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JEITA标准:ED-7303B 关于封装中缩写的详细说明

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JEITA标准:ED-7303B 关于封装中缩写的详细说明 EIAJ ED-7303B EIAJ ED-7303B CONTENTS 1. Scope of application …….………………………………………………………………………………..… 1 2. Terms ……….………………………………………………………………………………………………… 1 3. History ………………………………………………………………………………………………………. 1 4. Basic ...

JEITA标准:ED-7303B 关于封装中缩写的详细说明
EIAJ ED-7303B EIAJ ED-7303B CONTENTS 1. Scope of application …….………………………………………………………………………………..… 1 2. Terms ……….………………………………………………………………………………………………… 1 3. History ………………………………………………………………………………………………………. 1 4. Basic thinking for the standardization of package naming and coding method ……………………… 1 5. Package Code ………………………………………………………………………………………………… 3 5.1 Construction of package code ………………………………………………….…………………….... 3 5.2 Material code of package body ………………………………………………………………………….. 5 5.3 Package specific feature code ………………………………………………………………………….… 5 5.4 Basic package name code …………………………………………………….……………………….… 7 5.5 Package terminal number code ……………………………………………………………………….… 11 5.6 Code of package nominal dimension ……………………………………………………………….….. 11 5.7 Terminal in-line interval code ……………………………….…………………………………………… 15 5.8 Example of package code ……………………………………………………………………………….. 15 5.9 Coding of package code ……………………………………………………………………………….… 17 6. Derivative package name code and common name ……………………………………………….….. 17 6.1 Derivative package name code ………………………………………………………………………..… 17 6.2 Common name ……………………………………………………………………………………..…….. 17 6.3 Relation between each code ……………………………………………………..………………………… 17 7. Outer view and characteristics of basic package ……………………………………………………..… 21 EXPLANATORY NOTES 1. OBJECTIVES OF THE ESTABLISHMENT ……………………………………………………………... 27 2. HISTORY OF REVIEW ……………………………………………………………..……..……………… 27 3. KEY POINTS OF REVIEW AND EXPLANATORY NOTES …………………………………………….. 27 4. RELATED STANDARDS ……………………………………………………………..…………………….. 29 5. COMMITTEE MEMBERS ……………………………………………………………..……. ……………. 29 FIGURES AND TABLES Figure 1 Package code ……….……………………………………………………………………………… 3 Figure 2 Relation between each code ………………….…………………………………………………… 21 Table 1 Material code of package body ……….…………………………………………………………… 5 Table 2 Package specific feature code ……………….…………………………………………………… 7 Table 3 Basic package name code ……………….………………………………………………………… 9 Table 4 Example of package terminal number code ……………….…………………………………… 11 Teble 5 Exception code of package nominal dimension ………………….……………………………… 13 Table 6 Terminal in-line interval code ……………….…………………………………………………… 15 Table 7 Example of package code ………………….……………………………………………………… 15 Table 8 Example of derivative package name code ……………….…………………………………… 17 Table 9 Example of common name ……………….……………………………………………………… 19 Table 10 List of name and code ……………….…………………………………………………………… 21 Table 11 Outer view and characteristics of typical basic package ……………………………………… 23 EIAJ ED-7303B gggg Standard of Japan Electronics and Information Technology Industries Association ff Name and code for integrated circuits package gg 1. Scope of application This standard prescribes the name and code for semiconductor packages (hereinafter referred to as packages) in the EIAJ ED-7300 (Recommended practice on standard for the preparation of outline drawings of semiconductor packages). gg 2. Terms The terms used in this standard shall conform to those defined in the EIAJ ED-7300. The new terms not included therein shall be defined in the text of this standard. gg 3. History The EIAJ standards related with the name and code for integrated circuits package established and revised as follows: EIAJ ED-7411 [General Rules for the Preparation of Outline Drawings of Integrated Circuits Package Name and Code, established in February 1989] EIAJ ED-7401-2 [Packages name and code for semiconductor device package (Integrated Circuits), revised in June 1994] EIAJ ED-7303 [Name and code for integrated circuits package, established in June 1998] EIAJ ED-7303A [Name and code for integrated circuits package, revised in March 2001] First, EIAJ ED-7411 specified the name and code of an integrated circuits package as one of the outline general rules (the present outline standard). Then, the revised edition of EIAJ ED-7411 was published as EIAJ ED-7401-2 according to the principle that integrated circuits are subordinate to EIAJ ED-7401 and discrete devices are subordinate to EIAJ ED-7501. Next, EIAJ ED-7303 needed re-organization, revision and addition lager than before. That is, for the purpose of respect to International standard IEC, standards of JEITA (former EIAJ) for integrated circuits and discrete devices were integrated and re-organized. The standards of general rules were re-constructed to six-volume organization, ranging from EIAJ ED-7300 to EIAJ ED-7305. As one of six-volume organization, name and code for package were unified with the common rule to EIAJ ED-7303. Furthermore, considering examination result of JWG2 which is the joint meeting of JEITA (former EIAJ) and JEDEC, organization of package code were changed. Continuously EIAJ ED-7303A was revised to the more common standard by standardization of Japanese name for various codes and names. Then, for the needs of new codes addition such as seated height examined and approved by IEC for diversified package and for preparing for packages developed in future, it is newly revised as EIAJ ED-7303B. g g 4. Basic thinking for the standardization of package naming and coding method This standard is based upon the following basic idea. gg EIAJ ED-7303B gg ggg gg gg EIAJ ED-7303B gggg 5.2 Material code of package body According to Table 1, material code of package body shall be specified 1 letter. Table 1 Material code of package body Code Material Applicable to C Ceramic Multi-layer ceramic package G Ceramic Glass sealed ceramic package M Metal Package consisting of metallic materials P Plastic Package molded with plastic T Tape Package consisting of tape, For BGA and LGA, tape used for interposer. 5.3 Package specific feature code According to Table 2, Package specific feature code shall be specified maximum of 3 letters (maximum of 3 features). 5.3.1 Coding rule for package specific feature (1) Present “Design guideline of integrated circuit” are given a priority. (2) For new package, decide to apply this rule or not at making “Design guideline of integrated circuit”. (3) If “Design guideline of integrated circuit” is not exist, decide to apply this rule or not at making “Standard of integrated circuit package”. (4) In the case of adding 2 or more specific feature codes to, according to the order of specific feature, first letter is code of highest order. Maximum of 3 letters ( maximum of 3 features) shall be specified. Example: TSSOP, HTSSOP, LSSOP, DSDIP, LBQFP, DLSOI and so on. ggg ggg ggg ggg ggg ggg ggg ggg ggg ggg ggg ggg EIAJ ED-7303B gg ggg Table 2 Package specific feature code Order Functional classification Code Meaning Specific feature - - nothing - Basic package H Heat Sink Heat sink D Window Window 1 Outline addition P Piggyback Piggyback L Low profile Maximum seated height, 1.20mm < L <= 1.70mm T Thin Maximum seated height, 1.00mm < T <= 1.20mm V Very thin Maximum seated height, 0.80mm < V <= 1.00mm W Very-Very thin Maximum seated height, 0.65mm < W <= 0.80mm U Ultra thin Maximum seated height, 0.50mm < U <= 0.65mm 2 Seated height X Extremely thin Maximum seated height, X <= 0.50mm S Shrink Shrink pitch of basic package (only used for SOP, DIP, ZIP, PGA) F Fine pitch Terminal pitch is 0.8mm or less. (only used for BGA, LGA) Terminal pitch is 0.5mm or less. (only used for QFP) 3 Terminal pitch or terminal position I Interstitial Package with terminal other than grid array (only used for PGA, BGA, LGA) B Bumper with bumper G Guard Ring with Guard Ring 4 Lead protection R Retain with Retain 5.4 Basic package name code According to Table 3, basic package name code shall be specified 3 letters in principle. To classify package form in Table 3, refer to EIAJ ED-7300. As an exception, derivative package name TSOP(1), TSOP(2), DTP(1) and DTP(2) corresponding to basic package name code SOP and DTP shall be managed as basic package name code and allowed 7 or 6 letters. In this case, conventional TSOP(I) and TSOP(II) shall not be allowed to use for TSOP(1) and TSOP(2). EIAJ ED-7303B gggg EIAJ ED-7303B gg 5.5 Package terminal