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ADP160 Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator ADP160/ADP161 Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infr...

ADP160
Ultralow Quiescent Current, 150 mA, CMOS Linear Regulator ADP160/ADP161 Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved. FEATURES Ultralow quiescent current IQ = 560 nA with 0 μA load IQ = 860 nA with 1 μA load Stable with 1 μF ceramic input and output capacitors Maximum output current: 150 mA Input voltage range: 2.2 V to 5.5 V Low shutdown current: <50 nA typical Low dropout voltage: 195 mV @ 150 mA load Initial accuracy: ±1% Accuracy over line, load, and temperature: ±3.5% 15 fixed output voltage options: 1.2 V to 4.2 V Adjustable output available PSRR performance of 72 dB @ 100 Hz Current limit and thermal overload protection Logic-control enable Integrated output discharge resistor 5-lead TSOT package 4-ball, 0.5 mm pitch WLCSP APPLICATIONS Mobile phones Digital cameras and audio devices Portable and battery-powered equipment Post dc-to-dc regulation Portable medical devices TYPICAL APPLICATION CIRCUITS NC = NO CONNECT ADP160 1 2 3 5 4 1µF1µF VOUT = 1.8VVIN = 2.3V VOUT NC VIN GND EN OFF ON 08 62 8- 00 1 Figure 1. 5-Lead TSOT ADP160 with Fixed Output Voltage, 1.8 V 1 2 3 5 4 1µF1µF VOUT = 3.2VVIN = 4.2V VOUT ADJ VIN GND EN OFF ON ADP161 R1 R2 08 62 8- 00 2 Figure 2. 5-Lead TSOT ADP161 with Adjustable Output Voltage, 3.2 V VIN VOUT 1 2 EN GND 1µF1µF VOUT = 2.8VVIN = 3.3V TOP VIEW (Not to Scale) ADP160 A BOFF ON 08 62 8- 00 3 Figure 3. 4-Ball WLCSP ADP160 with Fixed Output Voltage, 2.8 V GENERAL DESCRIPTION The ADP160/ADP161 are ultralow quiescent current, low dropout, linear regulators that operate from 2.2 V to 5.5 V and provide up to 150 mA of output current. The low 195 mV dropout voltage at 150 mA load improves efficiency and allows operation over a wide input voltage range. The ADP160/ADP161 are specifically designed for stable operation with tiny 1 μF ± 30% ceramic input and output capacitors to meet the requirements of high performance, space-constrained applications. The ADP160 is available in 15 fixed output voltage options, ranging from 1.2 V to 4.2 V. The ADP160/ADP161 also include a switched resistor to discharge the output automatically when the LDO is disabled. The ADP161 is available as an adjustable output voltage regulator. It is only available in a 5-lead TSOT package. Short-circuit and thermal overload protection circuits prevent damage in adverse conditions. The ADP160 is available in a tiny 5-lead TSOT and a 4-ball, 0.5 mm pitch WLCSP package for the smallest footprint solution to meet a variety of portable power applications. ADP160/ADP161 Rev. 0 | Page 2 of 20 TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Typical Application Circuits ............................................................ 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Input and Output Capacitor, Recommended Specifications .. 4 Absolute Maximum Ratings ............................................................ 5 Thermal Data ................................................................................ 5 Thermal Resistance ...................................................................... 5 ESD Caution .................................................................................. 5 Pin Configurations and Function Descriptions ........................... 6 Typical Performance Characteristics ..............................................8 Theory of Operation ...................................................................... 12 Applications Information .............................................................. 13 Capacitor Selection .................................................................... 