EIAJ ED-7303B
EIAJ ED-7303B
CONTENTS
1. Scope of application …….………………………………………………………………………………..… 1
2. Terms ……….………………………………………………………………………………………………… 1
3. History ………………………………………………………………………………………………………. 1
4. Basic thinking for the standardization of package naming and coding method ……………………… 1
5. Package Code ………………………………………………………………………………………………… 3
5.1 Construction of package code ………………………………………………….…………………….... 3
5.2 Material code of package body ………………………………………………………………………….. 5
5.3 Package specific feature code ………………………………………………………………………….… 5
5.4 Basic package name code …………………………………………………….……………………….… 7
5.5 Package terminal number code ……………………………………………………………………….… 11
5.6 Code of package nominal dimension ……………………………………………………………….….. 11
5.7 Terminal in-line interval code ……………………………….…………………………………………… 15
5.8 Example of package code ……………………………………………………………………………….. 15
5.9 Coding of package code ……………………………………………………………………………….… 17
6. Derivative package name code and common name ……………………………………………….….. 17
6.1 Derivative package name code ………………………………………………………………………..… 17
6.2 Common name ……………………………………………………………………………………..…….. 17
6.3 Relation between each code ……………………………………………………..………………………… 17
7. Outer view and characteristics of basic package ……………………………………………………..… 21
EXPLANATORY NOTES
1. OBJECTIVES OF THE ESTABLISHMENT ……………………………………………………………... 27
2. HISTORY OF REVIEW ……………………………………………………………..……..……………… 27
3. KEY POINTS OF REVIEW AND EXPLANATORY NOTES …………………………………………….. 27
4. RELATED STANDARDS ……………………………………………………………..…………………….. 29
5. COMMITTEE MEMBERS ……………………………………………………………..……. ……………. 29
FIGURES AND TABLES
Figure 1 Package code ……….……………………………………………………………………………… 3
Figure 2 Relation between each code ………………….…………………………………………………… 21
Table 1 Material code of package body ……….…………………………………………………………… 5
Table 2 Package specific feature code ……………….…………………………………………………… 7
Table 3 Basic package name code ……………….………………………………………………………… 9
Table 4 Example of package terminal number code ……………….…………………………………… 11
Teble 5 Exception code of package nominal dimension ………………….……………………………… 13
Table 6 Terminal in-line interval code ……………….…………………………………………………… 15
Table 7 Example of package code ………………….……………………………………………………… 15
Table 8 Example of derivative package name code ……………….…………………………………… 17
Table 9 Example of common name ……………….……………………………………………………… 19
Table 10 List of name and code ……………….…………………………………………………………… 21
Table 11 Outer view and characteristics of typical basic package ……………………………………… 23
EIAJ ED-7303B
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Standard of Japan Electronics and Information Technology Industries Association
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Name and code for integrated circuits package
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1. Scope of application
This standard prescribes the name and code for semiconductor packages (hereinafter referred to as
packages) in the EIAJ ED-7300 (Recommended practice on standard for the preparation of outline
drawings of semiconductor packages).
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2. Terms
The terms used in this standard shall conform to those defined in the EIAJ ED-7300. The new terms not
included therein shall be defined in the text of this standard.
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3. History
The EIAJ standards related with the name and code for integrated circuits package established and
revised as follows:
EIAJ ED-7411 [General Rules for the Preparation of Outline Drawings of Integrated Circuits Package
Name and Code, established in February 1989]
EIAJ ED-7401-2 [Packages name and code for semiconductor device package (Integrated Circuits),
revised in June 1994]
EIAJ ED-7303 [Name and code for integrated circuits package, established in June 1998]
EIAJ ED-7303A [Name and code for integrated circuits package, revised in March 2001]
First, EIAJ ED-7411 specified the name and code of an integrated circuits package as one of the outline
general rules (the present outline standard). Then, the revised edition of EIAJ ED-7411 was published
as EIAJ ED-7401-2 according to the principle that integrated circuits are subordinate to EIAJ ED-7401
and discrete devices are subordinate to EIAJ ED-7501.
Next, EIAJ ED-7303 needed re-organization, revision and addition lager than before. That is, for the
purpose of respect to International standard IEC, standards of JEITA (former EIAJ) for integrated circuits
and discrete devices were integrated and re-organized. The standards of general rules were
re-constructed to six-volume organization, ranging from EIAJ ED-7300 to EIAJ ED-7305. As one of
six-volume organization, name and code for package were unified with the common rule to EIAJ ED-7303.