number code According to Table 4, Package terminal number code shall be specified maximum of 5 letters. In addition, terminal shall be a generic term for lead, pin, land, bump, ball and so on. Which formed for different connection method to outside. For missing terminals in Table 4, 5 letters shall be accepted for 100 pins or less. For example, in the case of 28 terminals package with 2 terminals missing, giving a code of 28/26. ggg Table 4 Example of package terminal number code Code Terminal number 8 8 14 14 64 64 144 144 1000 1000 28/26 28 (missing 2 terminals) 5.6 Code of package nominal dimension Code of package nominal dimension is constructed by “package body width (mm)”x”package body length (mm)” and shall be specified maximum of 11 letters. When the figure below the decimal point is “x0” or “00”, delete the “0” or “00” from the code. For example: 39.62 x 39.62, 11.50 x 14.50, 14.00 x 14.00 etc. New code : 39.62 x 39.62, 11.5 x 14.5, 14 x 14 etc. If package nominal dimension specified on existing “Design guideline of integrated circuit” and “Standard of integrated circuit package” is not same as new definition of “package body height (mm)”x”package body length (mm)”, it is allowed to use existing code for exception, but must be specified both new and existing codes (see Table 5). At the proposal to IEC, must be used only the new definition of “package body height (mm)”x”package body length (mm)”. If nominal value was not specified on existing “Design guideline of integrated circuit” and “Standard of integrated circuit package”, the maximum value must be used. ggg ggg ggg ggg ggg EIAJ ED-7303 gggg Table 5 Exception code of package nominal dimension Basic and derivative package name code Nominal dimension Example (5) QFP Body size 1010, 1420, etc. QFI terminal in-line interval 0325, 0400, etc. QFJ Body size (square/rectangle) S115, R400 etc. QFN Body size (square/rectangle) S350, R285, etc. SIP maximum seated height 0240, 0440, etc. ZIP maximum seated height 0325, 0400, etc. DIP terminal in-line interval 0300, 0400, etc. PGA matrix size (cavity up/down) S10U, R11D, etc. SOP distance between mount pad centers 0225, 0300, etc. TSOP (1) Outermost side dimension 1014, 0820, etc. TSOP (2) Body width 0300, 0400, etc. SOI terminal in-line interval 0300, 0400, etc. SOJ Body width 0300, 0400, etc. SSOP Body width 0300, 0044, etc. SVP Body size 0516, 1336, etc. DTP Body width 0300, 0450, etc. BGA Body size 1010, 2727, etc. FBGA Body size 1010, 2121, etc. English letters in code examples in Table 5 indicate the following contents S: Square R: Rectangle U: Cavity Up D: Cavity Down EIAJ ED-7303 gg 5.7 Terminal in-line interval code According to Table 6, terminal in-line interval code shall be specified 4 letters. Inch size terminal in-line interval expressed in millimeters shall be written on round form. (see ISO-370) ggg ggg ggg ggg ggg ggg 5.8 Example of package code Table 7 shows example of package code. ( ) is allowed for exception, but not be used for IEC proposal. ggg Table 7 Example of package code Package code (6) P- ZIP20 -9.4 x 26.67 -1.27 (P- ZIP20 -0400 -1.27) C -SDIP64 -18.8 x 83.82 -1.78 (C -SDIP64 -0750 -1.78) C-PGA144 -39.62 x 39.62 -2.54 (C-PGA144 -S15U -2.54) P -SOP28 -10.03 x 19.05 -1.27 (P -SOP28 -0450 -1.27) P -SOJ26 -7.74 x 17.57 -1.27 (P -SOJ26 -0300 -1.27) P -QFP80 -14 x 20 -0.80 (P -QFP80 -1420 –0.80) P -TSOP (1) 32 -10 x 12.4 -1.27 (P -TSOP (1) 32 -1014 -1.27) P -QFJ84 -29.41 x 29.41 -1.27 (P -QFJ84 -S115 -1.27) P -SSOP40 -11.5 x 17 -0.80 (P -SSOP40 -0450 -0.80) T -DTP (2) 16 -7.62 x 10.79 -1.27 (T -DTP (2) 16 -0300 -1.27) Table 6 Terminal in-line interval code Code Terminal in-line interval 2.54 2.54mm 1.78 1.778mm 1.50 1.50mm 1.27 1.27mm 1.25 1.25mm 1.00 1.00mm 0.80 0.80mm 0.75 0.75mm 0.65 0.65mm 0.50 0.50mm 0.40 0.40mm 0.30 0.30mm ggg EIAJ ED-7303 gggg 5.9 Coding of package code When a new integrated circuits package design guideline or a new standard of integrated circuits package are established by the Technical Standardization Committee on Semiconductor Device Package, new package code shall be assigned. In the case of new package name or new code excepted number of terminals will be necessity, this standard shall be revised. 6. Derivative package name code and common name 6.1 Derivative package name code Derivative package is constructed by package specific feature code (see Table 2) and package name code (see Table 3). Table 8 shows some examples. 6.2 Common name Common name is constructed by material code of package body (see Table 1) and derivative package name code, and shows the form of package directly. Table 9 shows some examples. When new common name is necessary to be established, it must be reviewed by the Technical Standardization Committee on Semiconductor Device Package according with EIAJ ED-7300 and this standard. 6.3 Relation between each code Figure 2 shows the relation between package code, basic package name code, derivative package name code and common name. Table 10 shows list of name and code. Table 8 Example of derivative package name code Basic package name code Derivative package name code Derivative package name QFP LQFP TQFP GQFP BQFP HQFP RQFP Low Profile QFP Thin QFP Guard Ring QFP Bumper QFP Heat Sink QFP Retain QFP SOP SSOP HSOP TSOP (1) TSOP (2) LSSOP TSSOP WSOP Shrink SOP Heat Sink SOP Thin SOP Type1 Thin SOP Type2 Low Profile Shrink SOP Thin Shrink SOP Window SOP DIP SDIP WDIP WSDIP Shrink DIP Window DIP Window Shrink DIP ZIP SZIP Shrink ZIP PGA IPGA SPGA Interstitial PGA Shrink PGA BGA FBGA Fine Pitch BGA DTP DTP (1) DTP (2) DTP Type1 DTP Type2 EIAJ ED-7303 gg Table 9 Example of common name Basic and derivative package name code Common name Basic and derivative package name LQFP P-LQFP C-LQFP G-LQFP Plastic LQFP Ceramic LQFP Glass sealed ceramic LQFP TQFP P-TQFP C-TQFP Plastic thin QFP Ceramic thin QFP FQFP P-FQFP C-FQFP Plastic fine pitch QFP Ceramic fine pitch QFP TSOP P-TSOP Plastic TSOP SSOP P-SSOP Plastic SSOP TSSOP P-TSSOP Plastic TSSOP SOJ P-SOJ Plastic SOJ VQFN P-VQFN Plastic very thin QFN DIP P-DIP C-DIP G-DIP Plastic DIP Ceramic DIP Glass sealed ceramic DIP PGA C-PGA P-PGA Ceramic PGA Plastic PGA BGA P-BGA T-BGA C-BGA Plastic BGA Tape BGA Ceramic BGA LBGA P-LBGA Plastic LBGA FBGA P-FBGA T-FBGA C-FBGA Plastic FBGA Tape FBGA Ceramic FBGA ggg ggg ggg ggg ggg ggg EIAJ ED-7303 gggg ggg ggg ggg ggg ggg ggg EIAJ ED-7303 gg Table 11 Outer view and characteristic of typical basic package Package Appearance Characteristics QFP Terminal leads are on four sides of package and are formed in gull wing-shape (L-shape) QFI Terminal leads are on four sides of package and are formed in I-shape. QFJ Terminal leads are on four sides of package and are formed in J-shape. QFF Terminal leads are on four sides of package and are non-formed. QFN Terminals are in a single line on each side and exist on four sides and bottom or only on bottom of package. SOP Terminal leads are on two sides of package and are formed in gull wing-shape (L-shape). SOI Terminal leads are on two sides of package and are formed in I-shape. SOJ Terminal leads are on two sides of package and are formed in J-shape. SOF Terminal leads are on two sides of package and are non-formed. SON Terminals are in a single line on each side and exist on two sides and bottom or only on bottom of package. ggg ggg ggg EIAJ ED-7303 gggg Table 11 Outer view and characteristic of typical basic package (continued) Package Appearance Characteristics DIP Terminal leads are on two opposite sides of package for through hole mount. SIP Terminal leads are on one side of the package and are arranged in a row. ZIP Terminal leads are on one side of the package and are bent alternately within the package thickness. SVP Terminal leads are on one side of the package and are formed in L-shape. PGA Terminal pins are on top or bottom surface of the package and are arranged in two or more lines or grid array. LGA Terminal lands are on top or bottom surface of the package and are arranged in two or more lines or grid array. BGA Terminal balls or bumps are on top or bottom surface of the package and are arranged in two or more lines or grid array. DTP Terminal leads are on two sides of package and package body is constructed by tape. QTP Terminal leads are on four sides of package and package body is constructed by tape. EIAJ ED-7303B ff EIAJ ED-7303B ss
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