13 Enable Feature ............................................................................ 14 Current Limit and Thermal Overload Protection ................. 14 Thermal Considerations ............................................................ 15 PCB Layout Considerations ...................................................... 17 Outline Dimensions ....................................................................... 19 Ordering Guide .......................................................................... 20 REVISION HISTORY 6/10—Revision 0: Initial Version ADP160/ADP161 Rev. 0 | Page 3 of 20 SPECIFICATIONS VIN = (VOUT + 0.5 V) or 2.2 V, whichever is greater; EN = VIN, IOUT = 10 mA, CIN = COUT = 1 μF, TA = 25°C, unless otherwise noted. Table 1. Parameter Symbol Conditions Min Typ Max Unit INPUT VOLTAGE RANGE VIN TJ = −40°C to +125°C 2.2 5.5 V OPERATING SUPPLY CURRENT IGND IOUT = 0 μA 560 1250 nA IOUT = 0 μA, TJ = −40°C to +125°C 2.3 μA IOUT = 1 μA 860 1800 nA IOUT = 1 μA, TJ = −40°C to +125°C 2.8 μA IOUT = 100 μA 2.6 4.5 μA IOUT = 100 μA, TJ = −40°C to +125°C 5.8 μA IOUT = 10 mA 11 μA IOUT = 10 mA, TJ = −40°C to +125°C 19 μA IOUT = 150 mA 42 μA IOUT = 150 mA, TJ = −40°C to +125°C 65 μA SHUTDOWN CURRENT IGND-SD EN = GND 50 nA EN = GND, TJ = −40°C to +125°C 1 μA OUTPUT VOLTAGE ACCURACY VOUT IOUT = 10 mA −1 +1 % 0 μA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V −2 +2 % 0 μA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V, TJ = −40°C to +125°C −3.5 +3.5 % ADJUSTABLE-OUTPUT VOLTAGE ACCURACY (ADP161)1 VADJ IOUT = 10 mA 0.99 1.0 1.01 V 0 μA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V 0.98 1.02 V 0 μA < IOUT < 150 mA, VIN = (VOUT + 0.5 V) to 5.5 V, TJ = −40°C to +125°C 0.97 1.03 V REGULATION Line Regulation ∆VOUT/∆VIN VIN = (VOUT + 0.5 V) to 5.5 V, TJ = −40°C to +125°C −0.1 +0.1 %/V Load Regulation2 ∆VOUT/∆IOUT IOUT = 100 μA to 150 mA 0.004 %/mA IOUT = 100 μA to 150 mA, TJ = −40°C to +125°C 0.01 %/mA DROPOUT VOLTAGE3 VOUT = 3.3 V 4-Ball WLCSP VDROPOUT IOUT = 10 mA 7 mV IOUT = 10 mA, TJ = −40°C to +125°C 13 mV IOUT = 150 mA 105 mV IOUT = 150 mA, TJ = −40°C to +125°C 195 mV 5-Lead TSOT IOUT = 10 mA 8 mV IOUT = 10 mA, TJ = −40°C to +125°C 15 mV IOUT = 150 mA 120 mV IOUT = 150 mA, TJ = −40°C to +125°C 225 mV ADJ INPUT BIAS CURRENT (ADP161) ADJI-BIAS 2.2 V ≤ VIN ≤ 5.5 V, ADJ connected to VOUT 10 nA ACTIVE PULL-DOWN RESISTANCE TSHUTDOWN VOUT = 2.8 V, RLOAD = ∞, ADP160 only 300 600 Ω START-UP TIME4 TSTART-UP VOUT = 3.3 V 1100 μs CURRENT LIMIT THRESHOLD5 ILIMIT 220 320 500 mA THERMAL SHUTDOWN Thermal Shutdown Threshold TSSD TJ rising 150 °C Thermal Shutdown Hysteresis TSSD-HYS 15 °C EN INPUT En Input Logic High VIH 2.2 V ≤ VIN ≤ 5.5 V 1.2 V EN Input Logic Low VIL 2.2 V ≤ VIN ≤ 5.5 V 0.4 V EN Input Leakage Current VI-LEAKAGE EN = VIN or GND 0.1 μA EN = VIN or GND, TJ = −40°C to +125°C 1 μA ADP160/ADP161 Rev. 0 | Page 4 of 20 Parameter Symbol Conditions Min Typ Max Unit UNDERVOLTAGE LOCKOUT UVLO Input Voltage Rising UVLORISE 2.19 V Input Voltage Falling UVLOFALL 1.60 V Hysteresis UVLOHYS 100 mV OUTPUT NOISE OUTNOISE 10 Hz to 100 kHz, VIN = 5 V, VOUT = 3.3 V 105 μV rms 10 Hz to 100 kHz, VIN = 5 V, VOUT = 2.5 V 100 μV rms 10 Hz to 100 kHz, VIN = 5 V, VOUT = 1.2 V 80 μV rms POWER SUPPLY REJECTION RATIO PSRR 100 Hz, VIN = 5 V, VOUT = 3.3 V 60 dB 100 Hz, VIN = 5 V, VOUT = 2.5 V 65 dB 100 Hz, VIN = 5 V, VOUT = 1.2 V 72 dB 1 kHz, VIN = 5 V, VOUT = 3.3 V 50 dB 1 kHz, VIN = 5 V, VOUT = 2.5 V 50 dB 1 kHz, VIN = 5 V, VOUT = 1.2 V 62 dB 1 Accuracy when VOUT is connected directly to ADJ. When the VOUT voltage is set by external feedback resistors, the absolute accuracy in adjust mode depends on the tolerances of resistors used. 2 Based on an end-point calculation using 0 μA and 150 mA loads. 