Furthermore, considering examination result of JWG2 which is the joint meeting of JEITA (former EIAJ)
and JEDEC, organization of package code were changed. Continuously EIAJ ED-7303A was revised to
the more common standard by standardization of Japanese name for various codes and names.
Then, for the needs of new codes addition such as seated height examined and approved by IEC for
diversified package and for preparing for packages developed in future, it is newly revised as EIAJ ED-7303B.
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4. Basic thinking for the standardization of package naming and coding method
This standard is based upon the following basic idea.
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EIAJ ED-7303B
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EIAJ ED-7303B
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5.2 Material code of package body
According to Table 1, material code of package body shall be specified 1 letter.
Table 1 Material code of package body
Code Material Applicable to
C Ceramic Multi-layer ceramic package
G Ceramic Glass sealed ceramic package
M Metal Package consisting of metallic materials
P Plastic Package molded with plastic
T Tape Package consisting of tape, For BGA and LGA, tape used for interposer.
5.3 Package specific feature code
According to Table 2, Package specific feature code shall be specified maximum of 3 letters (maximum
of 3 features).
5.3.1 Coding rule for package specific feature
(1) Present “Design guideline of integrated circuit” are given a priority.
(2) For new package, decide to apply this rule or not at making “Design guideline of integrated circuit”.
(3) If “Design guideline of integrated circuit” is not exist, decide to apply this rule or not at making
“Standard of integrated circuit package”.
(4) In the case of adding 2 or more specific feature codes to, according to the order of specific feature, first
letter is code of highest order. Maximum of 3 letters ( maximum of 3 features) shall be specified.
Example: TSSOP, HTSSOP, LSSOP, DSDIP, LBQFP, DLSOI and so on.
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EIAJ ED-7303B
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Table 2 Package specific feature code
Order Functional classification Code Meaning Specific feature
- - nothing - Basic package
H Heat Sink Heat sink
D Window Window 1 Outline addition
P Piggyback Piggyback
L Low profile Maximum seated height, 1.20mm < L <= 1.70mm
T Thin Maximum seated height, 1.00mm < T <= 1.20mm
V Very thin Maximum seated height, 0.80mm < V <= 1.00mm
W Very-Very thin Maximum seated height, 0.65mm < W <= 0.80mm
U Ultra thin Maximum seated height, 0.50mm < U <= 0.65mm
2 Seated height
X Extremely thin Maximum seated height, X <= 0.50mm
S Shrink Shrink pitch of basic package (only used for SOP, DIP, ZIP, PGA)
F Fine pitch
Terminal pitch is 0.8mm or less.
(only used for BGA, LGA)
Terminal pitch is 0.5mm or less.
(only used for QFP)
3 Terminal pitch or terminal position
I Interstitial Package with terminal other than grid array (only used for PGA, BGA, LGA)
B Bumper with bumper
G Guard Ring with Guard Ring 4 Lead protection
R Retain with Retain
5.4 Basic package name code
According to Table 3, basic package name code shall be specified 3 letters in principle. To classify
package form in Table 3, refer to EIAJ ED-7300.
As an exception, derivative package name TSOP(1), TSOP(2), DTP(1) and DTP(2) corresponding to
basic package name code SOP and DTP shall be managed as basic package name code and allowed 7
or 6 letters. In this case, conventional TSOP(I) and TSOP(II) shall not be allowed to use for TSOP(1)
and TSOP(2).
EIAJ ED-7303B
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EIAJ ED-7303B
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5.5 Package terminal number code
According to Table 4, Package terminal number code shall be specified maximum of 5 letters. In
addition, terminal shall be a generic term for lead, pin, land, bump, ball and so on. Which formed for
different connection method to outside.
For missing terminals in Table 4, 5 letters shall be accepted for 100 pins or less. For example, in the
case of 28 terminals package with 2 terminals missing, giving a code of 28/26.
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Table 4 Example of package terminal number code
Code Terminal number
8 8
14 14
64 64
144 144
1000 1000
28/26 28 (missing 2 terminals)
5.6 Code of package nominal dimension
Code of package nominal dimension is constructed by “package body width (mm)”x”package body
length (mm)” and shall be specified maximum of 11 letters.
When the figure below the decimal point is “x0” or “00”, delete the “0” or “00” from the code.
