ASM 设备全集

IndexASMSemiconductorEquipmentProductsEagle60AP-LDGoldBallWBStudBumpingGold/CopperStudBumpingHummingbird/-ST12"WaferHandlingThermosonicGoldBallWireBondEagleXtremeX2LWireBondingEquipmentAB530AB559ASeriesFineAluminumWBUltrasonicWedgeWireBondHAWBHeavyAluminumWBiHawk-02iHawk-ViHawkXtremeEagleXtremeHarrierXtremeTwinEagleXtremeWireBondingEquipmentProcessModelMaterialsHandlingFlipChipRFIDSolutionEpoxyDA6"WaferHandlingSolderPasteDA/ClipAttacheClipLensHolderAttachIS868LA2IRGA868GlassAttachIS898GAFOG900ACFD/ACOG900Multi-purposeDAMCM12Misc.FlipChipAD819-11A/-11TSAD819-11BEutecticDAAD819-LDAD819-PDAD896seriesAD880AD8930-02Epoxy/EutecticDAAD8930V/UVSoftSolderSD832DSoftSolderSD890AEutecticDAAD830UEpoxy/EutecticDAAD830R/URAD908AD830AD838LAD838RAD838EpoxyDAAD8988"WaferHandlingIS8912DAAD8912RLAD8912SD-AEpoxyDAAD8912IS9012LAAD9012TCAD9212AD9012-BOCAD900TS/AD9012TSAD900A/AD9012A12"WaferHandlingDieAttachEquipmentProcessModelMaterialsHandlingColumnPressingAPS70StripFormSubstratePressingEquipLoadingUnitsfrom/toCarrierBOL139/SOL139On/OffLoadingLoadingEquipLeadframeCuttingLFC130ReelFormLeadframeLFCuttingSystemTapeAttachCPS12ReelFormTapeTapingEquipPC139/PC139RSnapCuringOvenCOE139/COE139RStrip/ReelFormSubstrateSR902LAReflowOvenSR902StripFormSubstrateCuringOvenProcessModelMaterialsHandlingDieSortingAS899MapSortingwithAOIMS899ISeriesMapSortingMS899Series6"WaferHandlingWaferScanningWS8964"WaferHandlingWaferLevelPackagesSortingWP8088"WaferHandlingScanningandSortingEquipmentProcessModelMaterialsHandlingIndexASMSemiconductorEquipmentProductsJettingDS520StripFormSubstrateGlob-top,Dam&FillDS500SeriesStrip/ReelFormSubstrateDispensing/JettingWLP30012"WaferIDEALmold™R2RReelFormSubstrateIDEALmold™80/120/170tOSPREYMoldingSystemIDEALcompress™StripFormSubstrateMoldingEquipmentProcessModelMaterialsHandlingCarrierBasedLaserMarkLS2000AllkindsofICandpowerdeviceleadframes,etc.LaserMarkHandlingEquipPBGASingulationBG289-MPBGAframeinsinglerowormatrix,etc.SDCardSingulationMP-SDSSDCardLabPressMP-LABFortoolcharacterizationAutomaticTrim/FormMP-TABThinICframessuchasMSOP,SOT,etc.MechanicalPressTrim/FormMP209DPAK,D²PAK,QFN,SO,SOT,TO,TO220,TQFP,TSOP,TSSOP,etc.Trim/Form/SingulationSystemProcessModelMaterialsHandlingLS2000LaserMarkHandlingEquipProcessModelMaterialsHandlingHighSpeedTapeSortingCS900BCC,CSBGA,MLP,QFN,SiP,WBGA,etc.IntegratedCSPJigSawandSortingCS8000-APStrips–QFN,CSBGA,etc.BallPlacementBP2000Strips–CSBGA/PBGA,flexBGA,etc.BallPlacementandCSPHandlingEquipmentProcessModelMaterialsHandlingTurretBasedVisionInspectionFV2030SOT,SOD,SOIC,TSSOP,MSOP,QFN/MLP,DPAK,TO,etc.TestandFinishHandlingEquipmentWaferFrameSort/TestFT2030WFSawnDFN,QFNCSBGA,CIS,BareDie,BumpedDie,etc.Singulation&FinishingPS209SO,TSOP,TSSOP,etc.HotTestFT1000-HDSO,TSOP,QFN,MLF,BCC,BGA,CSPetc.CarrierBasedTestFT1000M-BGA,QFN,SOIC,QFP,TSOP,etcTurretBasedTest&FinishingFT2030SSOT,SOD,SOIC,TSSOP,MSOP,QFN/MLP,DPAK,TO,etc.ProcessModelMaterialsHandlingLaserMark,Trim/Form,Test&FinishingLS1000+MP209+FT2030SDirectFET™JigSaw&Sorting,HotTest,Singulation&FinishingCS8000AP+FT1000HD+PS209QFNLaserMark,Trim/FormLS1000+MP209DPAK,D²PAK,QFN,SO,SOT,TO,TO220,TQFP,TSOP,TSSOP,etc.In-lineAssemblySolutionProcessModelMaterialsHandlingAutoCMOSCameraModuleTestHandlerIS320-UTCameraModuleAutoFocusing&Electrical-TestIS300-AFCMOScameramoduleImageSensorEquipmentProcessModelMaterialsHandlingMultipleSMDLEDTapingIP360SMDtypeChipLED,TopLED&SideviewLEDSMDLEDTapingSLT400SMDtypeChipLED,TopLED&SideviewLEDSMDLEDTestingandSortingSLS230SeriesSMDtypeChipLED,TopLED&SideviewLEDLED(SMD)Sorting&TapingSystemProcessModelMaterialsHandlingAutomaticBOCFlipChipBonderAD9012-BOCAutomaticBOCFlipChipBonderAD9012-BOCPreciseplacement*:XYplacement:±15μm@3σHighproductivity*:1sec/cycle(bondingtimeexclusive)Diesizerange:10x10–500x500milIntelligentself-compensatedbondforcecontrolRegularlycalibrationfreebondheaddesign4consistentandindependentheatingcontrolsUpto250CbondingtemperatureAD9012TS-upto12”waferhandlingcapabilityApplications:Flipchipbondingonleadframe,BGA,ceramicsubstrates,singulatedunits,etc.Preciseplacement*:XYplacement:±7μm@3σHighproductivity*:0.7sec/cycle(bondingtimeexclusive)Diesizerange:10x10–1,000x1,000milExcellentprocessflexibilityFluxdispensingviawritingsystemFluxdippingHighviscositymaterialdispensingcapabilityConvertibleflipchipanddiebondingprocessAD9012A-upto12”waferhandlingcapabilityFlipChipBonderAD900A/AD9012AFlipChipBonderAD900A/AD9012AThermosonicFlipChipBonderAD900TS/AD9012TSThermosonicFlipChipBonderAD900TS/AD9012TSApplications:Thermosonicflipchipbondingonleadframe,BGA,ceramicsubstrates,singulatedunits,etc.*Remark:AllperformanceispackagedependentApplications:FlipchipbondingonWBGAsubstratesPreciseplacement*:Normalmode:25.4μm@3σHighprecisionmode:8μm@3σHighproductivity:3,000+*UPHProcessflexibilityPatentpendingthindicehandlingcapabilityLargerangeofbondforcecontrol:upto7,000gPrecisionbondtooltemperaturecontrol:upto250°C±5°CLOCbondingcapabilityExcellentprocesscontrolwithIntelligentpre-bakingprocessAutomaticcolletcleaningsystemSubstratewarpagecontrolwithstrategicsystemdesignConvertibledieattachfilm(DAF)andflipchipbondingprocess12”FLIPCHIPBONDINGEQUIPMENT12”FLIPCHIPBONDINGEQUIPMENTApplications:Flipchipbondingonleadframe,BGA,ceramicsubstrates,singulatedunits,etc.Preciseplacement*:XYplacement:±10μm@3σHighproductivitywithindividualdualflipchipbondingsystems:8,000*+UPHUpto12”waferhandlingcapabilitySupportingfluxdippingflipchipprocessDiesizerange:20x20–1,000x1,000milConvertibleflipchipanddiebondingprocessIn-linecapabilitywithSMEMAcompliance(option)DualHeadFlipChipBonderAD9212DualHeadFlipChipBonderAD921212”FLIPCHIPBONDINGEQUIPMENT12”FLIPCHIPBONDINGEQUIPMENT*Remark:AllperformanceispackagedependentApplications:ACPflipchipbondingfornon-contacttypesmartcardpackage,etc.CompletesolutionforRFIDpackagesFromadhesivedispensing,flipchipbonding,curingtotesterhandleprocessLargerangeofweb-tapehandling:upto100mmbondwidth@180mmphysicalwidthUpto32dicecuringwithsinglepassONLYFlexibletointegratewithvarioustestersSupportingrejectedunitmarkingcapabilityTotalRFIDAssemblySolutionUnwinder+AD900HS+APS900+RewinderTotalRFIDAssemblySolutionUnwinder+AD900HS+APS900+Rewinder12”FlipChipBonder(forImageSensorApplication)IS9012LA12”FlipChipBonder(forImageSensorApplication)IS9012LACompleteforeignmaterials(FM)preventionHEPAfilterimplementationconceptCleanbathduringon-loadingCleancellviaworkholderAndmore…...FlexibleindexingsystemforsubstrateorcarrierboatRealtimeepoxypatterninspectionandpositionalignmentUpto12”waferhandlingcapabilitySupportingbothflipchipanddirectdieattachprocessApplications:Imagesensorflipchipbondingone.g.CLCC,PLCC,BGA,PCB,singulatedunits,etc.12”ThermocompressionFlipChipBonderAD9012TC12”ThermocompressionFlipChipBonderAD9012TCExcellentbondingperformanceBondforcecontrol:upto6,000gBondcollettemperature:upto300°C±5°CFlexibleindexingsystemforsubstrateorcarrierboatRealtimedispensingpatterninspectionandpositionalignmentUpto12”waferhandlingcapabilitySupportingbothflipchipanddirectdieattachprocessApplications:Thermocompressionflipchipbondingone.g.CLCC,PLCC,BGA,PCB,singulatedunits,etc.*Remark:AllperformanceispackagedependentApplications:StackdieapplicationonMini-BGA,flexBGA,CSPBGA,QFN,QFP,TQFP,PLCC,TSSOP,TSOP,etc.Upto12”roboticwaferhandlingcapabilityHighaccuracyandproductivity*:XYplacement:25.4m@3Dierotation:0.5@3StackandthindiehandlingcapabilityExcellentsubstratewarpagecontrol12”StackDieBonderAD8912SD-A12”StackDieBonderAD8912SD-AApplications:Reelformmaterialshandlinge.g.smartcardsubstrates,metalleadframeorflexsubstrates,etc.HighspeeddiebondingprocesswithImplementingpatentedbondheaddesignSupportingdualdispensingsystemUpto12”roboticwaferhandlingcapabilityDiesizerange:10x10–1,000x1,000milFlexibletoequipwithvisualinspectionstationatoutputtingsideIn-linecapabilitywithcuringoven–PC139Randbufferstation12”DieBonder(ReelFormMaterialsHandling)AD8912RL12”DieBonder(ReelFormMaterialsHandling)AD8912RL12”DieBonder(forImageSensorApplication)IS8912DA12”DieBonder(forImageSensorApplication)IS8912DACompleteforeignmaterials(FM)preventionHEPAfilterimplementationconceptCleanbathduringon-loadingCleancellviaworkholderAndmore……FlexibleindexingsystemforsubstrateorcarrierboatRealtimeepoxypatterninspectionandpositionalignmentUpto12”roboticwaferhandlingcapabilitySupportingupto8”wafersizewithIS898DAApplications:Imagesensordiebondingone.g.CLCC,PLCC,BGA,PCB,singulatedunits,etc.12”AutomaticDieBonderAD891212”AutomaticDieBonderAD8912Applications:Mini-BGA,flexBGA,CSPBGA,MLP/QFN,QFP,TQFP,PLCC,TSSOP,TSOP,SOIC,SOT,PDIP,etc.Upto12”roboticwaferhandlingcapabilityHighaccuracyandproductivity*:Systemcycletime:320msXYplacement:25.4m@3Dierotation:0.5@3Diesizerange:10x10–1,000x1,000milUniversalworkholderdesignforvariouspackagesFlexibleindexingclampforleadframe/substratethickness:0.1-2mmRealtimeepoxypatterninspectionandpositionalignment12”DIEATTACHEQUIPMENT12”DIEATTACHEQUIPMENTUSPATENTEDPATENTEDPATENTPENDINGPATENTPENDING8”DIEATTACHEQUIPMENT8”DIEATTACHEQUIPMENTUpto17,200*+UPHbyImplementingpatentedbondheaddesignSupportingdualdispensingsystemExcellentaccuracywithfull-rangeofinspectionalgorithmsGraphicaluserinterfacewithmulti-languagessupportMSWindows®XPoperatingsystemProvidinggraphicalSPCdatawithlatestIQCsystemExtralargebondingarea:upto4”widthsubstratehandlingcapabilityApplications:Highdensityleadframe,e.g.QFN,TQFP,PLCC,TSSOP,TSOP,SOIC,SOT,etc.AutomaticHighSpeedEpoxyDieBonderAD838AutomaticHighSpeedEpoxyDieBonderAD838HighUPHwithImplementingpatentedbondheaddesignSupportingdualdispensingsystemExtralargebondingarea:upto4”widthsubstratehandlingcapabilityExcellentaccuracywithfull