3 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to the nominal output voltage. This applies only for output voltages above 2.2 V. 4 Start-up time is defined as the time between the rising edge of EN to VOUT being at 90% of its nominal value. 5 Current limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 3.0 V output voltage is defined as the current that causes the output voltage to drop to 90% of 3.0 V or 2.7 V. INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS Table 2. Parameter Symbol Conditions Min Typ Max Unit MINIMUM INPUT AND OUTPUT CAPACITANCE1 CMIN TA = −40°C to +125°C 0.7 μF CAPACITOR ESR RESR TA = −40°C to +125°C 0.001 0.2 Ω 1 The minimum input and output capacitance should be greater than 0.7 μF over the full range of operating conditions. The full range of operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended; however, Y5V and Z5U capacitors are not recommended for use with any LDO. ADP160/ADP161 Rev. 0 | Page 5 of 20 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN to GND −0.3 V to +6.5 V VOUT to GND −0.3 V to VIN EN to GND −0.3 V to VIN Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Operating Ambient Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings only apply individually; they do not apply in combination. The ADP160/ADP161 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula TJ = TA + (PD × θJA) Junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction-to-ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 inches × 3 inches, circuit board. Refer to JESD 51-7 and JESD 51-9 for detailed information on the board construction. For additional information, see Application Note AN-617, MicroCSP™ Wafer Level Chip Scale Package. ΨJB is the junction to board thermal characterization parameter with units of °C/W. ΨJB of the package is based on modeling and calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path as in thermal resistance, θJB. Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD × ΨJB) Refer to JESD51-8 and JESD51-12 for more detailed information about ΨJB. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA ΨJB Unit 5-Lead TSOT 170 43 °C/W 4-Ball, 0.4 mm Pitch WLCSP 260 58 °C/W ESD CAUTION ADP160/ADP161 Rev. 0 | Page 6 of 20 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS NC = NO CONNECT ADP160 TOP VIEW (Not to Scale) 1 2 3 5 4 VOUT NC VIN GND EN 08 62 8- 00 4 Figure 4. 5-Lead TSOT, Fixed Output Pin Configuration, ADP160 Table 5. 5-Lead TSOT Pin Function Descriptions, ADP160 Pin No. Mnemonic Description 1 VIN Regulator Input Supply. Bypass VIN to GND with a 1 μF or greater capacitor. 2 GND Ground. 3 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 4 NC No Connect. This pin is not connected internally. 5 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 μF or greater capacitor. ADP161 TOP VIEW (Not to Scale) 1 2 3 5 4 VOUT ADJ VIN GND EN 08 62 8- 00 5 Figure 5. 5-Lead TSOT, Adjustable Output Pin Configuration, ADP161 Table 6. 5-Lead TSOT Pin Function Descriptions, ADP161 Pin No. Mnemonic Description 1 VIN Regulator Input Supply. Bypass VIN to GND with a 1 μF or greater capacitor. 2 GND Ground. 3 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 4 ADJ Output Voltage Adjust Pin. Connect the midpoint of the voltage divider between VOUT and GND to this pin to set the output voltage. 5 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 μF or greater capacitor. ADP160/ADP161 Rev. 0 | Page 7 of 20 1 2 A B TOP VIEW (Not to Scale) ADP160 VIN VOUT EN GND 08 62 8- 00 6 Figure 6. 4-Ball WLCSP Pin Configuration, ADP160 Table 7. 4-Ball WLCSP Pin Function Descriptions, ADP160 Pin No. Mnemonic Description A1 VIN Regulator Input Supply. Bypass VIN to GND with a 1 μF or greater capacitor. B1 EN Enable Input. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. A2 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 μF or greater capacitor. B2 GND Ground. ADP160/ADP161 Rev. 0 | Page 8 of 20 TYPICAL PERFORMANCE CHARACTERISTICS VIN = 3.8 V, VOUT = 3.3 V, IOUT = 1 mA, CIN = COUT = 1 μF, TA = 25°C, unless otherwise noted. 