3 nV/√Hz Ultralow Distortion,
High Speed Op Amp
AD8045
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
FEATURES
Ultralow distortion
SFDR
−101 dBc @ 5 MHz
−90 dBc @ 20 MHz
−63 dBc @ 70 MHz
Third-order intercept
43 dBm @ 10 MHz
Low noise
3 nV/√Hz
3 pA/√Hz
High speed
1 GHz, −3 dB bandwidth (G = +1)
1350 V/µs slew rate
7.5 ns settling time to 0.1%
Standard and low distortion pinout
Supply current: 15 mA
Offset voltage: 1.0 mV max
Wide supply voltage range: 3.3 V to 12 V
APPLICATIONS
Instrumentation
IF and baseband amplifiers
Active filters
ADC drivers
DAC buffers
CONNECTION DIAGRAMS
1
2
5
6
7
8NC
FEEDBACK
–IN
+IN
+VS
OUTPUT
NC
–VS
3
4
04
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00
1
Figure 1. 8-Lead AD8045 LFCSP (CP-8)
04
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00
1
1FEEDBACK
2–IN
3+IN
–VS 4
8
+VS
NC
7
OUTPUT
NC
6
5
Figure 2. 8-Lead AD8045 SOIC/EP (RD-8)
GENERAL DESCRIPTION
The AD8045 is a unity gain stable voltage feedback amplifier
with ultralow distortion, low noise, and high slew rate. With a
spurious-free dynamic range of −90 dBc @ 20 MHz, the
AD8045 is an ideal solution in a variety of applications,
including ultrasound, ATE, active filters, and ADC drivers.
ADI’s proprietary next generation XFCB process and innovative
architecture enables such high performance amplifiers.
The AD8045 features a low distortion pinout for the LFCSP,
which improves second harmonic distortion and simplifies the
layout of the circuit board.
The AD8045 has 1 GHz bandwidth, 1350 V/µs slew rate, and
settles to 0.1% in 7.5 ns. With a wide supply voltage range (3.3 V
to 12 V) and low offset voltage (200 µV), the AD8045 is an ideal
candidate for systems that require high dynamic range, preci-
sion, and high speed.
The AD8045 amplifier is available in a 3 mm × 3 mm LFCSP
and the standard 8-lead SOIC. Both packages feature an
exposed paddle that provides a low thermal resistance path to
the PCB. This enables more efficient heat transfer, and increases
reliability. The AD8045 works over the extended industrial
temperature range (−40°C to +125°C).
04
81
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07
9
FREQUENCY (MHz)
1000.1 1 10
H
A
R
M
O
N
IC
D
IS
TO
R
TI
O
N
(d
B
c)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–120
–110
HD3 LFCSP
HD2 LFCSP
G = +1
VS = ±5V
VOUT = 2V p-p
RL = 1kΩ
RS = 100Ω
Figure 3. Harmonic Distortion vs. Frequency for Various Packages
AD8045
Rev. A | Page 2 of 24
TABLE OF CONTENTS
Specifications with ±5 V Supply ..................................................... 3
Specifications with +5 V Supply ..................................................... 4
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
Typical Performance Characteristics ............................................. 7
Circuit Configurations................................................................... 16
Wideband Operation ................................................................. 16
Theory of Operation ...................................................................... 17
Frequency Response................................................................... 17
DC Errors .................................................................................... 17
Output Noise............................................................................... 18
Applications..................................................................................... 19
Low Distortion Pinout............................................................... 19
High Speed ADC Driver ........................................................... 19
90 MHz Active Low-Pass Filter (LPF) ..................................... 20
Printed Circuit Board Layout ....................................................... 22
Signal Routing............................................................................. 22
Power Supply Bypassing ............................................................ 22
Grounding ................................................................................... 22
Exposed Paddle........................................................................... 23
Driving Capacitive Loads.......................................................... 23
Outline Dimensions ....................................................................... 24
Ordering Guide .......................................................................... 24
REVISION HISTORY
9/04—Data Sheet Changed from Rev. 0 to Rev. A
Changes to Features......................................................................... 1
Changes to Specifications ............................................................... 4
Changes to Figure 58.....................................................................15
Changes to Figure 63.....................................................................17
Changes to Frequency Response Section ...................................17
Changes to Figure 64.....................................................................17
Changes to DC Errors Section.....................................................17
Changes to Figure 65.....................................................................17
Changes to Figure 66.....................................................................18
Changes to Output Noise Section ...............................................18
Changes to Ordering Guide .........................................................24
7/04—Revision 0: Initial Version
AD8045
Rev. A | Page 3 of 24
SPECIFICATIONS WITH ±5 V SUPPLY
TA = 25°C, G = +1, RS = 100 Ω, RL = 1 kΩ to ground, unless noted otherwise. Exposed paddle must be floating or connected to −VS.
