IPC目录大全

IPC目录大全 IPC目录大全 一、设 计（Design）部分 IPC-M-106 Technology Reference for Design Manual 设计技术手册 IPC-2220 Design Standard Series 设计 标准 excel标准偏差excel标准偏差函数exl标准差函数国标检验抽样标准表免费下载红头文件格式标准下载 系列手册 IPC-2221A Generic Standard on Printed Board Design 印制板设计通用标准 IPC-2222 Sectional Standard on Rigid Organic Printed Boards刚性有机印制板设计分标准 IPC-2223 Sectional Design Standard for Flexible Printed Boards挠性印制板设计分标准 IPC-2224 Sectional Standard of Design of PWB for PC Card PC卡用印制电路板分设计分标准 IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies 有机多芯片模块(MCM-L)及其组装件设计分标准 IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards高密度互连(HDI)印制板设计分标准 IPC-SM-782A Surface Mount Design and Land Pattern Standard--Includes Amendments 1 & 2 表面安装设计及连接盘图形标准(包括修订1和2) IPC-EM-782 Surface Mount Design & Land Pattern Standard Spreadsheet表面安装设计及连接盘图形标准 IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits厚膜多层混合电路设计标准 IPC-1902 IPC/IEC Grid Systems for Printed Circuits IPC/IEC印制电路网格体系 SMC-WP-004 Design for Success 成功的综合设计 分析 定性数据统计分析pdf销售业绩分析模板建筑结构震害分析销售进度分析表京东商城竞争战略分析 手册 IPC-PWB-EVAL-CH Printed Circuit Board Defect Evaluation Chart 印制板缺陷评估图册 IPC/JPCA-2315 Design Guide for High Density Interconnects & Microvias高密度互连(HDI)和微通孔设计指南 IPC-2615 Printed Board Dimensions and Tolerances 印制板尺寸和公差 IPC-A-311 Process Controls for Phototool Generation and Use照相版制作和使用的过程控制 IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 高可靠表面安装印制板组装件技术设计导则 IPC-D-310C Guidelines for Phototool Generation and Measurement Techniques照相版制作指南和测量技术 IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes使用标准在制板尺寸的印制板尺寸选择指南 IPC-D-422 Design Guide for Press Fit Rigid Printed Board Back Plane压配合刚性印制背板设计指南 IPC-PWBADV-SG02 (HARD COPY) IPC-PWB ADV-CD (CD) PCB Advanced Designer Certification Study Guide印制电路板高级设计师证书学习指南和多媒体光盘 IPC-PWB-CRT-SG01 (HARD COPY) IPC-PWB-CERTCD1 (CD) PCB Designer Certification Study Guide 印制电路板设计师证书学习指南和多媒体光盘 IPC-2531 Standard Recipe File Format SpecificationSMEMA发布： 标准“菜单”（过程控制）文件格式 规范 编程规范下载gsp规范下载钢格栅规范下载警徽规范下载建设厅规范下载 注：SMEMA{The Surface Mount Equipment Manufacturers Association merged with IPC} IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication电子制造车间现场设备信息沟通(CAMX)通用要求 IPC-2546 Sectional Requirements for Specific Printed Circuit Board Assembly Equipment特殊印制板组装设备分要求 IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 车间现场电子检验及测试设备信息沟通分要求 IPC-2571 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX) 电子制造供应链信息沟通分要求 产品数据交换 IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Data eXchange 制成态产品-产品数据电子制造供应链信息沟通分要求 IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data-Product Data eXchange 材料单及产品设计构造数据-产品数据交换供应链信息沟通分要求 IPC-2511A Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer Methodology 实施产品制造数据描述及其传输方法学的通用要求 IPC-2501 Definition for Web-Based Exchange of XML Data XML数据网络交换定义 IPC-2511B Generic Requirements for Implementation of Product Manufacturing Description Data & Transfer XML Schema Methodology实施产品制造数据描述及其网络传输方法学的通用要求 IPC-2512A Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 实施制造数据描述管理方法的分要求 IPC-2513A Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 实施制造数据描述绘制方法的分要求 IPC-2514A Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 实施印制板制造数据描述的分要求 IPC-2515A Sectional Requirements for Implementation of Bare-Board Product Testing Data Description 实施裸板成品测试数据描述的分要求 IPC-2516A Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 实施已组装板制造数据描述的分要求 IPC-2517A Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description 实施组装件在线测试数据描述的分要求 IPC-2518A Sectional Requirements for Implementation of Parts List Product Manufacturing Data Description 实施零部件制造数据描述的分要求 IPC-D-356B Bare Board Electrical Test Data Format 裸基板电检测的数据格式 二、印 制 电 路 板（Printed Circuit Boards） IPC-M-105 Rigid Printed Board Manual 刚性印制板设计手册 IPC-D-325A Documentation Requirements for Printed Boards 印制板设计文件图册要求 IPC-PE-740A Troubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除 IPC-6010 Series IPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册 IPC-6011 Generic Performance Specification for Printed Boards 印制板通用性能规范 IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1) 