3.35 3.25 3.26 3.27 3.28 3.29 3.30 3.31 3.32 3.33 3.34 –40 –5 25 85 125 V O U T (V ) JUNCTION TEMPERATURE (°C) LOAD = 1µA LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 150mA 08 62 8- 00 7 Figure 7. Output Voltage (VOUT) vs. Junction Temperature 3.35 3.25 3.27 3.29 3.31 3.33 3.26 3.28 3.30 3.32 3.34 0.001 0.01 10001001010.1 V O U T (V ) ILOAD (mA) 08 62 8- 00 8 Figure 8. Output Voltage (VOUT) vs. Load Current (ILOAD) 3.35 3.25 3.27 3.29 3.31 3.33 3.26 3.28 3.30 3.32 3.34 3.7 5.55.35.14.94.74.54.34.13.9 V O U T (V ) VIN (V) LOAD = 1µA LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 150mA 08 62 8- 00 9 Figure 9. Output Voltage (VOUT) vs. Input Voltage 100 0.1 1 10 –40 –5 25 85 125 G R O U N D C U R R EN T (µ A ) JUNCTION TEMPERATURE (°C) LOAD = 1µA LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 150mA NO LOAD 08 62 8- 01 0 Figure 10. Ground Current vs. Junction Temperature 100 0.1 1 10 0.001 0.01 10001001010.1 G R O U N D C U R R EN T (µ A ) ILOAD (mA) 08 62 8- 01 1 Figure 11. Ground Current vs. Load Current (ILOAD) 100 0.1 1 10 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 G R O U N D C U R R EN T (µ A ) VIN (V) 08 62 8- 01 2 LOAD = 1µA LOAD = 100µA LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 150mA NO LOAD Figure 12. Ground Current vs. Input Voltage (VIN) ADP160/ADP161 Rev. 0 | Page 9 of 20 0.18 0 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 –40 –5 25 85 125 SH U TD O W N C U R R EN T (µ A ) TEMPERATURE (°C) VIN = 2.9V VIN = 3.2V VIN = 3.8V VIN = 4.1V VIN = 4.7V VIN = 5.5V 08 62 8- 01 3 Figure 13. Shutdown Current vs. Temperature at Various Input Voltages 250 200 150 100 50 0 1 10 100 1000 D R O PO U T VO LT A G E (m V) LOAD CURRENT (mA) 08 62 8- 01 4 VOUT = 2V VOUT = 3.3V Figure 14. Dropout Voltage vs. Load Current 3.35 3.30 3.25 3.20 3.15 3.10 3.05 3.00 3.1 3.2 3.3 3.4 3.5 3.6 V O U T (V ) VIN (V) VDROP = 1mA VDROP = 5mA VDROP = 10mA VDROP = 50mA VDROP = 100mA VDROP = 250mA 08 62 8- 01 5 Figure 15. Output Voltage (VOUT) vs. Input Voltage (in Dropout) 140 120 100 80 60 40 20 0 3.1 3.2 3.3 3.4 3.5 3.6 G R O U N D C U R R EN T (µ A ) VIN (V) IGND = 1mA IGND = 5mA IGND = 10mA IGND = 50mA IGND = 100mA IGND = 150mA 08 62 8- 01 6 Figure 16. Ground Current vs. Input Voltage(VIN) in Dropout 0 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 10 100 10M1M100k10k1k PS R R (d B ) FREQUENCY (Hz) LOAD = 200mA LOAD = 100mA LOAD = 10mA LOAD = 1mA LOAD = 100µA 08 62 8- 01 7 Figure 17. Power Supply Rejection Ratio vs. Frequency, VOUT = 1.2 V, VIN = 2.2 V 0 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 10 100 10M1M100k10k1k PS R R (d B ) FREQUENCY (Hz) LOAD = 200mA LOAD = 100mA LOAD = 10mA LOAD = 1mA LOAD = 100µA 08 62 8- 01 8 Figure 18. Power Supply Rejection Ratio vs. Frequency, VOUT = 2.5 V, VIN = 3.5 V ADP160/ADP161 Rev. 0 | Page 10 of 20 0 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 10 100 10M1M100k10k1k PS R R (d B ) FREQUENCY (Hz) LOAD = 200mA LOAD = 100mA LOAD = 10mA LOAD = 1mA LOAD = 100µA 08 62 8- 01 9 Figure 19. Power Supply Rejection Ratio vs. Frequency, VOUT = 3.3 V, VIN = 4.3 V 0 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 10 100 10M1M100k10k1k PS R R (d B ) FREQUENCY (Hz) LOAD = 3.3V/200mA LOAD = 2.5V/200mA LOAD = 1.2V/200mA LOAD = 3.3V/1mA LOAD = 2.5V/1mA LOAD = 1.2V/1mA 08 62 8- 02 0 Figure 20. Power Supply Rejection Ratio vs. Frequency Various Output Voltages and Load Currents, VIN − VOUT = 1 V 0 –100 –90 –80 –70 –60 –50 –40 –30 –20 –10 10 100 10M1M100k10k1k PS R R (d B ) FREQUENCY (Hz) LOAD = 200mA LOAD = 100mA LOAD = 10mA LOAD = 1mA LOAD = 100µA 08 62 8- 02 1 Figure 21. Adjustable ADP161
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