For example: 39.62 x 39.62, 11.50 x 14.50, 14.00 x 14.00 etc.
New code : 39.62 x 39.62, 11.5 x 14.5, 14 x 14 etc.
If package nominal dimension specified on existing “Design guideline of integrated circuit” and “Standard
of integrated circuit package” is not same as new definition of “package body height (mm)”x”package
body length (mm)”, it is allowed to use existing code for exception, but must be specified both new and
existing codes (see Table 5).
At the proposal to IEC, must be used only the new definition of “package body height (mm)”x”package
body length (mm)”. If nominal value was not specified on existing “Design guideline of integrated circuit”
and “Standard of integrated circuit package”, the maximum value must be used.
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EIAJ ED-7303
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Table 5 Exception code of package nominal dimension
Basic and derivative
package name code
Nominal dimension Example (5)
QFP Body size 1010, 1420, etc.
QFI terminal in-line interval 0325, 0400, etc.
QFJ Body size (square/rectangle) S115, R400 etc.
QFN Body size (square/rectangle) S350, R285, etc.
SIP maximum seated height 0240, 0440, etc.
ZIP maximum seated height 0325, 0400, etc.
DIP terminal in-line interval 0300, 0400, etc.
PGA matrix size (cavity up/down) S10U, R11D, etc.
SOP distance between mount pad centers 0225, 0300, etc.
TSOP (1) Outermost side dimension 1014, 0820, etc.
TSOP (2) Body width 0300, 0400, etc.
SOI terminal in-line interval 0300, 0400, etc.
SOJ Body width 0300, 0400, etc.
SSOP Body width 0300, 0044, etc.
SVP Body size 0516, 1336, etc.
DTP Body width 0300, 0450, etc.
BGA Body size 1010, 2727, etc.
FBGA Body size 1010, 2121, etc.
English letters in code examples in Table 5 indicate the following contents
S: Square
R: Rectangle
U: Cavity Up
D: Cavity Down
EIAJ ED-7303
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5.7 Terminal in-line interval code
According to Table 6, terminal in-line interval
code shall be specified 4 letters.
Inch size terminal in-line interval expressed in
millimeters shall be written on round form.
(see ISO-370)
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5.8 Example of package code
Table 7 shows example of package code. ( ) is allowed for exception, but not be used for IEC proposal.
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Table 7 Example of package code
Package code (6)
P- ZIP20 -9.4 x 26.67 -1.27
(P- ZIP20 -0400 -1.27)
C -SDIP64 -18.8 x 83.82 -1.78
(C -SDIP64 -0750 -1.78)
C-PGA144 -39.62 x 39.62 -2.54
(C-PGA144 -S15U -2.54)
P -SOP28 -10.03 x 19.05 -1.27
(P -SOP28 -0450 -1.27)
P -SOJ26 -7.74 x 17.57 -1.27
(P -SOJ26 -0300 -1.27)
P -QFP80 -14 x 20 -0.80
(P -QFP80 -1420 –0.80)
P -TSOP (1) 32 -10 x 12.4 -1.27
(P -TSOP (1) 32 -1014 -1.27)
P -QFJ84 -29.41 x 29.41 -1.27
(P -QFJ84 -S115 -1.27)
P -SSOP40 -11.5 x 17 -0.80
(P -SSOP40 -0450 -0.80)
T -DTP (2) 16 -7.62 x 10.79 -1.27
(T -DTP (2) 16 -0300 -1.27)
Table 6 Terminal in-line interval code
Code Terminal in-line interval
2.54 2.54mm
1.78 1.778mm
1.50 1.50mm
1.27 1.27mm
1.25 1.25mm
1.00 1.00mm
0.80 0.80mm
0.75 0.75mm
0.65 0.65mm
0.50 0.50mm
0.40 0.40mm
0.30 0.30mm
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EIAJ ED-7303
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5.9 Coding of package code
When a new integrated circuits package design guideline or a new standard of integrated circuits
package are established by the Technical Standardization Committee on Semiconductor Device
Package, new package code shall be assigned. In the case of new package name or new code
excepted number of terminals will be necessity, this standard shall be revised.
6. Derivative package name code and common name
6.1 Derivative package name code
Derivative package is constructed by package specific feature code (see Table 2) and package name
code (see Table 3). Table 8 shows some examples.
6.2 Common name
Common name is constructed by material code of package body (see Table 1) and derivative package
name code, and shows the form of package directly. Table 9 shows some examples.
