第4章控制功能及參數主操作
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关于同志近三年现实表现材料材料类招标技术评分表图表与交易pdf视力表打印pdf用图表说话 pdf
:AD809共有八個主要模式。按[ADV]或[RTD]鍵進行選擇及在選取項目後按[ENTER]確定選擇。按鍵盤上的[MODE]鍵後,如下的操作表會顯示在屏幕下方。AUTOSETUPPARASERVDIAGWHPARTCHPCBALNPCB按[ADV]或[RTD]鍵選取項目後按[ENTER]執行其中:AUTO=用於執行“AUTOMode”功能SETUP=用於執行“SETUPMode”功能PARA=用於執行“PARAMETERMod”e功能SERV=用於執行“SERVICEMode”功能DIAG=用於執行“DIAGNOSTICMode”功能WHPAR=用於執行“WORKHOLDERParamet”er功能TCHPCB=用於執行“TEACHPCB”功能ALNPCB=用於執行“ALIGNPCB”功能AUTOMode自（動模式）AUTOMODE0AutoBond1SingleCycleBond2UnloadWafer3WaferPRSEnable4ManualAlignPCB5EditBondPoint6GoToBondPt07EpoxyOffset8MissingDieDetectEnable9ReplacePickedDieEnable模式操作表#項目說明Auto0AutoBond根據已編寫的焊點程式執行自動焊點。按下列的鍵可trigger不同的功能。
-轉換攝像機的觀察位置-立刻停止焊接-停止焊接現時正在進行焊接的管芯1SingleCycleBond只焊接一個管芯。這項功能用於焊接測試。焊點會被更新為焊接ThebondpointwillbeupdatedtothebondtargetpositionifyouuseIQCinspection.2Unloadwafer當這項功能被triggered時,會自動地卸除芯片,載入新的芯片,對準芯片角,對準芯片XY位移,到達第1粒管芯,計算新的行程路徑方向及檢查管芯尺寸。3WaferPRS啟動或關閉芯片工作台上的圖像識別系統功能。預設值為[ENABLE]。4ManualAlignPCB用控制桿瞄準對準點後按[ENTER]。屏幕會顯示出[PCB(X,Y)MALN1],表示在X行及Y列上輸入PCB的第1對準點。5EditBondPt編輯或修正焊點位置,用控制桿移動瞄準,然後按[ENTER]設定。6GotoBondPt直接鍵入PCB上的指定焊點。7EpoxyOffset當銀漿點偏離於焊點時,用於修正焊接位置。必須按序分別輸入焊點及銀漿點以使機器知道銀漿偏距。8MissDieCheck啟動或關閉在進行自動焊接時的漏晶檢查功能。9ReplacepickedDie若機器在按[STOP]後停止操作時,用於啟動或關閉更換管芯功能。SETUPMode設(定模式)TEACHBONDARMSET-UP040WAFERPRSET-UPAdjVideoLevelDONE0PickPosition1PrepickPosition1LoadReference2BlowPosition2AdjSrchRangeDONE3MissingDiePosition3CalibrationDONE4PrebondPosition4SrchAlgorithmSTREET5BondPosition5Chip/InkRejectSize4066UnloadCarrierPos6AngleAcceptance(+/-)57SearchDie8PatternDieSrchCode09ClearAllPRReferenceTEACHB/HLEVELS15WHSET-UP0HeadHomeLevel0TchUnloadPCBPos1PickLevel1MeasuringRuler2BondLevel2ADVPCB3ReplaceDieLevel3HomePCB4RTDPCB5EpoxyOffset6HomePCBTableWAFERTABLE36TEACHEJECTORLEVELS0ShowWaferCenter0EjectorType1TeachWaferLimit1EjectorHomeLevel2TeachStartPosition2EjectorUpLevel3TeachLoadPosition4TeachPitch5EditPolygonVertex6ShowWaferLimit7WaferPRS模式操作表#項目說明Setup0BondArmThebondarmset-upistodefineandteachtheproperpositionofthebondarmduringbondingtoensuresmoothoperationandbetterplacementaccuracy.0PickPositionThepickpositionisthepositionwherethebondarmstopsafterswinginginthetamotionfrombondpositionbeforeitgoesdowntopickleveltopickdie.Therangevalueis-36to-40.1PrepickPosition靠近拾取位置的焊臂位置,的攝像機。但不能妨礙芯片圖像識別系統2BlowPosition當向外吹氣時的焊臂位置。3MissDiePosition用於漏晶探測時調校及定義焊臂位置。4PrebondPosition靠近焊接位置的焊臂位置。5BondPos焊接管芯到PCB上的焊臂位置6UnloadCarPosition當按[ADV]或[RTD]載入載具時用於定義焊臂位置。步數可調。