Moto TRI format

nullnull3D SPI machine EvaluationTRI TR7006Lnull Agenda system overview and specification survey item ---GR&R certification ---Inspect capability Inspection Rate Testing Two Transfer Direction CPK Testing defect analysis ---SPC capability Process improvement and DPMU tracking Conclusion Purchase phasenullTR7006L specification operation system : Windows XP 3D technology : Laser Parallel Triangulation Method resolution (Pixel Size) : X: 6~50um programmable ;Y: 20um (option:12um); Z: 1um inspection range : Max:460mm*510mm Min:50mm*50mm conveyor system : Clamp board driven by Motor instead of air cylinder statistical capability : Customized statistical process control output; top defect by reference/pad. repair picture : Provide 2D,Gray level,3D image data for reference (option 2D color image).Gage R&RGage R&RGR&R study Background Mode: V8 Stencil: thickness 4mil, laser cut manufacture Calculation method: CrossGR&R summary Study by calibration toolStudy by printing boardGR&R for height ,area, volume and X-shift and Y-shift are all below 10%, meet requirement .Multi-Angle Rotation Compare TestingMulti-Angle Rotation Compare TestingMulti-angle compare testing background Edit the inspection program with 0,90,180,270 degrees ,then inspect the same Pad(C4114) with solder printed, 40 times each direction. Comparing item: Volume Comparing location: C4114 Notes: The P-Value tells us whether the effect for that term is statistical significant. Multi-Angle Rotation Compare TestingMulti-Angle Rotation Compare TestingModel: W775Multi-Angle Rotation Compare TestingMulti-Angle Rotation Compare TestingThe following is the result of the multi-angle testing. The box-plot shows that angle 90 has a significant difference with angle 0, angle 180 and angle 270. But angle 0, angle 180 and angle 270 have no significant difference. The data shows only 0.00004 or 0.7% variation. Multi-Angle Rotation Compare TestingTwo-Sample T-Test and CI: Angle 90, Angle 0 Two-sample T for Angle 90 vs Angle 0 N       Mean      StDev    SE Mean Angle 90  40  0.0053753  0.0000494  0.0000078 Angle 0   40  0.0054170  0.0000595  0.0000094 Difference = mu (Angle 90) - mu (Angle 0) Estimate for difference:  -0.000042 95% CI for difference:  (-0.000066, -0.000017) T-Test of difference = 0 (vs not =): T-Value = -3.41  P-Value = 0.001  DF = 75Multi-Angle Rotation Compare TestingInspecting Capability Verification TestInspecting Capability Verification TestThis experiment will verify the inspecting capability, Items: Programming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify Total 100 panels were selected in this experiment Model: W775 Program tool: Gerber tool Inspection Rate Experiment Two Transfer Direction CPK Experiment Programming CapabilityProgramming CapabilityProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify Offline programming phase will be made in your office without occupying machine. online programming phase is very easy and take very short time. Program edit flow chartProgramming CapabilityProgramming CapabilityProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify Model:QIP2500 PCB size:266mmx195mm Pads: 2758 parts: 451Programming CapabilityProgramming CapabilityProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify It is easy to grasp the technology of programming, only taken about 30 minutes to finish a program for a fresh people( TZ_Jiang)Fine tune Gerber + CADImport Gerber Import CAD Generate .SPI File Scan board Import .SPI file Define F/MCycle Time TestingCycle Time TestingProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify Had test the MDB,CHS and Network model, the cycle time as bellow:MDB:W755 size 200*81mm parts:907 Pads:4051 cycle time:18.6sCHS:QIP2500 size:266*188mm parts:453 Pads:2661 cycle time:31.1sNetwork:PA900 size 216*182mm parts:431 Pads:943 cycle time:24.6sCycle Time TestingCycle Time TestingProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify The above shows the cycle time has a close relationship with board size. Cycle time also has a close relationship with the optical resolution. If the minimum component size is 0402, please select the optical resolution of 20 um, and get a faster speed, a shorter cycle time.Note: The evaluated machine assembly by old spare part, had to low the speed. the new model will be faster by 40%, as to the current line cycle time: W755 35 sec;QIP2500 31.1 sec; PA900 24.6 sec , the SPI cycle time would not be the bottleneck. Operate