R , I N S TA N TA N E O U S R E V E R S E C U R R E N T (μ A ) 100 Tj=125ºC Tj=25ºC 1 10 100 NUMBER OF CYCLES AT 60Hz Fig.3 Max Non-Repetitive Surge Current 500 400 300 200 100 0 Tj=150ºC Tj=25ºC f =1MHZ 0.1 1 10 100 VR, REVERSE VOLTAGE (V) Fig.4 Typical Junction Capacitance (per element) 1000 C 100 10 j, C A PA C IT A N C E (p F) Single Half-Sine Wave (JEDEC Method) Resistive or Inductive load Mounted on a 220x220x50 mm AL plate heatsink 80 60 40 20 0 100 0 50 100 150 TC, CASE TEMPERATURE (ºC) Fig.1 Forward Current Derating Curve Tj=25ºC Pulse Width=300μs I F , A V E R A G E F O R W A R D C U R R E N T (A ) I F S M , P E A K F W D S U R G E C U R R E N T (A ) GBPC5002 thru GBPC5010 Document Number: GBPC5002 thru GBPC5010 www. Jan.28, 2011 3 smsemi.com Package Outline Information Dimensions in inches (mm) 0.310(7.87) 0.290(7.36) 0.840(21.3) 0.740(18.8) 0.25 (6.35)0.034(0.86) 0.030(0.76) 0.094(2.4) DIA. － ~ ＋ 0.673(17.1) 0.633(16.1) 0.582(14.8) 0.542(13.8) 0.732(18.6) 0.692(17.6) 0.673(17.1) 0.633(16.1) 1.135(28.8) 1.115(28.3) 1.135(28.8) 1.115(28.3) DIA.0.200(5.1)0.185(4.7) ~ CASE: GBPC