預設值是301。1BondHead執行焊頭參數數據輸入功能。0HeadHomeLevel焊頭在原位高度時的位置。1PickLevel拾取管芯時的焊頭位置。PICKLEVELCOLLETDIESMYLARPAPEREJECTORCAPEJECTORPINNOTE:THEPICKLEVELISJUSTHITTINGTHEDIE.3BondLevel按[ADV]或[RTD]定義焊頭在焊接時的高度。步數可調。預設值是525。4ReplaceDie焊頭放管芯回芯片上的高度。放回管芯的高度通常低於拾取高度（數值會增大）。#WaferSet只用於AD809M-06多個芯片。3WaferTable用於執行芯片工作台設定功能。0ShowWaferCentre移動芯片工作台到芯片中心。0模式操作表#項目1TeachWaferLimitIfwafershapeissetto‘Polygon,'usethejoysticktolocatethepointsontheedgeofthewaferthenpress[ADV]everytimeapointisidentifiedandfinallypress[ENTER]forthelastpoint.Differentpolygonshapesofwafersareillustratedonthefollowingsketch.1243109說明Tosetthewaferlimitbasedontheoutsideactualdimensionofwafershape,thewafercouldbecircleorpolygon.IfwafershapeissettoCircle',‘3pointsonthewaferedgeneedbelocatedfordefiningthecircleasinthefollowingdiagram.TeachStartPos'nTeachLoadPos'nTeachPitchEditPolygonVertexTodefinethepositionofthebondheadtostarttopickadie.Todefinetheloadingpositionofthewafertableafterbondingbyusingthejoysticktolocatetheposition.Tocalculatethedistancebetween2dicebyusingthejoysticktomoveeachdietofitwiththecursorofthemonitorandthenpress[ENTER].Thisistoeditpolygonwaferprogrammingonly.Itofferstheusertoeditthewaferlimit.ShowWaferItshowsthemarginoftheprogrammedwaferarea.LimitWaferPRSWaferPRSAdjustVideoLevelLoadReferenceThisprovidesoptiontotheusertoenableordisablethePRSonsomeoccasion.ThisprovidesoptiontotheusertoEditthePRSParameteronsomeoccasion.Using[ADV]or[RTD]toadjustthedigitizedpicturesoastomakearecognizableclearpatternonthemonitor.Thisfunctionisappliedafterthedieisplaced.PRreferencecanbeloadedafterthelightingisadjustedandfollowingbyselectingthesearchrange.Finally,thecalibrationwillbedonebythePRsystem.模式操作表#項目說明2AdjustSearchRangeTodefinethesearchingareabypressing[ADV]or[RTD].Searchareashouldbesettothemaximumsizewhichshouldonlycontainonewholedie.3CalibrationTodocalibrationforthePRsystem.4SearchAlgorithmThereare2kindsofsearchingalgorithm,('street'and'template').For'template'method,thereareatotalof10kindsoftemplates.Thissearchingmethodistocomparethepatternwithinthetemplate.The'street'methodistocomparethespacearoundadie.5Chip/InkRejectThereareatotalof3digitsinthedisplay.Thefirstdigitisforchipdieandthethirddigitisforinkdie.Thevalueofthedigitsisfrom0to9.Thebiggerthevalue,thestrictertherequirementofanaccepteddie.The2nddigitisalwaysa0.Thedefaultis206.6AngleAcceptance(+/-)Therateofdierotationonthewafertobepicked-up.Dierotatedoutsidethepre-setvaluewillbeskipped.7SearchDieTosearchadieonthewafer,whetheritisrotated,inkedorgooddie.8PatternDieSearchCodeThecodecanbesettoeither‘0'or‘2'.Numericvaluforsearchinggoodandinkeddie,while‘2'isblankdie.Thedefaultsettingis0.9ClearAllPRReferenceThisistoclearallthereferenceofthePRstoredintheprogram.5WorkholderSet-upofsomefunctionsofworkholderrelatedtocontrollerside.0TeachUnloadPCBPosnTodefinetheunloadingpositionofthePCBorworkholdertableafterbondingcompletionofsubstrates.Thispositionservesalsoastheloadingpositionofnewcarrierorsubstratestobeprocessed.1MeasuringRulerTomeasurethedistancebetweenany2pointsontheworkholderside,i.e.pitchofbondpoints,referencealignmentpointsdistance,etc.2ADVPCBTomovethetabletothenextPCB.3HomePCBTomovetheworkholdertabletothefirstPCBalignmentpoint.4RTDPCBTomovethetablebacktotheprecedingPCB.5EpoxyOffsetRefertoChapter3.56HomePCBTableThisfunctioncanbeusedtohometheworkholdertable.6EjectorToperformejectorparameterdataentryfunction.0EjectortypeThisfunctionisoptional.Forsmallerdicei.e.LED,ordinaryischosen,whilecompositetypeisselectedforbiggerdice.Thistypeshouldbeselectedonlyiftheejectorassemblyisforcomposite.1EjectorHomeLevelThehomelevelpositionoftheejector.e‘0'isforthetestand9模式操作表#2項目EjectorUpLevel說明Thislevelwilltotallyfreeupthediefromthemylartapeadhesion.Theheightoftheejectorpinshouldbeaboutonediethickatthislevel.EjectorUpLevelDieColletEjectorPinEjectorValveColletVacuumEpoxyDrumSoleToEnableorDisabletheejectorcapvacuumToEnableorDisablethecolletvacuumNotcapableforstandardAD809-06machineBONDParameter(焊接參數)SETDELAYS0ArmPickDelay201HeadPickDelay702EjectorUpDelay203PickDelay504ArmBondDelay205HeadBondDelay606BondDelay507PRDelay708IndexWHDelay209WeakBlowDelays00SETMOTORSPEEDS0BondArmSlow1BondHeadUpFast2BondHeadDownNormal3EjectorSlow4TableXNormal5TableYNormal6PasswordDisable1BONDPARAMETERS0Delays1MotorSpeeds2WalkingPathSize03WaferEdgeSrchNum44UnitsToBond(x1K)05MissingDieDetectEnable6CurrDieRepickCount57ContactPickDisable8ContactBondDisable9BondInkedDieDisableModeMenu#TitleDescriptionPara meter0DelayMenu用於執行延遲參數數據輸入功能。0ArmPickDelayTospecifythetimedelayjustafterthebondingprocesshasbeencompletedandbeforethebondarmstartstorotatetopre pickposition.Thedefaultvalueis20.1HeadPickDelayTospecifythetimedelayjustafterthebondarmreachesthepickpositionandbeforeitwillreachthepicklevel.Thedefaultvalueis70.2EjectUpDelayTospecifythetimedelayjustwhenthebondheadstopsdescendingandbeforetheejectorstartrisingup.Thedefaultvalueis20.3PickDelayTospecifythetimeforthebondarmtoremainatpickuplevelaftertheejectorupandreturntoitshomeposition.Thedefaultvalueis50.4ArmBondDelayTospecifythetimedelayjustafterthepickingprocesshasbeencompletedandbeforethebondarmstartstorotatetopre