facilitation Operate facilitationProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify Have clear main UI shown next page. (UI: User Interface) Detail statistical information shown in main UI. TRI main UI is very similar to our AOI’S., can safely use the machine, easy to learn and operate. Three operator (production: XL_Wang; QA: July_Hong,XZ_Fang) had attended the experience, Only 10 minutes training, they can operated the machine individually and finished the inspection.Clear Main UI and easy to operate. Defect analysis-detail information at machine display.Clear Main UI and easy to operate. Defect analysis-detail information at machine display.SPI Main UIShow every fail pad’s Area, Height, volume and Bridge, and their percent.Display 2D image, Gray level image and 3D image to confirm.Show detail Yield Rate analysisShow the top ten fail component.3D2DGrayFalse Call verifyFalse Call verifyProgramming capability Cycle time testing Is the machine easy to operate? False call verify Inspecting rate verify Model: W755 Operator: MOTO Hua Yu, TRI Francis Preparations: Printed board, and an end programTotal 91200 components were inspected in this experiment, pass component is 90246, and pass rate is 98.95%. Defect Rate is 1.03%. False call is only 0.01%.Solder missingInspection Capability TestingInspection Capability TestingBackground: An excellent measurement system should have 100% inspection rate or 0% missing rate. Description: This experiment will to verify whether TRI 7006 satisfy the above requirement. We selected six printed boards to make the man-made fail boards. Total 101 fail points were made. All fail points were found out. Even find out the hair which was placed on the solder paste. Result: According to below data, inspection rate is 100%, no fail point missing. It satisfy our requirement. Inspect Capability TestingInspect Capability Testingthe experiments show that all failure points were captured successfully, no escaping. So the inspect rate is 100% in the experiment.Inspect result,6 pcs failed panel, total 101 failure points were captured successfullyInspect capabilityInspect capabilitySome of the failure pictures captured by SPI machine as bellowing. Bridgeno solderInsufficient solderBridge0201 no solderInsufficient solderno solderno solderInspect capabilityInspect capabilityThe foreign material inspect experiment.The fiber captured by SPI successfullyTwo Transfer Direction CPK TestingTwo Transfer Direction CPK TestingBackground SMT has two transfer direction lines. This experiment verify the factor whether affect CPK value. Description 40 printed boards were selected for this experiment. At first, we inspected all boards by the normal direction ( from left to right). Then, we inspected all boards by the negative direction (from right to left). TRI 7006 is easy to change the transfer direction. Only changing the stop sensor and resetting board size. Total about 5 minutes taken. Result As the below figures show, CPK is stable. The transfer direction can’t affect the CPK.Normal direction PPK: 1.67 Negative direction PPK: 1.62SPC system capabilitySPC system capabilitydefect analysis ---SPC capabilityModel: W755 Operator: MOTO Hua Yu, TRI Francis Preparations: Printed board, and an end programCustomized statistical process control output. Process control alarm: X-bar/ R-bar. Query/ Display/ Report: Yield rate/ False call alarm/ Defect Rate etc. Top ten defect by type/ component/ pad or pin Component statistical information Provide 2D, 3D, gray level image data to repair and tracking.SPC system capabilitySPC system capabilityProgramming capability Cycle time testing Is the machine easy to operate? Inspecting rate verify False call verify Verify SPC system capability Top 10 defect report can show significative information. can evidently improve quality by reducing the most fail component or type.SPC system capabilityTop ten defect component distribution.SPC system capabilityHeight CPK statistic. a plot means a CPK of one board. System collects all points’ height of one board and calculates a CPK value. 1.This CPK show the height distribution of a board, which reflected the printing level degree caused by support fixture, stencil level degree and Squeegee level etc. 2.The bellow showed W755 has a good average CPK of 1.57. Height CPK statistic. a plot means a CPK of one board. System collects all points’ height of one board and calculates a CPK value. 