-rangeofinspectionalgorithmsAutomaticinputreelsystemGraphicaluserinterfacewithmulti-languagessupportMSWindows®XPoperatingsystemProvidinggraphicalSPCdatawithlatestIQCsystemApplications:Reelformmaterialshandling,e.g.metalleadframeorflexsubstrates,topLED,etc.AutomaticHighSpeedEpoxyDieBonder(ReelFormMaterialsHandling)AD838RAutomaticHighSpeedEpoxyDieBonder(ReelFormMaterialsHandling)AD838RApplications:Mini-BGA,flexBGA,CSPBGA,MLP/QFN,QFP,TQFP,PLCC,TSSOP,TSOP,SOIC,SOT,PDIP,singulatedunits,etc.Highaccuracywithexcellentproductivity*:Systemcycletime:320msXYplacement:25.4m@3Dierotation:0.5@3FlexibleconfigurationstofitdifferentapplicationsSpecialdesignfordifferentapplicationsLargerangeofsubstratethickness:0.1–2mmDiesizerange:10x10–1,000x1,000milRealtimeepoxypatterninspectionandalignmentAutomaticDieBonderAD898AutomaticDieBonderAD898Strategicindexingalgorithmsuitableforspecialsubstratehandling,e.g.directceramicsubstrateindexingExcellentsubstratewarpagecontrolImplementingexcellentprecisionwithVariousinspectionsystemsduringbondingprocessPatentedbondheaddesignExtralargebondingarea:upto4”widthsubstratehandlingcapabilityImplementinglatestglobalsubstratealignmentApplications:Directsubstrateindexing,e.g.,SAWfilter,highpowerLED,etc.AutomaticHighSpeedEpoxyDieBonder(BoatCarrierIndexingSystem)AD838LAutomaticHighSpeedEpoxyDieBonder(BoatCarrierIndexingSystem)AD838L*Remark:AllperformanceispackagedependentUSPATENTEDPATENTEDUSPATENTEDPATENTEDUSPATENTEDPATENTEDHighUPH*byImplementingpatentedbondheaddesignProvidingexcellentoxygenlevelcontrolwithforminggassupplyGraphicaluserinterfacewithmulti-languagessupportMSWindows®XPoperatingsystemSupportingfluxeutecticdieattachprocessbyequippingdispensingsystem(option)Applications:Highdensitysubstrate,e.g.,SOIC,SOT,SOD,SOJ,HighpowerLED,etc.AutomaticHighSpeedEutecticDieBonderAD830UAutomaticHighSpeedEutecticDieBonderAD830UHighthroughputbyImplementingpatentedbondheaddesignEquippingwithdualdispensingsysteminAD830RExcellentaccuracywithfull-rangeofinspectionalgorithmsImplementingflexibilitywithLargerangeofreelformsubstratehandlingcapabilityIn-linecapabilitywithcuringoven,e.g.PC139R,COE139R,etc..Graphicaluserinterfacewithmulti-languagessupportMSWindows®XPoperatingsystemSupportingeutecticdieattachprocess–AD830URApplications:Reelformmaterialshandling,e.g.metalleadframeorflexsubstrates,topLED,etc.AutomaticHighSpeedDieBonderAD830R/URAutomaticHighSpeedDieBonderAD830R/URUSPATENTEDPATENTED*Remark:AllperformanceispackagedependentHighthroughput:upto18,000UPH*byImplementingpatentedbondheaddesignSupportingdualdispensingsystemWidelyimplementinglinearmotorsystemImplementingexcellentflexibilitybySupportingvarioustypesofinputtingsystemMulti-directionalbondingcapabilitywithrotarycolletbondarmsystemGraphicaluserinterfacewithmulti-languagessupportMSWindows®XPoperatingsystemUpto8”waferhandlingcapability(option)Applications:Highdensitysubstrate,e.g.,ChipLED,TopLED,SideViewLED,SOIC,SOD,HighpowerLED,etc.AutomaticHighSpeedDieBonderAD830AutomaticHighSpeedDieBonderAD8308”DIEATTACHEQUIPMENT8”DIEATTACHEQUIPMENTHighprecisionplacement*withspecialPRalignmentXYplacement:±10μmThetadirection:±0.08°ImplementingpatentpendinghallowbondheaddesignExtralongdispensingareaforlargeaspectratiodiehandlingSupportingepoxywritinganddottingcapabilityExcellentsubstratewarpagecontrolwithmovingbondworkholdertabledesignApplications:Largeaspectratiodiehandling,suitableforlinearscannerapplication,etc.AutomaticDieBonderAD908AutomaticDieBonderAD908PATENTPENDINGPATENTPENDINGUSPATENTEDPATENTEDUSPATENTEDPATENTEDApplications:EpoxybondingforbentleadframeforpiranhaandotherapplicationPro-longingMTBAwithnewinputting/outputtingsystemInputtingsystem:wheeltypeinputtingmechanism/multi-magazinesinputtingelevatorsystemOutputtingsystem:multi-magazineoutputtingelevatorsystemPreciseepoxystampingcapabilitywithpre-bondinspectionAdvancedPRlookaheadcapabilityfurtherenhancesbondingspeedAdvanceddiesurfacedefectinspectionatwaferstageSupportingeutecticdieattachprocesswithAD8930UVApplications:VerticalLED,phototransistor,infrareddiodes,etc.HighSpeedEpoxyDieBonder(forVerticalLEDApplication)AD8930V/UVHighSpeedEpoxyDieBonder(forVerticalLEDApplication)AD8930V/UVHighproductivitywithPatenteddoubledecouplingbondheadsystemExcellentpatternconsistencybyequippingdualpatentpendingsolderwritingsystemProvidingexcellentoxygenlevelcontrolwithforminggassupplyAutomaticdiethetaalignmentwithwell-developedrotarycolletbondarmsystemApplications:Highpowerdevice,discreteunit,e.g.TO-220,SOT,DPAK,DPAKmatrix,PowerSO,etc.SoftSolderDieBonderSD832DSoftSolderDieBonderSD832DProvidingcarrierfreeindexingdesignPro-longingMTBAwithvariousinputting/outputtingsystemInputtingsystem:multi-magazineinputtingelevatorsystemOutputtingsystem:multi-magazineoutputtingelevatorsystemPreciseepoxystampingcapabilitywithpre-bondinspectionAdvancedPRlookaheadcapabilityfurtherenhancesbondingspeedAdvanceddiesurfacedefectinspectionatwaferstageHighSpeedEpoxyDieBonder(forBentLeadframeApplication)AD8930-02HighSpeedEpoxyDieBonder(forBentLeadframeApplication)AD8930-026”DIEATTACHEQUIPMENT6”DIEATTACHEQUIPMENT8”DIEATTACHEQUIPMENT8”DIEATTACHEQUIPMENTPATENTPENDINGPATENTPENDINGSoftSolderDieBonderSD890ASoftSolderDieBonderSD890AApplications:Highpowerdevice,discreteunit,e.g.TO-220,SOT,DPAK,DPAKmatrix,PowerSO,etc.Highproductivity*:550mscycletimeImplementingflexibilitywithMatrixleadframehandlingwithXYshuttlingbondheadsystemABdicehandlingwithrotarycolletbondarmdesignUpto8independentlycontrolledheatingzonessuitableforvarioustemperatureprofilerequirementPrecisionsoldervolumeandpatterncontrolwithPrecisesolderwirefeedingandspankingsystemProvidingexcellentoxygenlevelcontrolwithforminggassupply*Remark:AllperformanceispackagedependentApplications:COBdevices,IrDA,7-segmentdisplay,dotmatrixdisplay,chipLED,metalcan,bentLeadframe,etc.AutomaticDieBonderAD896SeriesAutomaticDieBonderAD896SeriesWiderangeofsubstrateshandlingcapabilityFlexibleconfigurationsAD896-IL08:automaticmaterialhandlingsystemAD896M-06:multi-wafersystemformultidiceapplicationAD896M-IL08:multi-wafersystemwithautomaticmaterialhandlingsystemPowerfulinspectionsystemprovidingexcellentbondingqualityWaferPRSwithPRlookaheadcapabilityAdvanceddiesurfacedefectinspectionatwaferstage*Remark:AllperformanceispackagedependentHighPrecisionDieBonder(forPhotoDiodeApplication)AD819-PDHighPrecisionDieBonder(forPhotoDiodeApplication)AD819-PDHighprecisionepoxydiebondingwith2-in-1stampingandbondingsystemWidelyimplementinglinearmotorsystemFullrangeofPRinspectionatvariousstagesforprecisionbondingSupportingvariousconfigurationstofitdifferentapplicationsProgrammabletiltingworkchuckforPDapplicationRotaryworkchuckforVCSELapplication(option)CarrierfreemetalcanshandlingdesignApplications:Metalcanpackagese.g.photodiodeonstem,etc.Extralargebondingarea:upto8”x5”substratehandlingProvidingextremehighspeeddieattachwithDDRbondheadsystemImplementingexcellentflexibility–capabilityofhandlingvarioussubstrateswithsuitablecarrierdesign6milsmalldiehandlingcapabilityGraphicaluserfriendlyinterfacewithWindows®XPoperatingsystemAutomaticDieBonderAD880AutomaticDieBonderAD880Applications:SuitableforvarioustypesofLEDandCOBproduct,e.g.VLED,ChipLED,COB,TopLEDetc..HighPrecisionDieBonder(forLaserDiodeApplication)AD819-LDHighPrecisionDieBonder(forLaserDiodeApplication)AD819-LDApplications:Metalcanpackages,e.g.onepassLDandsubmountonstemPrecisionplacementwithWidelyimplementinglinearmotorsystemFullrangeofPRinspectionatvariousstagesforprecisionbondingIndividualbondingsystemforsubmountandLDattachProvidingconsistenteutecticenvironmentExcellentoxygenlevelcontrolwithnitrogengassupplyProgrammabletemperatureprofileonvariousstationsAnti-thermalshockwithpre-heatingandpost-heatingstationsCarrierfreemetalcanshandlingdesign6”DIEATTACHEQUIPMENT6”DIEATTACHEQUIPMENTHighPrecisionFlipChipBonderAD819-11A/-11TSHighPrecisionFlipChipBonderAD819-11A/-11TSHighproductivity*AD819-11A:0.7sec(cycletime)Precisionplacementaccuracy*WidelyimplementinglinearmotorsystemXYplacement:10μm@3Dierotation:0.5@3Configurableforflux/epoxyflipchipbondingprocessThermosonicflipchipbondingcapability–AD819-11TSAutomaticsubstrateinput&outputhandlingcapability(option)Applications:Precisionflipchipdieattache.g.LEDonsubmountforhighbrightnessLED,etc.HighPrecisionEutecticDieBonderAD819-11BHighPrecisionEutecticDieBonderAD819-11BPrecisionplacement*WidelyimplementinglinearmotorsystemXYplacement:25.4m@3(withup-lookinginspection)Dierotation:0.5@3ProvidingexcellentoxygenlevelcontrolwithforminggassupplyAnti-thermalshockdesignwithpre-heatandpost-heatstationsAutomaticsubstrateinput&outputhandlingcapability(option)Applications:Precisioneutecticdieattache.g.LEDonsubmountforhighbrightnessLED,etc.HighspeeddieattachprocesswithUSpatentedgantrydesignSupportingauxiliarydispensingsystemPrecisionplacementwithlatestinspectionsystemImplementingexcellentflexibilitybysupportingUpto12”waferhandlingcapabilityUpto14typesofpickingtoolshandlingcapabilityUpto5typesofejectingkitsinstallationExtralargesubstratehandlingSMDbondingcapabilityDirectdieattach/flipchipbondingcapabilityAndmore……SupportingautomaticwaferexchangingsystemApplications:Variousofmulti-chippackageson,e.g.BGA,singulatedunit,metalcan,wafersubmount,etc.Multi-chipModuleBonderMCM12Multi-chipModuleBonderMCM12HighspeedperformancedrivenbyWidelyimplementinglinearmotorsystemSupportingdualmainpressingsystemHighprecisionFullrangeofinspectionsystemateachprocess4D(XYZ-theta)workholdersystemdrivenbypreciselinearandDDRactuatingsystemSupportingvariousinputtingandoutputtingconfigurationsBeltinputting/outputtingsystemTrayhandlingcapability(option)Advan