bondposition.Thedefaultvalueis20.5HeadBondDelayTospecifythetimedelayjustafterthebondheadreachesitsbondpositionandbeforeitgoesdowntoreachthebondlevel.Thedefaultvalueis60.6BondDelayTospecifythetimedelayforthebondarmtoremainatthebondlevelbeforegoingup.Thedefaultvalueis50.7PRDelayTospecifythetimedelaywhentheX-YTablestopandbeforePRsystemstartstorecognizeapattern.Thedefaultis70.ModeMenu#TitleDescription8IndexWHDelayDelayafterdiebondedonthesubstratesandthew/htablestartstoindex.9WblowOnDelayThedurationforweakairflowblowfromthecolletbeforethebondheadrisesfrombondleveltohomelevel.bondheadz-levelbondlevelvalveopenpressurizedvalveclosevalvecloseairvalvewblowbonddelay1SetMotorSpeedsThisistoperformtheprooftherespectivemotors.Optionally,apasswordisrequiredtoaccessthisinformation.0BondArm焊臂馬達驅動運動Thebondarmmotordrivesthethetamotionofthebondarmitself.1BondheadUp焊頭可作兩種運動,上升及下降。Thebondheadisdividedintotwomotions,upanddown.Separateprofilesareavailabletoeachmotion.2BondheadDownThedownprobeslowerthanupmotiontopreventexcessivevibrationwhencolletisincontactwiththedie.3EjectorForsensitivedie,slowspeedforejectormayavoiddiefromcrackingorbreaking.4Table–XX軸馬達的速度。5Table–YY軸馬達的速度。6Password用於封鎖控制器參數及馬達速度狀態。SERVICEMode輔（助模式）SERVICEMODE0FormatNewDisk1SaveControllerParam2RestoreControllerParam3SaveWHParam4RestoreWHParam5PrintControllerParam6PrintStatistics7ShowStatistics8ClearStatistics9SetDateandTime7BONDSTATISTICSSinceDay-Month-YearTimeTotalUpTime=0.00:00TotalIdleTime=0.00:00Ave.CycleTime=0msTotalUnits=0InkedDieCount=0ChipDieCount=0UnsuccessfulPick=0ColletJamCount=0ModeMenu#TitleDescriptionService0FormatNewDisk將新磁碟格式化。1SaveControllerParam儲存控制器參數到已格式化的磁碟。2RestoreControllerParam開啟在磁碟內的控制器參數。3SaveWHParam儲存工作夾具參數到磁碟。4RestoreWHParam開啟在磁碟內的工作夾具參數。5PrintControllerParam列印參數表到配有RS-232介面的印表機。6PrintStatistics列印焊接統計表到印表機。7ShowStatistics顯示由某個指定時間至最後焊接單元的總工作時間、總停機時間、平均週期時間、總產量、印墨管芯計數、裂片管芯計數、不能成功拾取和吸咀阻塞計數的統計結果。8ClearStatistics用於清除統計記錄。9SetDateandTime按[ADV]或[RTD]鍵設定日期及時間,然後按[ENTER]。DIAGNOSTICMode診（斷模式）DIAGNOSTICMODE0TestBondSelectTestModuleCheckMissingStepsSingleStepTestDisableVideoModeDisableSELECTTESTMODULE0BondArmEnable1BondHeadEnable2EjectorEnable3WaferTableEnable4WHEnable5ValvesEnableMISSINGSTEPSRECORDTOC\o"1-5"\h\z0BondArm0BondHead0Ejector0Table-X0Table-Y0WaferTurnTable0模式操作表#項目說明DIAG0TestBond用於執行測試焊接工序。