1.This CPK show the height distribution of a board, which reflected the printing level degree caused by support fixture, stencil level degree and Squeegee level etc. 2.The bellow showed W755 has a good average CPK of 1.57. SPC system capabilitySPC system capability The below image is integrative dialog with track the historical data, function as following: 1. Can review the time series plots by component or pad, the normal distribution and the CP/CPK report and etc. Including solder volume, area, height. 2. The real time data statistic analysis for print process, and track the fail point. As below showing, component C1002_2 has a stable process with an excellent CP: 2.578/CPK: 1.804.SPC system capabilityProcess control alarm: X-char, R-char. 1.X-R Char can help to control process and improve the abnormal variation in time. System provides 7 kinds of rules to control the process. Max control range had 12 components at a time. Selectable subgroup/ Changeable Upper-Low limit / Real Time Running. 2.X-R Chart can show where and when the variation happenedProcess control alarm: X-char, R-char. 1.X-R Char can help to control process and improve the abnormal variation in time. System provides 7 kinds of rules to control the process. Max control range had 12 components at a time. Selectable subgroup/ Changeable Upper-Low limit / Real Time Running. 2.X-R Chart can show where and when the variation happenedSPC System FunctionProcess Improvement and DPMU TrackingProcess Improvement and DPMU TrackingPrinting process improvement and DPMU tracking Time: 2008.7.05 Mode: W775 Line : X12B Stencil: 4mil, laser cutting Method: Inspecting printed boards (front and rear squeegee) of X12B,and detected the solder paste printed failure, deal with the obvious bad failure,such as the “ss,us”, then tracking the failure rate. Sample size: 2000 PCS Result: the 2000 PCS PCBA had finished the B/E test and assembly, there is no SMT process failure.Captured the fail pictureProcess Improvement Process Improvement The SMT process failure mostly contribute from the solder Joint issue------solder bridge and insufficient solder paste had the SPI can detect the solder print issue before the part placement; The DPMU would reduced greatly (at least 30% improvement) Base on the good inspect capability of SPI. 30%nullnullnullnullnullSummarySPI operation and program software Easy to operate and training, the UI(user interface) is similar to the AOI in running now. Off line edit program function, import CAD data and Gerber file directly, only taken about 15 minutes to finish a program, the program include the same information as the mount machine programs. If no relate files above, can edit program with a bare board also. SPC system It is a overall SPC system. provide process data analysis. Customized statistical process control. Process control alarm: X-bar/ R-bar. Query/ Display/ Report: Yield rate/ False call alarm/ Defect Rate etc. Top defect by type/ component/ pad or pin Component statistical information Provide 2D, 3D, gray level image data for repair and tracking.nullHardware and mechanical system No need the air pressure supply. The all mechanical movements driven by Motor instead of air cylinder system, which won’t be affected by air pressure enough, clean or not and so on. The simple mechanical and electrical system, easy to trouble shooting and maintenance. Can cover over the bend of PCB during the inspect process by Z axis of head. Easy to change the PCB transfer direction, only set in system option, and exchange the in/out sensor can finish the changing direction. The conveyor design with the rope belt instead of the tape belt, which make the PCB can transfer into freely, avoid the thin thickness PCB insert into the Gap showed the following: nullGapTRI SPI Rope transfer beltThe conventional Tape beltpurchase configurationpurchase configurationTR7006L Standard X-Y Table (NSK-P) 7006LL Main PC LENS NIKON 55mm Laser Module(660)--55mm Lens Resolution(12um) Option Auto Conveyor Width Adjustment Single Barcode System Module SPC System (Single User) Optical System Module(2D) Support pin Warranty One year since delivery Software maintain Free upgrade firmware Education training Free charge during one year warranty Service charge (Extend warranty) Provide cal / warranty contract Spare part support Engineering support RMB400/hr Better Testing Better QualityBetter Testing Better QualityTHANK YOU! For more information about Test Research, Inc. Please visit: www.tri.com.tw