电子元器件高速连续电镀设备及工艺介绍（Introduction of high speed continuous electroplating equipment and process for electronic components）

电子元器件高速连续电镀设备及工艺介绍（Introduction of high speed continuous electroplating equipment and process for electronic components） 电子元器件高速连续电镀设备及工艺介绍(Introduction of high speed continuous electroplating equipment and process for electronic components) Introduction of high speed continuous electroplating equipment and process for electronic components With the rapid development of information technology, in recent years, the demand for electronic components has increased rapidly, and most of the components need to be treated by electroplating. From the development of international electronic products, mainly in Japan and Europe and the United States in 70s, mainly the production of electronic components shifted to Singapore, Taiwan, Hongkong and other regions; however, after entering in 90s, the development focus gradually shifted to the mainland Chinese, large quantities of foreign factories in Chinese. They have brought us markets, but they have also introduced many Advanced production equipment and process. Therefore, the production process of electronic components electroplating in China has rapidly moved closer to the international advanced technology level in recent years, and the most prominent is the production of high-speed continuous electroplating automatic production line. In this paper, the characteristics, types and electroplating process conditions of high speed continuous electroplating line are briefly introduced from the view of electroplating demand of electronic components. Characteristics and requirements of 2 electronic components electroplating 2.1 plating parts are small in size and large in batch size. Low cost and high efficiency electroplating production is required. 2.2 high coating requirements 2.2.1 electroplating components are generally functional coatings, with special weldability, conductivity and other requirements, the main plating types are: Ag, Au, Sn / Pb, Ni, etc.. 2.2.2 many components have strict requirements for their electroplating position, requiring local electroplating. Such as SOT-23 semiconductor plastic lead frame, which requires the width of the local silver plating is 1.1 + 0.1mm. 2.2.3 some components require different plating on different positions of the same part. For example, one end of the connector needs to be plated gold, and the other end is tinned lead; some semiconductor lead frames are partly plated with nickel and partly plated silver. High speed continuous automatic line is used in electroplating of 2.2.4 electronic components to meet the above requirements. Characteristics of 3 high speed continuous electroplating automatic line 3.1 fast plating speed, high efficiency High speed plating bath can be used in high current density electroplating, such as high-speed silver plating, generally controlled at 60-100ASD, the highest can reach 300ASD. The plating speed of plating line can reach 7 - 8m / min, even for some products It can reach 20m / min. 3.2 high degree of automation, stable product quality Due to the high degree of automation, greatly improving the production efficiency, and greatly reduce the impact of human factors on the quality of products, can be 24h continuous production, such as Ningbo Kangqiang Electronics Co., more than 10 automatic electroplating line at present, while worker only about 15 people per class. 3.3 is suitable for various electroplating area control requirements, both full plating, also can be partial plating. 3.4 accord with environmental protection control requirements 3.4.1 wastewater is less: a large number of countercurrent rinsing technology, small amount of waste water, and even can reach zero emissions. 3.4.2 field environment control, complete seal, exhaust gas extraction workshop outside processing, workshop generally no run, drop, drop, leakage phenomenon. Introduction of 4 high speed continuous electroplating equipment At present there are more than 100 kinds of continuous electroplating automatic production line for most semiconductor package lead frame plating and electroplating connector, following only my understanding, some simple introduction: The basic structure of 4.1 continuous electroplating equipment 4.1.1 continuous automatic electroplating equipment is generally composed of two parts, namely the transmission device and electroplating bath system. 4.1.2 bath system generally adopts the composite groove structure: the groove potion by pumping to the tank, tank is on: Complete: electroplating, cleaning the factory - order, and then from the bath tank back into the groove. So again and again, to ensure electricity Continuous plating process. 4.1.3 according to the different requirements of the workpiece, in the sub groove in the use of various types of plating position (area) control mechanism, so it derived from all types of continuous electroplating equipment. Type of 4.2 high speed continuous electroplating equipment According to the type of workpiece can be divided into "roll to roll" type and "piece to piece" type, according to the different plating position control method, can be divided into immersion, wheel plating, plate type spray and other types. Four 2.1 roll to roll continuous full immersion production line This is a continuous electroplating production line in the most simple, the most basic, only the plating liquid from the tank is pumped to the mother sub slot, let the workpiece continuous after Michiko trough (D in the sub tank is full of bath, washing, drying and finally submerged), got continuous plating finished product. This kind of plating is widely used for silver plating, nickel plating, tin lead, copper wire gilding, silver plating, semiconductor lead frame full silver plating, full nickel plating and connector lead tin lead. 4.2.2 roll to roll continuous partial immersion plating production line The basic principle of this kind of equipment is similar to that of the front immersion plating line, but some processes adopt liquid level control method for partial electroplating (the upper part is not plated), This equipment is usually used for plating partial silver plating and partial nickel plating on the lead frame of the semiconductor, and also for the gold plating at one end of the connector and tin lead at one end. 4.2.3 roll to roll continuous wheel plating (spray plating) automatic line The plating line is single plating products to meet the local design, a surface - piece affixed to the plating on the wheel, the other side is a mask belt pressing down, moving the workpiece rotate synchronously with spraying wheel, and the plating solution is injected into the pump from a particular direction is not pressed on the surface of the workpiece so, this part of the surface is plated on the required coating, and hidden membrane and spray part is basically not pressed round plating. This equipment is widely used in IC, SOT plastic lead frame of the local nickel plating, also used for connectors of partial gold plating. 