挠性印制板的鉴定与性能规范（包括修改单1） IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1 刚性印制板的鉴定与性能规范 (包括修改单1) IPC-6018A Microwave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范 IPC-A-600F Acceptability of Printed Boards 印制板验收条件 IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量 评价 LEC评价法下载LEC评价法下载评价量规免费下载学院评价表文档下载学院评价表文档下载 IPC-QE-605A-KIT Hard Copy and CD 印制板质量评价书和光盘(CD) IPC-HM-860 Specification for Multilayer Hybrid Circuits多层混合电路规范 IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能 IPC-ML-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范 IPC-TR-481 Results of Multilayer Tests Program Round Robin多层印制板联合试验计划结果 IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价 IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验 IPC-4552 Specification for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范 IPC-DR-572 Drilling Guidelines for Printed Boards 印制板钻孔导则 IT-95080 Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工 方案 气瓶 现场处置方案 .pdf气瓶 现场处置方案 .doc见习基地管理方案.doc关于群访事件的化解方案建筑工地扬尘治理专项方案下载 的改进和优选手册 IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers钻床和铣床用计算机数字控制格式 IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则 IPC-HDI-1 High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要 IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials高密度互连(HDI)及微导通孔材料规范 IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范 IPC/JPCA-6801 IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例 IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验 IT-96060 High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔评价指标手册, 第一期第一版 IT-97071 High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔评价指标手册, 第一期第二版 IT-30101 High Density PCB Microvia Evaluation, Phase I, Round 3高密度印制板微通孔评价指标手册, 第一期第三版 IT-98123 Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告 IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计 IPC-2252 Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南 IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范 IPC-6018A Microwave End Product Board Inspection and Test 微波成品印制板的检验和测试 IPC-D-317A Design Guidelines for Electronic Packaging Utilizing High Speed Techniques采用高速技术电子封装设计导则 IPC-M-102 Flexible Circuits Compendium 挠性电路纲要 IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry挠性印制线路用挠性绝缘基底材料 IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆盖层用涂粘接剂绝缘薄膜 IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装 IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards & Amendment 1 挠性印制板的鉴定与性能规范（包括修改单1） IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA单双面挠性印制板性能手册 IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits单面和双面挠性电路组装导则 IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范 IPC-MB-380 Guidelines for Molded Interconnection Devices 模压互连器件导则 IPC-M-107 Standards for Printed Board Materials Manual 印制板材料标准手册 IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册 IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范 IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则 IPC-4562 Metal Foil for Printed Wiring Applications 印制线路用金属箔 IPC-CF-148A Resin Coated Metal for Printed Boards 印制板用涂树脂金属箔 IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范 IPC-TR-482 New Developments in Thin Copper Foils 薄铜箔的新发展 IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin StudyIPC铜箔延展性联合研究结果 IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study铜箔断裂强度试验联合研究结果 IPC-4412 Specification for Finished Fabric Woven from ”E” Glass for Printed Boards“E”类精纺玻璃纤维层印制板技术规范 IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass MaterialsE 玻璃纤维非织布材料规范及性能确定方法 IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纤维纸规范及性能确定方法 IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1 聚芳基酰胺非织布规范及性能确定方法, 包括修改单 1 IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1 关于聚芳基酰胺非织布规范及性能确定方法的修改单 1 IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards印制板用经处理S玻璃纤维织物规范 IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范 IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范 IPC-2524 PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系 IPC-9151A Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺, 容量, 质量,可靠性试验标准和数据库 IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则 