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Bandwidth G = +1, VOUT = 0.2 V p-p 1000 MHz
G = +1, VOUT = 2 V p-p 300 350
G = +2, VOUT = 0.2 V p-p 320 400 MHz
Bandwidth for 0.1 dB Flatness G = +2, VOUT = 2 V p-p, RL = 150 Ω 55 MHz
Slew Rate G = +1, VOUT = 4 V step 1000 1350 V/µs
Settling Time to 0.1% G = +2, VOUT = 2 V step 7.5 ns
NOISE/HARMONIC PERFORMANCE
Harmonic Distortion (dBc) HD2/HD3 fC = 5 MHz, VOUT = 2 V p-p
LFCSP −102/−101 dBc
SOIC −106/−101 dBc
fC = 20 MHz, VOUT = 2 V p-p
LFCSP −98/−90 dBc
SOIC −97/−90 dBc
fC = 70 MHz, VOUT = 2 V p-p
LFCSP −71/−71 dBc
SOIC −60/−71 dBc
Input Voltage Noise f = 100 kHz 3 nV/√Hz
Input Current Noise f = 100 kHz 3 pA/√Hz
Differential Gain Error NTSC, G = +2, RL = 150 Ω 0.01 %
Differential Phase Error NTSC, G = +2, RL = 150 Ω 0.01 Degrees
DC PERFORMANCE
Input Offset Voltage 0.2 1.0 mV
Input Offset Voltage Drift See Figure 54 8 µV/°C
Input Bias Current 2 6.3 µA
Input Bias Current Drift 8 nA/°C
Input Bias Offset Current 0.2 1.3 µA
Open-Loop Gain VOUT = −3 V to +3 V 62 64 dB
INPUT CHARACTERISTICS
Input Resistance Common-mode/differential 3.6/1.0 MΩ
Input Capacitance Common-mode 1.3 pF
Input Common-Mode Voltage Range ±3.8 V
Common-Mode Rejection VCM = ±1 V −83 −91 dB
OUTPUT CHARACTERISTICS
Output Overdrive Recovery Time VIN = ±3 V, G = +2 8 ns
Output Voltage Swing RL = 1 kΩ −3.8 to +3.8 −3.9 to +3.9 V
RL = 100 Ω −3.4 to +3.5 −3.6 to +3.6 V
Output Current 70 mA
Short-Circuit Current Sinking/sourcing 90/170 mA
Capacitive Load Drive 30% overshoot, G = +2 18 pF
POWER SUPPLY
Operating Range ±1.65 ±5 ±6 V
Quiescent Current 16 19 mA
Positive Power Supply Rejection +VS = +5 V to +6 V, −VS = −5 V −61 −68 dB
Negative Power Supply Rejection +VS = +5 V, −VS = −5 V to −6 V −66 −73 dB
AD8045
Rev. A | Page 4 of 24
SPECIFICATIONS WITH +5 V SUPPLY
TA = 25°C, G = +1, RS = 100 Ω, RL = 1 kΩ to midsupply, unless otherwise noted. Exposed paddle must be floating or connected to −VS.