4.2.4 coil to roll pressing plate plating automatic line The electroplating line is a combination of intermittent spraying and continuous strip plating, and there is a buffer device between the front and rear sides of the plate spraying unit, so that the production of the whole electroplating line is still uninterrupted. The basic principle of the partial plating is: a piece of workpiece is sent into the plate with a length of about 80cm and sprayed in the mold, and then the workpiece is pressed by the upper and lower platen, and the liquid pump is started, and the plating solution is sprayed to the worker at high speed The surface of the workpiece (in electroplating area on the template openings), about more than 10 seconds after the workpiece reaches the required thickness, then the pump stops, loose forward mode, good plating workpiece, a workpiece into the spray mold at the same time, and then repeat the previous process, so the cycle, to achieve the purpose of local side plating products. This device is most commonly used in the IC plastic lead frame of the local silver plating. 4.2.5 chip local spraying automatic line All of the above mentioned are roll type continuous plating. But some of the electronic components are chip. If the IC frame with multi legs is easy to be deformed by roll plating, it is usually made by first punching and then partly plated with silver. The basic principle of the electroplating is similar to the plate type spray plating, but the transmission mechanism is different. The device has twelve channels and can be plated with twelve different 1C frames at the same time. 4.2.6 slice Z inch continuous full immersion automatic production line The plating principle of this kind of wire is similar to that of coil to roll type full immersion plating, but only different delivery devices. This kind of equipment is generally ring shaped, which is used for high speed tin plating lead of IC plastic frame, and has automatic upper film and automatic film collecting device, which is suitable for use in the condition of high consistency of plating. The company uses this principle Kangqiang made a hand under the framework of continuous full chip nickel plating production line, product quality and yield of plating has been greatly improved than the original hand hanging. Process conditions of 5 high speed continuous electroplating automatic line 5.1 process flow Different products have different requirements on the coating, the process layout is also different, but the basic process is consistent, all need to go through oil, activation, electroplating, cleaning, drying and other processes, the following illustration. Electroplating process flow of 5.1.1IC plastic lead frame On material, electrolytic degreasing, water washing, acid activation, water washing, water washing, pre plating a prepreg (silver plated), water washing, water washing, recycling, and partial silver plating silver, back washing, anti discoloration agent, water washing, high pure water washing, hair - baking material. Electroplating process flow of 5.1.2 connector The process includes feeding, electrolysis, degreasing, washing, acid activation, washing, nickel plating, washing, partial gold plating, washing, activation, tin plating, washing, neutralization, washing, rinsing, blowing, drying and cutting. 5.2 current domestic high-speed electroplating process conditions High speed electroplating liquid is mainly provided by foreign suppliers, but it is basically available in China. The following are some commonly used high-speed plating process conditions. 5.2.1 high speed silver plating Major suppliers: Silverjet220 (SE) of SHIPLEY company K980 of ENGELHARD-CLAL company SilvrexJS-5 of OMI company The bath composition and operating conditions were (Silverjet220 (SE)): Ag 50 ~ 100g / L KCN (free) 0.5 ~ 3G / L PH 9 - 9.5 T 60 - 70 C Dk 50 ~ 200A/dm2 5.2.2 gold plating Major suppliers: ENGOLD2010C (HS) of ENGELHARD-CLAL company Auronal GC of SHIPLEY company The bath composition and operating conditions are (ENGOLD2010C (HS)): A, l 6-10g / L Co 0.7 - 1.1 g / L PH 4.2 ~ 4.9 T 30-60 C Dk 1-6A / DM2 5.2.3 Tin Lead A. bright Sn Pb (90 / 10) plating bath Major suppliers: SHIPLEY's SolderonBHT-90 CN-494BR-21 of ENGELHARD-CLAL company SLOTOLETGB40 of Schloetter company 1SHIHARA company FH - 50 STANNOSTARHMB of OMI company The bath composition and operating conditions were (SolderonBHT-90): Sn 45-80g / L Pb Soldeton HC acid 165-235m1/L T 20-40 C Dk 5 - 25M/dm2 B. Sn Pb (90 / 10) plating bath Major suppliers: Solderon SC of SHIPLEY company KB30 of Schlotter company MH-1K of ISHZHARA company The composition and operating conditions of nickel solution were (Solderon SC): Sn 50 ~ 70g / L Pb 5 ~ 7g / L. Soldern HC acid 165 ~ 235ml / L T 20-60 C Dk 15-30A/dm2 6 Summary 6.1 in recent years, the domestic electronic components industry has developed rapidly. It is expected to become the largest production base of electronic components in the world. Therefore, the market for high speed continuous electroplating line domestic demand will gradually increase, but so far there is no domestic electroplating equipment factory to develop and produce the equipment, basically by electroplating production enterprises themselves based on the introduction of foreign equipment, the digestion and absorption, and imitation. Therefore, it is necessary for domestic electroplating equipment manufacturers to strengthen development investment in this regard. The 6.2 agents and additives used in the high speed electroplating enterprises basically rely on imports, domestic products there is a big gap, but the price difference is large, the development of high performance high speed electroplating products should have great market potential - 6.3 high speed electroplating of electronic components is a relatively new technology in China. It is necessary to strengthen technical exchanges between domestic counterparts to improve the level of electronic plating technology in china. I know some more than 6.4 of the electronic components of the high speed continuous plating, because I understand things and limited this right when something has many deficiencies in the paper, please peer experts.