IPC-9199 Statistical Process Control (SPC) Quality Rating 统计分析控制 IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南 IT-97061 PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性 IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性 IPC-MS-810 Guidelines for High Volume Microsection 大批量显微剖切导则 IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证 IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试----国际联合试验计划I阶段及II阶段报告 IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究 三、电 子 组 装（Assembly） IPC-T-50F Terms and Definition for Interconnecting and Packaging Electronic Circuits电子电路互连与封装的定义和术语 IPC-S-100 Standards and Specifications Manual标准和详细说明汇编手册 IPC-E-500 IPC Electronic Document Collection已出版的IPC标准电子文档资料合订本 IPC-TM-650 Test Methods Manual试验方法手册 IPC-ESD-20-20 Association Standard for the Development of an ESD Control Program静电释放控制过程(由静电释放协会制定) IPC/EIA J-STD-001C Requirements for Soldered Electrical & Electronic Assemblies电气与电子组装件锡焊要求 IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001—Includes Amendment 1J-STD-001辅助手册及指南及修改说明1 IPC-A-610C Acceptability of Electronic Assemblies印制板组装件验收条件 IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C ComparisonIPC-610手册和指南(包括IPC-A-610B和C的对比) IPC-EA-100-K Electronic Assembly Reference Set电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。 IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies电缆和引线贴装的要求和验收 IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale Technology倒装芯片及芯片级封装技术的应用 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation芯片直装技术实施导则 IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip Applications倒装芯片用半导体设计标准 J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size ConfigurationsFC（倒装片）和CSP(芯片级封装)的外形轮廓标准 IPC/EIA J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准 SMC-WP-003 Chip Mounting Technology 芯片贴装技术 J-STD-013 Implementation of Ball Grid Array and Other High Density Technology球栅阵列 (BGA)及其它高密度封装技术的应用 IPC-7095 Design and Assembly Process Implementation for BGAs球栅阵列的设计与组装过程的实施 IPC/EIA J-STD-032 Performance Standard for Ball Grid Array BallsBGA球形凸点的标准规范 IT-98000 JPL Chip Scale Packaging GuidelinesJPL 发布的CSP导则注： IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory) IT-98080 JPL Ball Grid Array Packaging GuidelinesJPL 发布的BGA封装导则 IT-98093 ITRI Chip Carrier, Phase 1 ReportITRI 关于芯片载体的报告ITRI (The Interconnect Technology Research Institute) IPC-MC-790 Guidelines for Multichip Module Technology Utilization多芯片组件技术应用导则 IPC-M-108 Cleaning Guides and Handbook Manual 清洗导则和手册 IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What Does It Tell Us?电路板离子洁净度测量：它告诉我们什么？ IPC-CH-65A Guidelines for Cleaning of Printed Boards & Assemblies印制板及组装件清洗导则 IPC-SC-60A Post Solder Solvent Cleaning Handbook 锡焊后溶剂清洗手册 IPC-SA-61 Post Solder Semi-aqueous Cleaning Handbook 锡焊后半水溶剂清洗手册 IPC-AC-62A Aqueous Post Solder Cleaning Handbook 锡焊后水溶液清洗手册 IPC-TR-476A Electrochemical Migration: Electrically Induced Failures in Printed Circuit Assemblies 电化学迁移：印制电路组件的电气诱发故障 IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results清洗及清洁度试验计划1阶段试验结果 IPC-TR-582 Cleaning and Cleanliness Test Program for: Phase 3 --Low Solids, Fluxes and Pastes Processed in Ambient Air IPC第3阶段非清洗助焊剂研究 IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing 深入离子洁净度测试 IPC-9201 Surface Insulation Resistance Handbook 表面绝缘电阻手册 IPC-TP-104K Cleaning & Cleanliness Test Program, Phase 3 Water Soluble Fluxes,Part 1 & Part 2第3阶段水溶性助焊剂清洗，第一和第二部分 IPC-M-109 Component Handling Manual 元件处理手册 IPC/JEDEC J-STD-020B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 非密封固态表面贴装器件湿度／再流焊敏感度分类 IPC/JEDEC J-STD-033A Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 对湿度、再流焊敏感表面贴装器件的处置、包装、发运和使用 IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非气密封装电子元件用声波显微镜 IPC-9500-K Set of four documents 9501-9504 9501至9504手册合订本 IPC-DRM-18F Component Identification Desk Reference Manual 零件分类标识手册 IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 IPC-DRM-40E Through-Hole Solder Joint Evaluation Desk Reference Manual接插件焊接点评价手册 IPC-DRM-56 Wire Preparation & Crimping Desk Reference Manual导线和端子预成形参考手册 IPC-DRM-53 Introduction