Table 2.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Bandwidth G = +1, VOUT = 0.2 V p-p 900 MHz
G = +1, VOUT = 2 V p-p 160 200 MHz
G = +2, VOUT = 0.2 V p-p 320 395 MHz
Bandwidth for 0.1 dB Flatness G = +2, VOUT = 2 V p-p, RL = 150 Ω 60 MHz
Slew Rate G = +1, VOUT = 2 V step 480 1060 V/µs
Settling Time to 0.1% G = +2, VOUT = 2 V step 10 ns
NOISE/HARMONIC PERFORMANCE
Harmonic Distortion (dBc) HD2/HD3 fC = 5 MHz, VOUT = 2 V p-p
LFCSP −89/−83 dBc
SOIC −92/−83 dBc
fC = 20 MHz, VOUT = 2 V p-p
LFCSP −81/−70 dBc
SOIC −83/−70 dBc
fC = 70 MHz, VOUT = 2 V p-p
LFCSP −57/−46 dBc
SOIC −57/−46 dBc
Input Voltage Noise f = 100 kHz 3 nV/√Hz
Input Current Noise f = 100 kHz 3 pA/√Hz
Differential Gain Error NTSC, G = +2, RL = 150 Ω 0.01 %
Differential Phase Error NTSC, G = +2, RL = 150 Ω 0.01 Degrees
DC PERFORMANCE
Input Offset Voltage 0.5 1.4 mV
Input Offset Voltage Drift See Figure 54 7 µV/°C
Input Bias Current 2 6.6 µA
Input Bias Current Drift 7 nA/°C
Input Bias Offset Current 0.2 1.3 µA
Open-Loop Gain VOUT = 2 V to 3 V 61 63 dB
INPUT CHARACTERISTICS
Input Resistance Common-mode/differential 3/0.9 MΩ
Input Capacitance Common-mode 1.3 pF
Input Common-Mode Voltage Range 1.2 to 3.8 V
Common-Mode Rejection VCM = 2 V to 3 V −78 −94 dB
OUTPUT CHARACTERISTICS
Output Overdrive Recovery Time VIN = −0.5 V to +3 V, G = +2 10 ns
Output Voltage Swing RL = 1 kΩ 2.2 to 3.7 1.1 to 4.0 V
RL = 100 Ω 2.5 to 3.5 1.2 to 3.8 V
Output Current 55 mA
Short-Circuit Current Sinking/sourcing 70/140 mA
Capacitive Load Drive 30% overshoot, G = +2 15 pF
POWER SUPPLY
Operating Range 3.3 5 12 V
Quiescent Current 15 18 mA
Positive Power Supply Rejection +VS = +5 V to +6 V, −VS = 0 V −65 −67 dB
Negative Power Supply Rejection +VS = +5 V, −VS = 0 V to −1 V −70 −73 dB
AD8045
Rev. A | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 12.6 V
Power Dissipation See Figure 4
Common-Mode Input Voltage −VS − 0.7 V to +VS + 0.7 V
Differential Input Voltage ±VS
Exposed Paddle Voltage −VS
Storage Temperature −65°C to +125°C
Operating Temperature Range −40°C to +125°C
Lead Temperature Range
(Soldering 10 sec)
300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, i.e., θJA is specified
for device soldered in circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type θJA θJC Unit
SOIC 80 30 °C/W
LFCSP 93 35 °C/W
Maximum Power Dissipation
The maximum safe power dissipation for the AD8045 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 150°C, which is the glass transition temperature,
the properties of the plastic change. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric perform-
ance of the AD8045. Exceeding a junction temperature of
175°C for an extended period of time can result in changes in
silicon devices, potentially causing degradation or loss of
functionality.
The power dissipated in the package (PD) is the sum of the qui-
escent power dissipation and the power dissipated in the die
due to the AD8045 drive at the output. The quiescent power is
the voltage between the supply pins (VS) times the quiescent
current (IS).
PD = Quiescent Power + (Total Drive Power – Load Power)
( )
L
2
OUT
L
OUTS
SSD R
V
–
R
V
2
V
IVP ⎟⎟⎠
⎞
⎜⎜⎝
⎛ ×+×=
RMS output voltages should be considered. If RL is referenced to
−VS, as in single-supply operation, the total drive power is VS ×
IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS/4 for RL to midsupply.
( ) ( )
L
S
SSD R
/V
IVP
24+×=
In single-supply operation with RL referenced to −VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
Also, more metal directly in contact with the package leads and
exposed paddle from metal traces, through holes, ground, and
power planes reduce θJA.