When new common name is necessary to be established, it must be reviewed by the Technical
Standardization Committee on Semiconductor Device Package according with EIAJ ED-7300 and this
standard.
6.3 Relation between each code
Figure 2 shows the relation between package code, basic package name code, derivative package
name code and common name.
Table 10 shows list of name and code.
Table 8 Example of derivative package name code
Basic package name code Derivative package name code Derivative package name
QFP LQFP
TQFP
GQFP
BQFP
HQFP
RQFP
Low Profile QFP
Thin QFP
Guard Ring QFP
Bumper QFP
Heat Sink QFP
Retain QFP
SOP SSOP
HSOP
TSOP (1)
TSOP (2)
LSSOP
TSSOP
WSOP
Shrink SOP
Heat Sink SOP
Thin SOP Type1
Thin SOP Type2
Low Profile Shrink SOP
Thin Shrink SOP
Window SOP
DIP SDIP
WDIP
WSDIP
Shrink DIP
Window DIP
Window Shrink DIP
ZIP SZIP Shrink ZIP
PGA IPGA
SPGA
Interstitial PGA
Shrink PGA
BGA FBGA Fine Pitch BGA
DTP DTP (1)
DTP (2)
DTP Type1
DTP Type2
EIAJ ED-7303
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Table 9 Example of common name
Basic and derivative
package name code
Common name Basic and derivative package name
LQFP P-LQFP
C-LQFP
G-LQFP
Plastic LQFP
Ceramic LQFP
Glass sealed ceramic LQFP
TQFP P-TQFP
C-TQFP
Plastic thin QFP
Ceramic thin QFP
FQFP P-FQFP
C-FQFP
Plastic fine pitch QFP
Ceramic fine pitch QFP
TSOP P-TSOP Plastic TSOP
SSOP P-SSOP Plastic SSOP
TSSOP P-TSSOP Plastic TSSOP
SOJ P-SOJ Plastic SOJ
VQFN P-VQFN Plastic very thin QFN
DIP P-DIP
C-DIP
G-DIP
Plastic DIP
Ceramic DIP
Glass sealed ceramic DIP
PGA C-PGA
P-PGA
Ceramic PGA
Plastic PGA
BGA P-BGA
T-BGA
C-BGA
Plastic BGA
Tape BGA
Ceramic BGA
LBGA P-LBGA Plastic LBGA
FBGA P-FBGA
T-FBGA
C-FBGA
Plastic FBGA
Tape FBGA
Ceramic FBGA
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Table 11 Outer view and characteristic of typical basic package
Package Appearance Characteristics
QFP
Terminal leads are on four sides of package and are formed
in gull wing-shape (L-shape)
QFI
Terminal leads are on four sides of package and are formed
in I-shape.
QFJ
Terminal leads are on four sides of package and are formed
in J-shape.
QFF
Terminal leads are on four sides of package and are
non-formed.
QFN
Terminals are in a single line on each side and exist on four
sides and bottom or only on bottom of package.
SOP
Terminal leads are on two sides of package and are formed
in gull wing-shape (L-shape).
SOI
Terminal leads are on two sides of package and are formed
in I-shape.
SOJ
Terminal leads are on two sides of package and are formed
in J-shape.
SOF
Terminal leads are on two sides of package and are
non-formed.
SON
Terminals are in a single line on each side and exist on two
sides and bottom or only on bottom of package.
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EIAJ ED-7303
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Table 11 Outer view and characteristic of typical basic package (continued)
Package Appearance Characteristics
DIP
Terminal leads are on two opposite sides of package for
through hole mount.
SIP
Terminal leads are on one side of the package and are
arranged in a row.
ZIP
Terminal leads are on one side of the package and are bent
alternately within the package thickness.
SVP
Terminal leads are on one side of the package and are
formed in L-shape.
PGA
Terminal pins are on top or bottom surface of the package
and are arranged in two or more lines or grid array.
LGA
Terminal lands are on top or bottom surface of the package
and are arranged in two or more lines or grid array.
BGA
Terminal balls or bumps are on top or bottom surface of the
package and are arranged in two or more lines or grid array.
DTP
Terminal leads are on two sides of package and package
body is constructed by tape.
QTP
Terminal leads are on four sides of package and package
body is constructed by tape.
EIAJ ED-7303B
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EIAJ ED-7303B
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