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首页 IPC-2221A

IPC-2221A.pdf

IPC-2221A

niatcn
2017-10-09 0人阅读 举报 0 0 0 暂无简介

简介:本文档为《IPC-2221Apdf》,可适用于IT/计算机领域

IPCAGenericStandardonPrintedBoardDesignASSOCIATIONCONNECTINGELECTRONICSINDUSTRIESregSandersRoad,Northbrook,ILTelFaxwwwipcorgIPCAMayAstandarddevelopedbyIPCSupersedesIPCFebruaryCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=DefenseContractMgmtCommandNotforResale,::MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS`,,``,,`,,`,`,,``,,`,``,``,``,,`,,`,`,,`wwwbzfxwcomThePrinciplesofStandardizationInMaytheIPCrsquosTechnicalActivitiesExecutiveCommitteeadoptedPrinciplesofStandardizationasaguidingprincipleofIPCrsquosstandardizationeffortsStandardsShould:bullShowrelationshiptoDesignforManufacturability(DFM)andDesignfortheEnvironment(DFE)bullMinimizetimetomarketbullContainsimple(simplified)languagebullJustincludespecinformationbullFocusonendproductperformancebullIncludeafeedbacksystemonuseandproblemsforfutureimprovementStandardsShouldNot:bullInhibitinnovationbullIncreasetimetomarketbullKeeppeopleoutbullIncreasecycletimebullTellyouhowtomakesomethingbullContainanythingthatcannotbedefendedwithdataNoticeIPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneedExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofIPCfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublication,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanIPCmembers,whetherthestandardistobeusedeitherdomesticallyorinternationallyRecommendedStandardsandPublicationsareadoptedbyIPCwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocessesBysuchaction,IPCdoesnotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublicationUsersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringementIPCPositionStatementonSpecificationRevisionChangeItisthepositionofIPCrsquosTechnicalActivitiesExecutiveCommittee(TAEC)thattheuseandimplementationofIPCpublicationsisvoluntaryandispartofarelationshipenteredintobycustomerandsupplierWhenanIPCpublicationisupdatedandanewrevisionispublished,itistheopinionoftheTAECthattheuseofthenewrevisionaspartofanexistingrelationshipisnotautomaticunlessrequiredbythecontractTheTAECrecommendstheuseofthelatestrevisionAdoptedOctoberWhyisthereachargeforthisdocumentYourpurchaseofthisdocumentcontributestotheongoingdevelopmentofnewandupdatedindustrystandardsandpublicationsStandardsallowmanufacturers,customers,andsupplierstounderstandoneanotherbetterStandardsallowmanufacturersgreaterefficiencieswhentheycansetuptheirprocessestomeetindustrystandards,allowingthemtooffertheircustomerslowercostsIPCspendshundredsofthousandsofdollarsannuallytosupportIPCrsquosvolunteersinthestandardsandpublicationsdevelopmentprocessTherearemanyroundsofdraftssentoorreviewandthecommitteesspendhundredsofhoursinreviewanddevelopmentIPCrsquosstaffattendsandparticipatesincommitteeactivities,typesetsandcirculatesdocumentdrafts,andfollowsallnecessaryprocedurestoqualifyforANSIapprovalIPCrsquosmembershipdueshavebeenkeptlowtoallowasmanycompaniesaspossibletoparticipateTherefore,thestandardsandpublicationsrevenueisnecessarytocomplementduesrevenueThepricescheduleoffersadiscounttoIPCmembersIfyourcompanybuysIPCstandardsandpublications,whynottakeadvantageofthisandthemanyotherbenefitsofIPCmembershipaswellFormoreinformationonmembershipinIPC,pleasevisitwwwipcorgorcallThankyouforyourcontinuedsupportcopyCopyrightIPC,Northbrook,IllinoisAllrightsreservedunderbothinternationalandPanAmericancopyrightconventionsAnycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStatesCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=DefenseContractMgmtCommandNotforResale,::MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS`,,``,,`,,`,`,,``,,`,``,``,``,,`,,`,`,,`标准分享网wwwbzfxwcom免费下载wwwbzfxwcomIPCAGenericStandardonPrintedBoardDesignDevelopedbytheIPCTaskGroup(Db)oftheRigidPrintedBoardCommittee(D)ofIPCUsersofthispublicationareencouragedtoparticipateinthedevelopmentoffuturerevisionsContact:IPCSandersRoadNorthbrook,IllinoisTelFaxSupersedes:IPCFebruaryASSOCIATIONCONNECTINGELECTRONICSINDUSTRIESregCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=DefenseContractMgmtCommandNotforResale,::MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS`,,``,,`,,`,`,,``,,`,``,``,``,,`,,`,`,,`wwwbzfxwcomFOREWORDThisstandardisintendedtoprovideinformationonthegenericrequirementsfororganicprintedboarddesignAllaspectsanddetailsofthedesignrequirementsareaddressedtotheextentthattheycanbeappliedtothebroadspectrumofthosedesignsthatuseorganicmaterialsororganicmaterialsincombinationwithinorganicmaterials(metal,glass,ceramic,etc)toprovidethestructureformountingandinterconnectingelectronic,electromechanical,andmechanicalcomponentsItiscrucialthatadecisionpertainingtothechoiceofproducttypesbemadeasearlyaspossibleOnceacomponentmountingandinterconnectingtechnologyhasbeenselectedtheusershouldobtainthesectionaldocumentthatprovidesthespecificfocusonthechosentechnologyItmaybemoreeffectivetoconsideralternativeprintedboardconstructiontypesfortheproductbeingdesignedAsanexampletheapplicationofarigidflexprintedwiringboardmaybemorecostorperformanceeffectivethanusingmultipleprintedwiringboards,connectorsandcablesIPCrsquosdocumentationstrategyistoprovidedistinctdocumentsthatfocusonspecificaspectofelectronicpackagingissuesInthisregarddocumentsetsareusedtoprovidethetotalinformationrelatedtoaparticularelectronicpackagingtopicAdocumentsetisidentifiedbyafourdigitnumberthatendsinzero()IncludedinthesetisthegenericinformationwhichiscontainedinthefirstdocumentofthesetandidentifiedbythefourdigitsetnumberThegenericstandardissupplementedbyoneormanysectionaldocumentseachofwhichprovidespecificfocusononeaspectofthetopicorthetechnologyselectedTheuserneeds,asaminimum,thegenericdesigndocument,thesectionalofthechosentechnology,andtheengineeringdescriptionofthefinalproductAstechnologychangesspecificfocusstandardswillbeupdated,ornewfocusstandardsaddedtothedocumentsetTheIPCinvitesinputontheeffectivenessofthedocumentationandencouragesuserresponsethroughcompletionoflsquolsquoSuggestionsforImprovementrsquorsquoformslocatedattheendofeachdocumentHIERARCHYOFIPCDESIGNSPECIFICATIONS(SERIES)IPCRIGIDIPCFLEXIPCPCMCIAIPCMCMLIPCHDISIPCGENERICDESIGNCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=DefenseContractMgmtCommandNotforResale,::MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS`,,``,,`,,`,`,,``,,`,``,``,``,,`,,`,`,,`标准分享网wwwbzfxwcom免费下载wwwbzfxwcomAcknowledgmentAnydocumentinvolvingacomplextechnologydrawsmaterialfromavastnumberofsourcesWhiletheprincipalmembersoftheIPCTaskGroup(Db)oftheRigidPrintedBoardCommittee(D)areshownbelow,itisnotpossibletoincludeallofthosewhoassistedintheevolutionofthisStandardToeachofthem,themembersoftheIPCextendtheirgratitudeRigidPrintedBoardCommitteeIPCTaskGroupTechnicalLiaisonoftheIPCBoardofDirectorsChairCDonDupriestLockheedMartinMissilesandFireControlChairLionelFullwoodWKKDistributionLtdNileshSNaikEagleCircuitsIncIPCTaskGroupLanceAAuer,TycoPrintedCircuitGroupStephenBakke,CID,AlliantTechsystemsIncFrankBelisle,HamiltonSundstrandMarkBentlage,IBMCorporationRobertJBlack,NorthropGrummanCorporationGeraldLeslieBogert,BechtelPlantMachinery,IncJohnLBourque,CID,ShureIncScottABowles,SovereignCircuitsIncRonaldJBrock,NSWCCraneMarkBuechnerLewisBurnett,HoneywellIncByronCase,LCommunicationsIgnatiusChong,CelesticaInternationalIncChristineRCoapman,DelphiDelcoElectronicsSystemsChristopherConklin,LockheedMartinCorporationDavidJCorbett,DefenseSupplyCenterColumbusBrianCrowley,HewlettPackardCompanyWilliamCDieffenbacher,BAESystemsControlsGerhardDiehl,AlcatelSELAGCDonDupriest,LockheedMartinMissilesandFireControlJohnDusl,LockheedMartinTheodoreEdwards,DynacoCorpWernerEngelmaier,EngelmaierAssociates,LCGaryMFerrari,CID,FerrariTechnicalServicesGeorgeFranck,CID,RaytheonESystemsMahendraSGandhi,NorthropGrummanHueTGreen,LockheedMartinSpaceandStrategicMissilesKenGreene,SiemensEnergyAutomationMichaelRGreen,LockheedMartinSpaceandStrategicMissilesDrSamyHanna,ATSAustriaTechnologieSystemRichardPHartley,CID,HartleyEnterprisesWilliamHazen,RaytheonCompanyPhillipEHinton,HintonrsquoPWBrsquoEngineeringMichaelJouppi,ThermalMan,IncThomasEKempRockwellCollinsFrankNKimmey,CID,PowerWaveTechnologies,IncNarinderKumar,CID,SolectronInvotronicsCliffordHLamson,CID,PlexusTechnologyGroupRogerHLandolt,CooksonElectronicsMichaelGLuke,CID,RaytheonCompanyWesleyRMalewicz,SiemensMedicalSystemsIncKennethManning,RaytheonCompanySusanSMansilla,RobisanLaboratoryIncReneRMartinez,NorthropGrummanBrianCMcCrory,DelsenTestingLaboratoriesRandyMcNutt,NorthropGrummanJohnHMorton,CID,LockheedMartinCorporationBobNeves,MicrotekLaboratoriesBennyNilsson,EricssonABStevenMNolan,CID,SiliconGraphicsComputerSystemRandyRReed,MerixCorporationKellyMSchriver,SchriverConsultantsJeffSeekatz,RaytheonCompanyKennethCSelk,NorthropGrummanRussellSShepherd,MicrotekLaboratoriesLowellSherman,DefenseSupplyCenterColumbusAkikazuShibata,PhD,JPCAJapanPrintedCircuitAssociationJeffShubrooks,RaytheonCompanyMarkSnow,BAESystemsRogerSu,LCommunicationsRonaldEThompson,NSWCCraneMaxEThorson,CID,HewlettPackardCompanyDungQTiet,LockheedMartinSpaceandStrategicMissilesDeweyWhittaker,HoneywellIncDavidLWolf,ConductorAnalysisTechnology,IncJamesVYohe,CID,YoheDesignServicesMayIPCAiiiCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=DefenseContractMgmtCommandNotforResale,::MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS`,,``,,`,,`,`,,``,,`,``,``,``,,`,,`,`,,`wwwbzfxwcomTableofContentsSCOPEPurposeDocumentationHierarchyPresentationInterpretationDefinitionofTermsClassificationofProductsBoardTypePerformanceClassesProducibilityLevelRevisionLevelChangesAPPLICABLEDOCUMENTSIPCJointIndustryStandardsSocietyofAutomotiveEngineersAmericanSocietyforTestingandMaterialsUnderwritersLabsIEEEANSIGENERALREQUIREMENTSInformationHierarchyOrderofPrecedenceDesignLayoutEndProductRequirementsDensityEvaluationSchematicLogicDiagramPartsListTestRequirementConsiderationsPrintedBoardAssemblyTestabilityBoundaryScanTestingFunctionalTestConcernforPrintedBoardAssembliesInCircuitTestConcernsforPrintedBoardAssembliesMechanicalElectricalLayoutEvaluationBoardLayoutDesignFeasibilityDensityEvaluationPerformanceRequirementsMATERIALSMaterialSelectionMaterialSelectionforStructuralStrengthMaterialSelectionforElectricalPropertiesMaterialSelectionforEnvironmentalPropertiesDielectricBaseMaterials(IncludingPrepregsandAdhesives)PreimpregnatedBondingLayer(Prepreg)AdhesivesAdhesiveFilmsorSheetsElectricallyConductiveAdhesivesThermallyConductiveElectricallyInsulatingAdhesivesLaminateMaterialsColorPigmentationDielectricThicknessSpacingConductiveMaterialsElectrolessCopperPlatingSemiconductiveCoatingsElectrolyticCopperPlatingGoldPlatingNickelPlatingTinLeadPlatingSolderCoatingOtherMetallicCoatingsforEdgeboardContactsMetallicFoilFilmElectronicComponentMaterialsOrganicProtectiveCoatingsSolderResist(SolderMask)CoatingsConformalCoatingsTarnishProtectiveCoatingsMarkingandLegendsESDConsiderationsMECHANICALPHYSICALPROPERTIESFabricationConsiderationsBareBoardFabricationProductBoardConfigurationBoardTypeBoardSizeBoardGeometries(SizeandShape)BowandTwistStructuralStrengthComposite(ConstrainingCore)BoardsVibrationDesignIPCAMayivCopyrightAssociationConnectingElectronicsIndustriesProvidedbyIHSunderlicensewithIPCLicensee=DefenseContractMgmtCommandNotforResale,::MDTNoreproductionornetworkingpermittedwithoutlicensefromIHS`,,``,,`,,`,`,,``,,`,``,``,``,,`,,`,`,,`标准分享网wwwbzfxwcom免费下载wwwbzfxwcomAssemblyRequirementsMechanicalHardwareAttachmentPartSupportAssemblyandTestDimensioningSystemsDimensionsandTolerancesComponentandFeatureLocationDatumFeaturesELECTRICALPROPERTIESElectricalConsiderationsElectricalPerformancePowerDistributionConsiderationsCircuitTypeConsiderationsConductiveMaterialRequirementsElectricalClearanceBndashInternalConductorsBndashExternalConductors,Uncoated,SeaLeveltom,feetBndashExternalConductors,Uncoated,Overm,feetBndashExternalConductors,withPermanentPolymerCoating(AnyElevation)AndashExternalConductors,withConformalCoatingOverAssembly(AnyElevation)AndashExternalComponentLeadTermination,Uncoated,SeaLeveltom,feetAndashExternalComponentLeadTermination,withConformalCoating(AnyElevation)ImpedanceControlsMicrostripEmbeddedMicrostripStriplinePropertiesAsymmetricStriplinePropertiesCapacitanceConsiderationsInductanceConsiderationsTHERMALMANAGEMENTCoolingMechanismsConductionRadiationConvectionAltitudeEffectsHeatDissipationConsiderationsIndividualComponentHeatDissipationThermalManagementConsiderationsforBoardHeatsinksAssemblyofHeatsinkstoBoardsSpecialDesignConsiderationsforSMTBoardHeatsinksHeatTransferTechniquesCoefficientofThermalExpansion(CTE)CharacteristicsThermalTransferThermalMatchingThermalDesignReliabilityCOMPONENTANDASSEMBLYISSUESGeneralPlacementRequirementsAutomaticAssemblyComponentPlacementOrientationAccessibilityDesignEnvelopeComponentBodyCentering

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