1SelectTestModules用於選擇不同模件在所有模式中執行功能與否。用[ADV]或[RTD]鍵選擇需要的項目後按[ENTER]鍵。（用於啟動或關閉下列的測試項目:焊臂、焊頭、頂針系統、芯片工作台、工作夾具及閥門。2MissStepRecords用於顯示焊臂、焊頭、頂針系統、X工作台及Y工作台的失步記錄。要重新計算,按[ENTER]。3SingleStepTest用於啟動或關閉逐步執行的測試焊接工序。預設值是[Disable]4VideoTest用於啟動或關閉顯示數字化圖像識別圖案的視頻模式功能。預設值是[Disable]。WHPARAM工（作夾具參數）ModeMenu#TitleDescriptionWHParam0TableParameterMenu提供選項編輯工作夾具參數。0TableSpeedTospecifythetablespeedoftheworkholderbypressing[ADV]or[RTD]keys.Thereareatotalof5differentkindsofspeed,fromAtoE.WhereEisthefastestandAistheslowestspeed.Thedefaultvalueis'C'.1TableJoystickSpeedTochangetheworkholdertablejoystickspeedforminimummotion.2TableTolTospecifythemaximumdeviationofdistanceoftwoalignmentpoints(toberecognizedbythePRsystem).Thedefaultvalueis15.3TableDelay設定工作夾具攝像機在穿梭到其他行時等候的延遲時間TosetthedelaytimefortheWHcameratowaitbeforeshuttlingtotheotherrows.4WHDelayTospecifythetimedelaybetweenthefirstPCBinsidethecarrierandtheactivationofPRS.Thedefaultvalueis200.1PRDelayTospecifythetimedelaywhentheworkholderstopsandthePRsystemstartsrecognizethepattern.Thedefaultvalueis30.2SingleCarrierToenableordisablethefunctionoftheworkholderasasinglecarrier.Thedefaultvalueis'Disable'.3HomeIn-CarTableToenableordisablethefunctionoftheworkholdertohomepositionfirstaftercarrierisloadedduringloadingModeMenu#TitleDescription4EditIn-SubPosnToenableordisablethefunctionofbondpausingbeforePRsearchforworkholderaftercarrierisloaded.IncasethePCBPRpatternisalwaysbeyondPRtolerance.ThenPRalignmentpointcanbemanuallyadjustedduringpausingofbonding5CheckMissingStepsToshowthenumberofthemissingstepsofthePCBtable-XandPCBtable-Y.Thecountercouldberesetbypressingthe[ENTER]key.6PrintW/HParameterToprintoutthe‘W/H'parameteronlywhentheswitheprinterportisturnedinto“W/H”.7EpoxyDiscStepsTospecifythenumberofstepsofepoxydiscmovementafterbondingadie.Thedefaultvalueis130.TeachPCBProgram(編寫PCB程式)TEACHPCBPROGRAM0ChangeCarrier1No.ofSub-Carriers12No.ofRowsofPCB3No.ofColsofPCB4PRAlignPoints25TeachSubstrateLoc6PCBNo.TchBondPoint17MaxSkipPCBAllow18DeletePCBProgramTEACHPCBPROGRAMEDITPCB0ChangeofCarrier0EditAlignPoints1No.ofSub-Carrier11HomePCB2EditAlignPoints2ADV3EditBondPoints23AlignSelect4PRAlignPoints24RTD5EditSubstrateLoc6PCBNo.TchBondPoint17MaxSkipPCBAllow18DeletePCBProgram33EDITDIEEDITPCB0Edit0PRLoadReference1Die#11HomePCB2ADV2ADV3Delete3AlignSelect4RTD4RTD5Insert5PRVideo#WaferNo.(WHPgmNum)16PRRange/Template7GroupPattern7PRCalibration8RepeatPattern8PRSearch9TeachMatrix9PRTolerance5ModeMenu#TitleDescriptionTCHPCB0TeachPCBProgram執行PCB編程。