to Electronics Assembly Desk Reference Manual电子组装基础介绍手册 IPC-M-103 Standards for Surface Mount Assemblies Manual 所有SMT标准合订本 IPC-M-104 Standards for Printed Board Assembly Manual 10种常用印制板组装标准合订本 IPC-TA-722 Technology Assessment of Soldering 锡焊技术精选手册 IPC-TA-723 Technology Assessment Handbook on Surface Mounting表面安装技术精选手册 IPC-TA-724 Technology Assessment Series on Clean Rooms 清洁室技术精选系列 IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting以表面安装为主的元件封装及互连导则 IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments表面安装焊接件加速可靠性试验导则 IPC-PD-335 Electronic Packaging Handbook 电子封装手册 IPC-7525 Stencil Design Guidelines 网版设计导则 IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC第3阶段受控气氛焊接研究 IPC-MI-660 Incoming Inspection of Raw Materials Manual 原材料接收检验手册 IPC/EIA J-STD-004 Requirements for Soldering Fluxes-Includes Amendment 1锡焊焊剂要求（包括修改单1） IPC/EIA J-STD-005 Requirements for Soldering Pastes-Includes Amendment 1焊膏技术要求（包括修改单1） IPC-HDBK-005 Guide to Solder Paste Assessment 焊膏性能评价手册 IPC/EIA J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级锡焊合金、带焊剂及不带剂整体焊料技术要求 IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives表面安装用介电粘接剂通用要求 IPC-CA-821 General Requirements for Thermally Conductive Adhesives导热胶粘剂通用要求 IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives表面贴装导电胶使用指南 IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films各向异性导电胶膜的一般要求 IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies 印制板组装电气绝缘性能和质量手册 IPC-HDBK-830 Guideline for Design, Selection and Application of Conformal Coatings敷形涂层的设计，选择和应用手册 IPC-SM-840C Qualification and Performance of Permanent Solder Mask - Includes Amendment 1永久性阻焊剂的鉴定及性能(包括修改单1) IPC-HDBK-840 Guide to Solder Paste Assessment 焊膏性能评价手册 IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001基于J-STD-001组装工艺雷氏选择法 IPC-TR-467 Supporting Data & Numerical Examples for J-STD-001 (Control of Fluxes) J-STD-001(焊剂控制)的支持数据及数字实例 IPC-AJ-820 Assembly & Joining Handbook 装联手册 IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes 大规模焊接(回流焊与波峰焊)过程温度曲线指南 IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments 表面安装锡焊件性能试验方法与鉴定要求 IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes 新型助焊剂雷氏选择法 IPC-TP-1115 Selection and Implementation Strategy for a Low-Residue No-Clean Process 低残留不清洗工艺的选择和实施 IPC-S-816 SMT Process Guideline & Checklist 表面安装技术过程导则及检核表 IPC-TR-460A Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表 IPC-CM-770D Component Mounting Guidelines for Printed Boards印制板元件安装导则 IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies印制板和电子组装件每百万件缺陷数(DPMO)和制造指数的计算 IPC-9261 In-Process DPMO and Estimated Yield for PWAs 印制板组装过程中每百万件缺陷数(DPMO)及合格率估计 IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 电子元件的印制板组装过程模拟评价 IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components电子元件的印制板组装焊接过导则 IPC-9503 Moisture Sensitivity Classification for Non-IC Components非集成电路元件的湿度敏感度分级 IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components) 非集成电路元件的组装过程模拟评价（非集成电路元件预处理） IPC-9850-K Surface Mount Placement Equipment Characterization-KIT表面贴装设备性能检测方法的描述（附Gerber格式CD盘） IPC-9850-TM-KW, IPC-9850-TM-K Test Materials Kit for Surface Mount Placement Equipment Standardization 表面贴装设备性能测试用的标准工具包• IPC-9850 Placement Accuracy Verification Panels• 1 IPC-9850 CMM Measurement Verification Panels• IPC-9850 QFP-100 Glass Components• 130 IPC-9850 QFP-208 Glass Components• 150 IPC-9850 BGA-228 Glass Components• NIST Traceable Measurement Certificate• Custom Storage Case IPC-7711/21 7711 & 7721 Package 合订本 IPC-7711 Rework of Electronic Assemblies 电子组装件的返工 IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies印制板和电子组装件的修复与修正 IPC/EIA J-STD-002B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 元件引线、端子、焊片、接线柱及导线可焊性试验 IPC/EIA J-STD-003 Solderability Tests for Printed Boards 印制板可焊性试验 IPC-TR-461 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards印制板波峰焊故障排除检查表 IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage 带保护性涂层印制板长期贮存的可焊性评价 IPC-TR-464 Accelerated Aging for Solderability Evaluations可焊性加速老化评价(附修订) IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability蒸汽老化器温度控制稳定性联合试验 IPC-TR-465-2 The Effect of Steam Aging Time a