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首页 IPC-EIA-J-STD-001C 电气与电子组装件锡焊要求

IPC-EIA-J-STD-001C 电气与电子组装件锡焊要求.pdf

IPC-EIA-J-STD-001C 电气与电子组装件锡焊要求

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2009-10-13 0人阅读 举报 0 0 暂无简介

简介:本文档为《IPC-EIA-J-STD-001C 电气与电子组装件锡焊要求pdf》,可适用于工程科技领域

JOINTINDUSTRYSTANDARDRequirementsforSolderedElectricalandElectronicAssembliesIPCEIAJSTDCMARCHSupersedesRevisionBOctoberOriginalPublicationAprilInkeepingwiththeUSDepartmentofDefenseacquisitionreformprincipleofrelyingonperformancerequirementswheneverpracticable,andthenrelyingoncontractorstomeetthoserequirements,thisstandardhasnotbeen‘‘adopted’’However,itisrecommendedasareferencetobeusedintheestablishmentandevaluationofdesignandprocessrequirementsTheadoptionnoticeoftheIPCHDBKisreprintedbelowtobetteridentifytheDepartment’sintenttouseANSIJSTD,IPCHDBK,andIPCAwhenevaluatingelectronicmanufacturingstrategies,processes,andmanagement‘‘IPCHDBK,‘‘HandbookandGuidetotheRequirementsforSolderedElectricalandElectronicAssembliestoSupplementANSIJSTDB’’wasadoptedonJanuary,,forusebytheDepartmentofDefense(DoD)DepartmentofDefensepolicyistorelyonperformancebasedrequirementswheneverpracticableandtonotrequirestandardmanagementapproachesormanufacturingprocessesinsolicitationsandcontractsByestablishingperformancerequirementsandthenrelyingoncontractorstomeetthoserequirementsweenableinnovationandallowcontractorstomeetourneedsatthelowestcostNeverthelessDefenseprogrammanagersandcontractoversightpersonnelmusthaveanunderstandingoftheunderlyingmanagement,engineering,andmanufacturingprocessesatworksotheycanevaluateandmonitorcontractorprocessesDoDactivitiesmayusethishandbookanditsassociateddocumentswhenevaluatingelectronicmanufacturingstrategies,processes,andmanagement’’ThePrinciplesofStandardizationInMaytheIPC’sTechnicalActivitiesExecutiveCommitteeadoptedPrinciplesofStandardizationasaguidingprincipleofIPC’sstandardizationeffortsStandardsShould:•ShowrelationshiptoDesignforManufacturability(DFM)andDesignfortheEnvironment(DFE)•Minimizetimetomarket•Containsimple(simplified)language•Justincludespecinformation•Focusonendproductperformance•IncludeafeedbacksystemonuseandproblemsforfutureimprovementStandardsShouldNot:•Inhibitinnovation•Increasetimetomarket•Keeppeopleout•Increasecycletime•Tellyouhowtomakesomething•ContainanythingthatcannotbedefendedwithdataNoticeIPCStandardsandPublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforhisparticularneedExistenceofsuchStandardsandPublicationsshallnotinanyrespectprecludeanymemberornonmemberofIPCfrommanufacturingorsellingproductsnotconformingtosuchStandardsandPublication,norshalltheexistenceofsuchStandardsandPublicationsprecludetheirvoluntaryusebythoseotherthanIPCmembers,whetherthestandardistobeusedeitherdomesticallyorinternationallyRecommendedStandardsandPublicationsareadoptedbyIPCwithoutregardtowhethertheiradoptionmayinvolvepatentsonarticles,materials,orprocessesBysuchaction,IPCdoesnotassumeanyliabilitytoanypatentowner,nordotheyassumeanyobligationwhatevertopartiesadoptingtheRecommendedStandardorPublicationUsersarealsowhollyresponsibleforprotectingthemselvesagainstallclaimsofliabilitiesforpatentinfringement©CopyrightIPC,Northbrook,IllinoisAllrightsreservedunderbothinternationalandPanAmericancopyrightconventionsAnycopying,scanningorotherreproductionofthesematerialswithoutthepriorwrittenconsentofthecopyrightholderisstrictlyprohibitedandconstitutesinfringementundertheCopyrightLawoftheUnitedStatesIPCEIAJSTDCRequirementsforSolderedElectricalandElectronicAssembliesAjointstandarddevelopedbytheJointNationalSolderingStandardTaskGroup(a),theEIASolderingTechnologyCommittee(STC)andtheSolderingSubcommittee()ofIPCUsersofthisstandardareencouragedtoparticipateinthedevelopmentoffuturerevisionsContact:EIAEngineeringDepartmentWilsonBoulevardArlington,VAPhone()Fax()IPCSandersRoadNorthbrook,ILPhone()Fax()ASSOCIATIONCONNECTINGELECTRONICSINDUSTRIESWhyisthereachargeforthisstandardYourpurchaseofthisdocumentcontributestotheongoingdevelopmentofnewandupdatedindustrystandardsStandardsallowmanufacturers,customers,andsupplierstounderstandoneanotherbetterStandardsallowmanufacturersgreaterefficiencieswhentheycansetuptheirprocessestomeetindustrystandards,allowingthemtooffertheircustomerslowercostsIPCspendshundredsofthousandsofdollarsannuallytosupportIPC’svolunteersinthestandardsdevelopmentprocessTherearemanyroundsofdraftssentoutforreviewandthecommitteesspendhundredsofhoursinreviewanddevelopmentIPC’sstaffattendsandparticipatesincommitteeactivities,typesetsandcirculatesdocumentdrafts,andfollowsallnecessaryprocedurestoqualifyforANSIapprovalIPC’smembershipdueshavebeenkeptlowinordertoallowasmanycompaniesaspossibletoparticipateTherefore,thestandardsrevenueisnecessarytocomplementduesrevenueThepricescheduleoffersadiscounttoIPCmembersIfyourcompanybuysIPCstandards,whynottakeadvantageofthisandthemanyotherbenefitsofIPCmembershipaswellFormoreinformationonmembershipinIPC,pleasevisitwwwipcorgorcallThankyouforyourcontinuedsupportAcknowledgmentMembersoftheEIASolderingTechnologyCommittee(STC)andtheJointNationalStandardforSolderingTaskGrouphaveworkedtogethertodevelopthisdocumentWewouldliketothankthemfortheirdedicationtothiseffortAnyStandardinvolvingacomplextechnologydrawsmaterialfromavastnumberofsourcesWhiletheprincipalmembersoftheJointNationalStandardforSolderingTaskGroupareshownbelow,itisnotpossibletoincludeallofthosewhoassistedintheevolutionofthisStandardToeachofthem,themembersoftheEIAandIPCextendtheirgratitudeAssemblyJoiningProcessesCommitteeEIASolderingTechnologyCommitteeJointNationalStandardforSolderingTaskGroupChairJamesFMaguireBoeingPhantomWorksChairMarkKwokaIntersilCorporationCoChairsJeffKoonRaytheonCompanyTeresaRoweAAICorporationTechnicalLiaisonsoftheIPCBoardofDirectorsStanPlzakPensarCorpPeterBigelowBeaverBrookCircuitsIncJointNationalStandardforSolderingTaskGroupDavidCAdams,RockwellCollinsMichaelAldrich,AmetekAerospaceKariAnderson,RaytheonCompanyGadArbel,IAIPeterAshaolu,CiscoSystemsIncWilliamJBalon,BayerCorporationMarkBarnett,RaytheonCompanyCharlesRBarker,InputOutputIncAnnBastin,EldecCorporationTimothyEBates,AlcatelUSAJimBeal,ITTAerospaceCommunicationsChrisBeaufait,GeneralElectricCoAmirBega,AlliedSignalAerospaceCanadaGraceLBen,AmbitechIncDennisFBernier,KesterSolderDivisionMichaelABeverly,TRWKenBloomquist,PrimexAerospaceCompanyRichardWBoerdner,EJEResearchGLesBogert,BechtelPlantMachinery,IncSudhirTBora,AutomotiveSystemsLaboratoryTimothyABowser,OrbitalSciencesCorporationDianaBradford,SolderingTechnologyInternationalJasonBragg,CelesticaInternationalIncDrPeterBratin,ECITechnology,IncDavidBruder,HarrisCorporationCarlBuchanan,USAviationMissileCommandTerryBurnette,MotorolaIncJeffCannis,AmkorTechnologyIncKenHCarlson,HarrisCorporationThomasACarroll,HughesSpaceCommunicationsCoRobertVCarter,TRWAlanSCash,NorthropGrummanCorporationDPhillipChen,AlliedSignalAerospaceCanadaRayCirimele,DiversifiedSystemsIncDrHughCole,CobarAmericasIncJeffreyCColish,NorthropGrummanCorporationCharlesDalCurrier,AmbitechIncGeneCushman,EPTACCorporationDonaldHDaebler,SCISystemsIncDerekD’Andrade,SurfaceMountTechnologyCentreJGordonDavy,NorthropGrummanESSDJenniferDay,SolderingTechnologyInternationalLynDayman,ATTECAustraliaRodneyDehne,OEMWorldwideStaceyDeLorenzo,NorthropGrummanCorporationRamonDiaz,SolectronTechnologyIncWilliamCDieffenbacher,LockheedMartinCorporationMicheleJDiFranza,TheMitreCorpDarrinDodson,AlcatelUSANickD’Onofrio,CAEElectronicsLtdKarenDowney,LockheedMartinCorporationKathieMDrakeWillcox,JetPropulsionLaboratoryDrBarrieDDunn,EuropeanSpaceAgencyFrankDurso,MacDermid,IncMarchIPCEIAJSTDCiiiManonDutil,CMACElectronicSystemsIncKathyEdsinger,MCMSWernerEngelmaier,EngelmaierAssociates,LCTommyREtheridge,BoeingAircraftMissilesJoeRFelty,RaytheonCompanyJeffFerry,CircuitTechnologyCenter,IncDarylFeryance,EatonCutlerHammerCharlesDFieselman,SolectronTechnologyIncBruceDFischer,LogitechIncDanielLFoster,ElectronicsTrainingAdvantage(ETA)JamesEFowler,RaytheonCompanyKevinJFrasier,ScientificAtlantaIncMikeFreed,RockwellAutomationAllenBradleyJuanGamboa,CiscoSystemsIncMahendraSGandhi,RaytheonCompanyFloydGentry,SandiaNationalLabsJohnJGerman,OrbitalSciencesCorporationConstantinoJGonzalez,ACME,IncRandallGoodnight,SolectronTechnologyIncGaryAGorsche,LittonAmecomRobertGregory,CAEElectronicsLtdRussellSGriffith,TycoPCGEngineeredSystemsWilliamFGriffiths,TellumatPtyLtdCDudleyHamilton,LockheedMartinCorporationDrCarolHandwerker,NISTDrMichaelEHayes,PetrofermIncStevenAHerrberg,RaytheonCompanyDavidDHillman,RockwellCollinsPhilHinton,Hinton‘‘PWB’’EngineeringFDBruceHoughton,CelesticaInternationalIncTrevorHughes,FisherRosemontLimitedThomasLHumpal,OEMWorldwideConstantinHudon,VaritronTechnologies,IncDrChrisHunt,NationalPhysicalLaboratoryGregHurst,MarconiAerospaceDefenseSystemsDrJennieSHwang,HTechnologiesGroupIncLesHymes,TheCompleteConnectionMartinWJawitz,EimerCompanyJamesJenkins,HarrisCorporationMartinEJohns,PolarisContractServicesKathrynLJohnson,HexaconElectricCompanyChrisAJohnson,LucentTechnologiesIncJosephEKane,LockheedMartinCorporationCindyAKemp,EvenfloCompanyIncRichardKennady,BahiatechBahiaTechnologiaLtdaTerenceKern,AxiomElectronics,IncWilliamKillion,KimballElectronicsGroupClarenceWKnapp,LittonGuidanceControlSystemsJeffryFKoon,RaytheonCompanyConnieMKorth,KByteHibbingManufacturingRichardKraszewski,KesterSolderDivisionVijayKumar,LockheedMartinElectronicsMissilesMarkAKwoka,IntersilCorporationPatrickKyne,DefenseSupplyCenterColumbusLeoPLambert,EPTACCorporationCharlesALawson,GeneralDynamicsAdvancedTechnologyFredericWLee,NorthropGrummanNordenSystemsChouHLi,LMITechnologiesLarryLichtenberg,ProcessOptimizationSpecialistsAlvinRLuther,LittonLaserSystemsDavidHMa,LockheedMartinMissilesSpaceBrianMaas,PensarCorporationKimMacDougall,SanminaCorporationJamesFMaguire,BoeingPhantomWorksPeterEMaher,PEMConsultingAlanMahoney,CAEElectronicsLtdSusanSMansilla,RobisanLaboratoryIncJamesMarsico,AILSystemsIncJohnMastorides,GroupTechnologiesCorpWilliamDeanMay,NSWCCraneWilliamEMcManes,PEIElectronics,IncMarkMcDonough,ChandlerEvansControlSystemsGarryDMcGuire,HernandezEngineeringIncRonaldMcIlnay,MedtronicPhysioControlWilliamEMcManes,PEIElectronics,IncRandyMcNutt,NorthropGrummanReneeMichalkeiwicz,TraceLabsEastKellyJMiller,CAEElectronicsLtdJamesMisiak,IIStanleyCoIncJamesHMoffitt,MoffittConsultingServicesPhilipLMontague,RaytheonCompanyMarshaMoore,Techdyne,LyttonIncChristianMorin,VaritronTechnologies,IncBarryMorris,AdvancedReworkTechnologyARTGordonMorris,RaytheonCompanyEugeneRMoyer,MarconiAerospaceElectronicsSystemsMaryMuller,EldecCorporationTerryLMunson,CSLIncStevenWMyers,BoeingDefenseSpaceIrvingRichardNasielski,NVFCompanyJamesNebergall,LockheedMartinCorporationDavidNicol,LucentTechnologiesIncBennyNilsson,EricssonRadioSystemsABIPCEIAJSTDCMarchivKimNorris,LockheedMartinMisslesandFireControlRileyLNortham,EMPFACIJohnSNorton,XeroxCorporationWilliamANovak,HoneywellInternational,IncDavidTNovick,TheBoeingCompanySeppoNuppola,NokiaNetworksRobinLO’Connor,DelphiDelcoElectronicsSystemsGreggOwens,OmniTrainingCorpDeepakPai,GeneralDynamicsInformationSysIncMelParrish,EMPFACIDouglasOPauls,CSLIncRyanPetersen,CelesticaInternationalIncPeterAPhillips,HoneywellIncTimothyMPitsch,PlexusCorpChristinePollock,PresidioComponentsIncScottPoole,MCMSRobertWQuinn,CopalElectronicsCo,LtdDavidPosner,GammaMetricsJimDRaby,SolderingTechnologyInternationalJamesERausch,DelphiDelcoElectronicsSystemsJimRReed,RaytheonCompanyTonyReyes,AdvancedMicroDevicesIncNancyWReynolds,KemetElectronicsCorpDonRipplinger,ITTAerospaceCommunicationsDavidERobertson,HexaconElectricCompanyJoseARomo,ThomsonTelevisionesdeMexicoJeraldGRosser,RosserConsultingTeresaMRowe,AAICorporationMichaelMRubin,VishaySpragueWilliamRRussell,RaytheonCompanyJosephPSalvin,SmithsIndustriesStevenTSauer,XetronCorpAlvinFSchneider,AlphaMetalsIncKellyMSchriver,SchriverConsultantsPeggySchuck,HiTechManufacturingJoyceSchutt,SCISystems,IncFrankSSegura,LockheedMartinAstronauticsMerlynLSeltzer,DelcoDefenseSystemsOperationsBarryWShapiro,DataGeneralCorporationXianyuShea,StrykerInstrumentsDrAkikazuShibata,SonyCorporationMarkShireman,AlliantTechsystemsIncEricSSiegel,PaceIncVernonPSingleton,LockheedMartinCorporationFinnSkaanning,DELTAQualityCertificationTimSkidmore,MulticoreSolders,IncJosephTSlanina,AlliedSignalAerospaceEdwardSmall,EdSmallConsultingSAlanSmith,MTTC(MfgTechnlgyTrainingCtr)RickBSmith,MotorolaIncDrJohnESohn,LucentTechnologiesIncWayneASteen,RockwellCollinsJorgenSvensson,EricssonRadioSystemsABAlanWSwanson,Sanders,ALockheedMartinCompanyBlenFTalbot,LCommunicationsJohnETaylor,DelphaxSystemsJamesTerveen,LCommunicationsEdRTidwell,AlcatelUSAStephenTodd,FCIBergElectronicsStevenTorres,CorlundElectronicsCorpDrLauraJTurbini,Atlanta,GAVictorATwaddell,Sanders,ALockheedMartinCoPaulLUrban,CooperIndustriesIncSharonTVentress,USAviationMissileCommandNickVirmani,NavalResearchLabLSamanthaWalley,RaytheonCompanyKarenWalters,BTUInternationalVernTWeik,CID,CenturyCircuitsElectronicsBobWillis,LockheedMartinCorporationJamesWalterWoodford,DepartmentofDefenseGeraldWooten,LockheedMartinSkunkWorksDonYoungblood,HoneywellIncAdamZbrzezny,CelesticaInternationalIncDrYunZhang,LucentTechnologiesIncMarchIPCEIAJSTDCvTableofContentsSCOPEPurposeClassificationMeasurementUnitsandApplicationsVerificationofDimensionsDefinitionofRequirementsHardwareDefectsandProcessIndicatorsMaterialandProcessNonconformancesProcessControlRequirementsAPPLICABLEDOCUMENTSElectronicIndustriesAlliance(EIA)IPCJointIndustryStandardsASTMElectrostaticDischargeAssociationGENERALREQUIREMENTSOrderofPrecedenceConflictSpecializedProcessesandTechnologiesTermsandDefinitionsDefectDispositionManufacturer(Assembler)ObjectiveEvidenceProcessIndicatorProficiencySolderDestinationSideSolderSourceSideSupplierUserRequirementsFlowdownPersonnelProficiencyElectrostaticDischarge(ESD)FacilitiesEnvironmentalControlsTemperatureandHumidityLightingFieldAssemblyOperationsMoistureSensitiveComponentsSolderingToolsandEquipmentMATERIALSSolderFluxSolderPasteSolderPreformsAdhesivesChemicalStrippersHeatShrinkableSolderingDevicesCOMPONENTSSolderTerminalsSolderabilitySolderabilityTestingofCeramicBoardsSolderPurityMaintenanceSolderabilityMaintenanceGoldRemovalReworkofNonsolderablePartsASSEMBLYPROCESSESGeneralPartMountingRequirementsComponentandSealDamageLeadForming

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IPC-EIA-J-STD-001C 电气与电子组装件锡焊要求

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