��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
� 500-mA Rated Collector Current (Single
Output)
� High-Voltage Outputs . . . 50 V
� Output Clamp Diodes
� Inputs Compatible With Various Types of
Logic
� Relay Driver Applications
� Compatible with ULN2800A Series
description/ordering information
The ULN2803A is a high-voltage, high-current Darlington
transistor array. The device consists of eight npn Darlington pairs
that feature high-voltage outputs with common-cathode clamp
diodes for switching inductive loads. The collector-current rating of
each Darlington pair is 500 mA. The Darlington pairs may be
connected in parallel for higher current capability.
Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line
drivers, and logic buffers. The ULN2803A has a 2.7-kΩ series base resistor for each Darlington pair for operation
directly with TTL or 5-V CMOS devices.
ORDERING INFORMATION
TA PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (N) Tube of 20 ULN2803AN ULN2803AN
−40°C to 85°C
SOIC (DW) Tube of 40 ULN2803ADW ULN2803A−40 C to 85 C SOIC (DW)
Reel of 2000 ULN2003ADWR
ULN2803A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
1B
2B
3B
4B
5B
6B
7B
8B
GND
1C
2C
3C
4C
5C
6C
7C
8C
COM
DW OR N PACKAGE
(TOP VIEW)
�
� ��
��� �
� ����������� �� ������� �� �� ��!"������� #���$
���#���� ������� �� �������������� ��� �%� ����� ��
�&�� �����������
����#��# '������($ ���#������ ���������) #��� ��� ���������"( ���"�#�
������) �� �"" ����������$
��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram
8C
7C
6C
5C
4C
3C
2C
7
6
5
4
3
2
1
7B
6B
5B
4B
3B
2B
1B
11
12
13
14
15
16
17
COM
8
8B
10
1C
18
schematic (each Darlington pair)
2.7 kΩ
7.2 kΩ 3 kΩ
COM
Output C
E
Input B
��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings at 25°C free-air temperature (unless otherwise noted)†
Collector-emitter voltage 50 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage (see Note 1) 30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous collector current 500 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp diode current 500 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Total substrate-terminal current −2.5 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): DW package TBD°C/W. . . . . . . . . . . . . . . . . . . . . . . .
N package TBD°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the emitter/substrate terminal GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
electrical characteristics at 25°C free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICEX Collector cutoff current
VCE = 50 V,
See Figure 1
II = 0, 50 µA
II(off) Off-state input current VCE = 50 V,TA = 70°C,
IC = 500 µA,
See Figure 2 50 65 µA
II(on) Input current VI = 3.85 V, See Figure 3 0.93 1.35 mA
VCE = 2 V,
IC = 200 mA 2.4
VI(on) On-state input voltage
VCE = 2 V,
See Figure 4 IC = 250 mA 2.7 VVI(on) On-state input voltage See Figure 4
IC = 300 mA 3
V
II = 250 µA,
See Figure 5
IC = 100 mA, 0.9 1.1
VCE(sat) Collector-emitter saturation voltage
II = 350 µA,
See Figure 5
IC = 200 mA, 1 1.3 V
II = 500 µA,
See Figure 5
IC = 350 mA, 1.3 1.6
IR Clamp diode reverse current VR = 50 V, See Figure 6 50 µA
VF Clamp diode forward voltage IF = 350 mA, See Figure 7 1.7 2 V
Ci Input capacitance VI = 0 V, f = 1 MHz 15 25 pF
switching characteristics at 25°C free-air temperature
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low- to high-level output VS = 50 V, RL = 163 Ω, 130 ns
tPHL Propagation delay time, high- to low-level output
VS = 50 V,
CL = 15 pF,
RL = 163 Ω,
See Figure 8 20 ns
VOH High-level output voltage after switching
VS = 50 V,
See Figure 9
IO ≈ 300 mA, VS − 20 mV
��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Figure 1. ICEX Test Circuit
Open VCE
ICEX
Open
Figure 2. II(off) Test Circuit
Open VCE
IC
II(off)
Figure 3. II(on) Test Circuit
Open
II
OpenVI
Figure 4. VI(on) Test Circuit
Open
VCE
IC
VI
Figure 5. hFE, VCE(sat) Test Circuit
Open
VCE
ICII
hFE =
IC
II
Figure 6. IR Test Circuit
VR
Open
IR
��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
Figure 7. VF Test Circuit
Open
VF
IF
NOTES: A. The pulse generator has the following characteristics: PRR = 1 MHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
C. VIH = 3 V
Figure 8. Propagation Delay Times
Pulse
Generator
(see Note A)
Input Open VS = 50 V
RL = 163 Ω
CL = 15 pF
(see Note B)
Output
tPHL tPLH
0.5 µs
<5 ns <10 ns
90%
50%10% 10%
90%
50%
50% 50%
VIH
(see Note C)Input
Output
0
Test Circuit
Voltage Waveforms
VOH
��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
NOTES: A. The pulse generator has the following characteristics: PRR = 12.5 KHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
C. VIH = 3 V Figure 9. Latch-Up Test
Pulse
Generator
(see Note A)
Input
VS
163 Ω
CL = 15 pF
(see Note B)
Output
40 µs
<5 ns <10 ns
90%
1.5 V10% 10%
90%
1.5 V
VIH
(see Note C)Input
Output
0
2 mH
VOH
Test Circuit
Voltage Waveforms
��������
�
����
��
�����
�
�
��
SLRS049C − FEBRUARY1997 − REVISED AUGUST 2004
7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
ULN2803ADW ACTIVE SOIC DW 18 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1YEAR
ULN2803ADWR ACTIVE SOIC DW 18 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1YEAR
ULN2803AN ACTIVE PDIP N 18 20 Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Mar-2005
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio
Data Converters dataconverter.ti.com Automotive www.ti.com/automotive
DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
Mailing Address: Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated
本文档为【ULN2803A】,请使用软件OFFICE或WPS软件打开。作品中的文字与图均可以修改和编辑,
图片更改请在作品中右键图片并更换,文字修改请直接点击文字进行修改,也可以新增和删除文档中的内容。
该文档来自用户分享,如有侵权行为请发邮件ishare@vip.sina.com联系网站客服,我们会及时删除。
[版权声明] 本站所有资料为用户分享产生,若发现您的权利被侵害,请联系客服邮件isharekefu@iask.cn,我们尽快处理。
本作品所展示的图片、画像、字体、音乐的版权可能需版权方额外授权,请谨慎使用。
网站提供的党政主题相关内容(国旗、国徽、党徽..)目的在于配合国家政策宣传,仅限个人学习分享使用,禁止用于任何广告和商用目的。