0ChangeCarrier移動工作夾具載具到卸除位置以便更換其他PCB。1No.ofSub-CarSpecifiesthenumberofsub-carriersinonepass.Sub carriersarecarrierwithagroupofPCB's.Msub-carriersinoneprogram.2EditAlignPts執行編輯對準點功能。0EditAlignmentPoints編輯或編寫圖像識別系統對準點。0PRLoadReference用於載入基準或PCB的對準點到圖像識別系統。1HomePCB移動工作台到首個PCB的首個圖像識別對準點。2ADV前進到下一個PCB。3AlignSelect當選取了對準選擇後,會切換到圖像識別對準操作表。4RTD後退到先前的PCB.5PRVideoToadjustthethresholdvalueoftheselectedPRalignmentpoint.oftwModeMenu#TitleDescription6PRRange/Template用於調校適當的範圍,模板圖形及尺寸。7PRCalibration輸入所有參數後執行校準。8PRSearchTosearchforthealignmentpointswhetherthedataenteredisgoodorrejected.9PRToleranceToadjustthePRsearchimageacceptancelevel.3EditBondPts用於執行編輯焊點功能。0Edit用於編輯管芯及選項Toeditthedieandoptionisgiventochangetoanewposition.1Die#Tomovetoadiepositionaccordingtothenumberentered.2ADV用於前進到下一個管芯。3Delete用於刪除使用者希望從程式中刪除的焊點。4RTD用於返回先前的焊點。5Insert這項功能允許使用者在完成程式後增加或插入管芯。Thisfunctionallowstheusertoaddorinsertadieevenaftercompletingtheprogram.Thisisalsouseforindividualprogrammingwherebondpointsisenteredintotheprogrampoint-by-point.#Waferno.(WHpgmnum)這項功能只適用於AD809M-06多個芯片的機器。7Grouppattern這是把多個組別的焊點組合為一個組別的編程方法,用於取代單獨輸入焊焊。8RepeatPatternThegroupedpatterncanberepeatedintonumberofPCBorrowsandcolumnsofdicewithoutteachingorgroupingeverygroupofPCB's.Ifitem‘7'and‘8'aremtogether,itiscalledgroup-and-repeatprogramming.9TeachMatrix這項程式要求行Thisprogramasksforthenumberofrowsofdieverticallyandthenumberofcolumnshorizontally.Itisrecommendedforasymmetricalarrangementofbondpoints.4PRAlignPoints用於指定圖像識別系統內的對準點。5EditSubstrateLocThisisusefulforcircularshapeofPCB.Enterthealignmentpointsfirstbeforeeditingthesubstratelocation.Inothercases,whereacarrierwithanumberofPCB'sshifts,editthefirstPCBlocationorfirstalignmentpointsonlyandallthePCB'sinthesamecarrierareupdatedautomaticallytothisnewposition.6PCBNo.TchBndPtTherearesomePCB'sornumberofunitsinonePCBthareconsideredPCB'sthatarenotclearforprogramming,thisfunctionenablestheusertoselectabrilliantorbetterimagePCBasreferenceinteachingthebondpoints.Example:key-in‘4',thetablemovestoPCB#4.7MaxSkipPCBAllow若PCB的品質差劣或圖像識別對準參考不一致時,程式會自動地跳過該不能被對準的PCB。必須在這項參數輸入要跳過的PCB數目,在跳過該數目的PCB後機器會自動地停止。ModeMenu#TitleDescription8DeletePCBProgram當刪除了編寫的程式,[TEACHPCBPROGRAMMODE]的主操作表將會轉換為[1EDITALIGNPTS]及[2EDITBONDPTS],並會顯示[1#OFROWSOFPCB]及[2#OFCOLSOFPCB]。ALNPCB(對準PCB)這個模式功能是用於設定PCB的對準點。屏幕會自動地轉換攝像機到工作夾具上,用控制桿瞄準對準點並按[ENTER],屏幕會顯示[PCB(X,Y)MALN1],表示你將要在X行及Y列上輸入PCB的第1對準點。
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