Figure 4 shows the maximum safe power dissipation in the
package versus the ambient temperature for the exposed paddle
SOIC (80°C/W) and LFCSP (93°C/W) package on a JEDEC
standard 4-layer board. θJA values are approximations.
04
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08
0
AMBIENT TEMPERATURE (°C)
120–40 –20 0 20 40 60 80 100
M
A
XI
M
U
M
P
O
W
ER
D
IS
SI
PA
TI
O
N
(W
at
ts
)
0.0
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
LFCSP
SOIC
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy elec-
trostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation
and loss of functionality.
AD8045
Rev. A | Page 6 of 24
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
04
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3
FEEDBACK8
–IN7
+IN6
–VS5
NC 1
+VS 2
OUTPUT 3
NC 4
NC = NO CONNECT
AD8045
BOTTOM VIEW
(Not to Scale)
Figure 5. SOIC Pin Configuration
04
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4
BOTTOM
VIEW
(Not to Scale)
8
7
6
5 4
3
2
1 NC
FEEDBACK
–IN
+IN
+VS
OUTPUT
NC
–VS
NC = NO CONNECT
Figure 6 . 8-Lead LFCSP Pin Configuration
Note: The exposed paddle must be connected to −VS or it must be electrically isolated (floating).
Table 5. 8-Lead SOIC Pin Function Descriptions
Pin No. Mnemonic Description
1 FEEDBACK Feedback Pin
2 −IN Inverting Input
3 +IN Noninverting Input
4 −VS Negative Supply
5 NC NC
6 OUTPUT Output
7 +VS Positive Supply
8 NC NC
9 Exposed Paddle Must Be Connected to −VS or
Electrically Isolated
Table 6. 8-Lead LFCSP Pin Function Descriptions
Pin No. Mnemonic Description
1 NC No Connect
2 FEEDBACK Feedback Pin
3 −IN Inverting Input
4 +IN Noninverting Input
5 −VS Negative Supply
6 NC No Connect
7 OUTPUT Output
8 +VS Positive Supply
9 Exposed Paddle Must Be Connected to −VS or
Electrically Isolated
AD8045
Rev. A | Page 7 of 24
TYPICAL PERFORMANCE CHARACTERISTICS
04
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04
9
FREQUENCY (MHz)
10001 10 100
N
O
R
M
A
LI
ZE
D
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
1
0
–1
–2
–3
–4
–5
–6
–7
G = +2
G = –1G = +10
VS = ±5V
RL = 1kΩ
Figure 7. Small Signal Frequency Response for Various Gains
04
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05
0
FREQUENCY (MHz)
100010 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
4
3
2
1
0
–1
–3
–2
–4
–5
–6
G = +1
VS = ±5V
RS = 100Ω
RL = 500Ω
RL = 100Ω
RL = 1kΩ
Figure 8. Small Signal Frequency Response for Various Loads
04
81
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05
1
FREQUENCY (MHz)
100010 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
5
4
3
2
0
1
–2
–1
–3
–4
–5
VS = ±5V
VS = ±2.5V
G = +1
RL = 1kΩ
RS = 100Ω
Figure 9. Small Signal Frequency Response for Various Supplies
04
81
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0-
04
8
FREQUENCY (MHz)
100010 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
12
10
11
8
9
6
7
4
5
2
3
0
1
18pF
5pF
10pF
G = +2
VS = ±5V
RL = 1kΩ
RF = 499Ω
0pF
Figure 10. Small Signal Frequency Response for Various Capacitive Loads
04
81
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05
2
FREQUENCY (MHz)
100010 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
4
2
0
–1
–3
3
1
–2
–4
–5
–6
–40°C
+25°C
+125°C
G = +1
VS = ±5V
RL = 1kΩ
Figure 11. Small Signal Frequency Response for Various Temperatures
04
