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Semiconductor cooler(半导体制冷器)

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Semiconductor cooler(半导体制冷器)Semiconductor cooler(半导体制冷器) Semiconductor cooler(半导体制冷器) - (Z25) - solid cold source semiconductor refrigerator TEC12706 (40 x 40 x 4mm, no word mark, two pin length 250mm), refrigeration piece 72W, the maximum voltage 15V the maximum current 5A, the actual...

Semiconductor cooler(半导体制冷器)
Semiconductor cooler(半导体制冷器) Semiconductor cooler(半导体制冷器) - (Z25) - solid cold source semiconductor refrigerator TEC12706 (40 x 40 x 4mm, no word mark, two pin length 250mm), refrigeration piece 72W, the maximum voltage 15V the maximum current 5A, the actual power of 50 ~ 60W, the maximum cooling capacity of 70W. Sound power amplifier, car electronic refrigerator, water dispenser, computer CPU and video card. No do not stick fins on electricity both sides will test! Connected to 12 volt supply cooler temperature, a cold side heat, do not put the voltage exceeds the prescribed voltage or breakdown - - - - - refrigerator refrigerator, composed of particles of many N type and P type semi polar body each other arranged, N and P between the common conductor are connected to form a complete line, usually copper, aluminum or other metal conductor, the two ceramic like hamburgers clip up - - - - - the refrigeration part is based on the new solid cold source - semiconductor refrigerator, instead of the traditional mechanical compression refrigeration system. Because the manufacture is convenient, the technical requirement is not high, so the utility model is very convenient for self-control. Principle: thermoelectric cooler refrigeration principle is established to achieve based on the Poerpa effect. That is, when the current flows through the junctions formed by conductors of different materials, heat and heat absorption (cooling) occurs at the contact point. Heat or heat changes depending on the direction of the current, and the magnitude of heat release or heat absorption is determined by the magnitude of the current. - - - - - is not paste fin on electricity test! - - - - - - - the introduction of refrigeration semiconductor refrigeration chip (TE) is also called the thermoelectric cooler, a heat pump, the utility model has the advantages of no sliding parts, application is limited in some space, high reliability, no refrigerant pollution situation. - - - - - the semiconductor refrigeration piece work with DC current, it can refrigeration and heating to achieve refrigeration or heating in the same refrigeration piece by changing the polarity of the DC current, this effect is produced by the thermoelectric principle, the following figure is a single piece of refrigeration and it consists of two pieces of ceramic chip, which has semiconductor material N type and P type (bismuth telluride), the semiconductor element in the circuit is composed of the principle - - - - - the semiconductor refrigeration piece is connected in series with the form: when connecting a N type semiconductor material and a P type the semiconductor material into the galvanic pair in this circuit, DC current can be generated after the transfer of energy, current by the joint N type element type P element to absorb heat, become cold end by P type to N type connector element element Release heat and make it hot. The magnitude of heat absorption and heat release is determined by the magnitude of the current and the logarithm of the components of the semiconductor material N and P. The following three points are the thermoelectric effects of thermoelectric cooling. 1, the Sebek effect (SEEBECK EFFECT) 1822 German Sebek found that when two different conductor connected, such as temperature difference between the two connection points remain different, generating a thermo electromotive force in a conductor: ES=S. T type: ES S thermalelectromotiveforce (?) for TEP (Sebek coefficient) Delta T is the temperature difference between the 2 posts, contact Perle (PELTIER EFFECT) effect in 1834 the French Perle found the post effect and the Sebek effect, when the current flows through two different contact conductors are formed when the junction will produce exothermic and endothermic exothermic or endothermic phenomenon, determined by the size of the current. Pi pi pi = Q.I =aTc type: Q PI for exothermic or endothermic power proportional to the proportional coefficient, known as the Perle post coefficient I working current a thermoelectric power Tc cold junction temperature 3, Thomson effect (THOMSON EFFECT) when the current flowing through the conductor temperature gradient, in addition to the Joule heat produced by the conductor resistance, the conductor will emit or absorb heat, the temperature difference between two points of the conductor is T, its heat or heat absorption: Q =.I. tau Tau T Q for delta tau tau exothermic or endothermic power for Thomson coefficient I is current Delta T theory until the temperature gradient over the century in 50s, the Soviet Union Semiconductor Research Institute about flying academicians have done a lot of research on semiconductor, in 1954 published the findings, show that the bismuth telluride solid solution has a cooling effect well, this is the earliest and most important thermoelectric materials, thermoelectric refrigeration is still an important component of semiconductor materials. About the theory of practical application of fly, there are many scholars to conduct the research to the semiconductor refrigerating materials in 60s the figure of merit, to reach a certain level, widely used, is now the semiconductor refrigeration piece. China in semiconductor refrigeration technology begins in late 50s and early 60s, when the international community is also one of the earliest research units, the middle of 60s, the performance of semiconductor material has reached the international level, at the end of 60s to early 80s is a step of China's semiconductor refrigeration technology development. During this period, on the one hand, the coefficient of merit value of the semiconductor refrigeration material is improved, and on the other hand, the application field of the semiconductor refrigeration material is expanded. The semiconductor Research Institute of the Chinese Academy of Sciences has invested a great deal of manpower and material resources to obtain the semiconductor refrigeration wafer. Therefore, the production of the semiconductor refrigeration wafer and the development and application of the two product have been realized. Application of semiconductor refrigeration plate sheets as a special cold source, has the following advantages and characteristics in application: 1, do not need any refrigerant, continuous work, no pollution no rotating parts, does not produce the gyroscopic effect, no sliding parts is a solid piece of work, no vibration, noise, long service life, easy installation. 2, the semiconductor refrigeration chip has two functions, both refrigeration and heating, refrigeration efficiency is generally not high, but the heating efficiency is very high, always greater than 1. Therefore, the use of a piece can replace the discrete heating system and refrigeration system. 3, is current in the semiconductor refrigeration piece type piece, by controlling the input current, which can achieve high precision temperature control, coupled with the temperature detection and control method, is easy to realize remote control, program control, computer, easy to form an automatic control system. 4, the semiconductor refrigeration plate heat inertia is very small, refrigeration heating time is very fast, in the heat side heat dissipation is good, cold end no-load, less than a minute after the electricity, the refrigerator can reach the maximum temperature difference. 5. The reverse use of semiconductor refrigeration chips is thermoelectric generation, and semiconductor refrigeration chips are generally suitable for middle and low temperature power generation. A single power refrigeration element 6, the semiconductor refrigeration piece of very small, but the combination of stack, with the same type of stack combination method of series and parallel to the refrigeration system, the power can be large, so the cooling power can be done within a few milliwatts to watts. 7. The temperature range of the semiconductor cooling plate can be achieved from the positive temperature of 90 DEG C to the negative temperature of 130 DEG C. Through the above analysis, the semiconductor thermoelectric piece the application of refrigeration, heating, electricity, cooling and heating are widely used, are as follows: 1 aspects: military missile, radar, infrared detection, and other aspects of the submarine navigation system. 2, medical treatment, cold, cold, cataract, blood analyzer and so on. 3 、 laboratory equipment: cold trap, cold box, cold groove, electronic low temperature test device, all kinds of constant temperature, high and low temperature test instrument. 4, special device aspects: petroleum products
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