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03
9
FREQUENCY (MHz)
1 10 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
6.3
6.2
6.1
6.0
5.9
5.8
5.7
VOUT = 2V p-p
VOUT = 200mV p-p
G = +2
VS = ±5V
RF = 499Ω
RL = 150Ω
Figure 12. 0.1 dB Flatness vs. Frequency for Various Output Voltages
AD8045
Rev. A | Page 8 of 24
04
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04
3
FREQUENCY (MHz)
100010 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
2
0
1
–2
–1
–4
–3
–6
–5
–8
–7
–10
–9
G = +1
RL = 1kΩ
RS = 100Ω
VOUT = 2V p-p
VS = ±2.5V
VS = ±5V
Figure 13. Large Signal Frequency Response for Various Supplies
04
81
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0-
04
2
FREQUENCY (MHz)
100010 100
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
2
0
1
–2
–1
–4
–3
–6
–5
–8
–9
–7
–10
G = +1
VS = ±5V
RS = 100Ω
VOUT = 2V p-p
RL = 1kΩ
RL = 100Ω
Figure 14. Large Signal Frequency Response for Various Loads
04
81
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0-
04
1
FREQUENCY (MHz)
10001 10 100
N
O
R
M
A
LI
ZE
D
C
LO
SE
D
-L
O
O
P
G
A
IN
(d
B
)
2
1
0
–1
–2
–3
–4
–5
–6
–7
–8
VS = ±5V
RF = 499Ω
RL = 1kΩ
VOUT = 2V p-p
G = +10 G = –1
G = +2
Figure 15. Large Signal Frequency Response for Various Gains
04
81
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06
4
FREQUENCY (MHz)
10000.01 0.1 1 10 100
O
PE
N
-L
O
O
P
PH
A
SE
(D
eg
re
es
)
–360
0
–90
–135
–180
–45
–225
–270
–315
O
PE
N
-L
O
O
P
G
A
IN
(d
B
)
70
50
60
40
20
30
10
0
–10
VS = ±5V
RL = 1kΩ
Figure 16. Open-Loop Gain and Phase vs. Frequency
04
81
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0-
03
0
FREQUENCY (MHz)
1000.1 1 10
H
A
R
M
O
N
IC
D
IS
TO
R
TI
O
N
(d
B
c)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
HD3 SOIC AND LFCSP
HD2 LFCSP
HD2 SOIC
G = +1
VS = ±5V
VOUT = 2V p-p
RL = 1kΩ
RS = 100Ω
Figure 17. Harmonic Distortion vs. Frequency for Various Packages
04
81
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02
8
FREQUENCY (MHz)
0.1 1 10 100
H
A
R
M
O
N
IC
D
IS
TO
R
TI
O
N
(d
B
c)
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
G = +1
VS = ±5V
VOUT = 4V p-p
RL = 1kΩ
HD3 LFCSP AND SOIC
HD2 LFCSP
HD2 SOIC
Figure 18. Harmonic Distortion vs. Frequency for Various Packages
AD8045
Rev. A | Page 9 of 24
04
81
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03
2
FREQUENCY (MHz)
0.1 1 10 100
H
A
R
M
O
N
IC
D
IS
TO
R
TI
O
N
(d
B
c)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
G = +1
VS = ±5V
VOUT = 2V p-p
RL = 100Ω
RS = 100Ω
HD2 SOIC
HD2 LFCSP
HD3 SOIC AND LFCSP
Figure 19. Harmonic Distortion vs. Frequency for Various Packages
04
81
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03
6
FREQUENCY (MHz)
0.1 1 10 100
H
A
R
M
O
N
IC
D
IS
TO
R
TI
O
N
(d
B
c)
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
G = –1
VS = ±5V
VOUT = 2V p-p
RL = 1kΩ
SOIC AND LFCSP
HD2
HD3
Figure 20. Harmonic Distortion vs. Frequency for Various Packages
04
81
4-
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03
7
FREQUENCY (MHz)
0.1 1 10 100
H
A
R
M
O
N
IC
D
IS
TO
R
TI
O
N
(d
B
c)
–30
–50
–40
–60
–80
–70
–100
–90
–110
G = –1
VS = ±5V
RL = 150Ω
VOUT = 2V p-p
HD3 SOIC AND LFCSP
HD2 SOIC
HD2 LFCSP
Figure 21. Harmonic Distortion vs. Frequency for Various Packages
04
81
4-
0-
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