© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 8
1 Publication Order Number:
MC100EL1648/D
MC100EL1648
5 V ECL Voltage Controlled
Oscillator Amplifier
Description
The MC100EL1648 is a voltage controlled oscillator amplifier that
requires an external parallel tank circuit consisting of the inductor (L)
and capacitor (C). A varactor diode may be incorporated into the tank
circuit to provide a voltage variable input for the oscillator (VCO).
This device may also be used in many other applications requiring a
fixed frequency clock.
The MC100EL1648 is ideal in applications requiring a local
oscillator, systems that include electronic test equipment, and digital
high−speed telecommunications.
The MC100EL1648 is based on the VCO circuit topology of the
MC1648. The MC100EL1648 uses advanced bipolar process
technology which results in a design which can operate at an extended
frequency range.
The ECL output circuitry of the MC100EL1648 is not a traditional
open emitter output structure and instead has an on−chip termination
emitter resistor, RE, with a nominal value of 510 �. This facilitates
direct ac−coupling of the output signal into a transmission line.
Because of this output configuration, an external pull−down resistor is
not required to provide the output with a dc current path. This output is
intended to drive one ECL load (3.0 pF). If the user needs to fanout the
signal, an ECL buffer such as the EL16 (EL11, EL14) type Line
Receiver/Driver should be used.
Features
• Typical Operating Frequency Up to 1100 MHz
• Low−Power 19 mA at 5.0 Vdc Power Supply
• PECL Mode Operating Range: VCC = 4.2 V to 5.5 V with VEE = 0 V
• NECL Mode Operating Range: VCC = 0 V with VEE = −4.2 V
to −5.5 V
• Input Capacitance = 6.0 pF (TYP)
• Pb−Free Packages are Available
NOTE: The MC100EL1648 is NOT useable as a crystal oscillator.
VEE
VCCVCC
VEE
OUTPUT
AGC
BIAS POINT
TANK
EXTERNAL
TANK
CIRCUIT
Figure 1. Logic Diagram
MARKING
DIAGRAMS*
SOEIAJ−14
M SUFFIX
CASE 965
1
14
14
1
*For additional marking information, refer to
Application Note AND8002/D.
SOIC−8
D SUFFIX
CASE 751
TSSOP−8
DT SUFFIX
CASE 948R
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See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
ORDERING INFORMATION
KEL1648
ALYWG
1648
ALYW�
�
1
8
1
8
1
8
K1648
ALYW
�
1
8
DFN8
MN SUFFIX
CASE 506AA 6
L
M
�
�
1 4
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G or � = Pb−Free Package
(Note: Microdot may be in either location)
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1314 12 11 10 9 8
21 3 4 5 6 7
VCC NC TANK NC BIAS NC VEE
VCC NC OUT NC AGC NC VEE
BIAS
TANK
VEE
VCC VCC
AGC
OUT
Figure 2. Pinout Assignments
VEE
8 Lead 14 Lead
Warning: All VCC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
1 2 3
7
4
568
Table 1. PIN DESCRIPTION
Pin No.
Symbol Description8 Lead 14 Lead
ÁÁÁÁ
ÁÁÁÁ
1 ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
12 ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
TANK ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
OSC Input Voltage
ÁÁÁÁ
ÁÁÁÁ
2, 3 ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
1, 14 ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
VCC ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Positive Supply
ÁÁÁÁ
ÁÁÁÁ
4 ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
3 ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
OUT ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ECL Output
ÁÁÁÁ
ÁÁÁÁ
5 ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
5 ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
AGC ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Automatic Gain Control Input
ÁÁÁÁ
ÁÁÁÁ
6, 7 ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
7, 8 ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
VEE ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Negative Output
ÁÁÁÁ
ÁÁÁÁ
8 ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
10 ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
BIAS ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
OSC Input Reference Voltage
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
2, 4, 7, 9, 11, 13ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
NC ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
No Connect
ÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁ
Thermal
Exposed
Pad
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
EP ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
(DFN8 only) Thermal exposed pad must be connected to a sufficient thermal
conduit. Electrically connect to the most negative supply (GND) or leave uncon-
nected, floating open.
Table 2. ATTRIBUTES
Characteristic Value
Internal Input Pulldown Resistor N/A
Internal Input Pullup Resistor N/A
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 1 kV
> 100 V
> 1 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pkg
SOIC−8
TSSOP−8
SOEIAJ−14
DFN8
Level 1
Level 1
Level 3
Level 1
Level 1
Level 3
Level 3
Level 1
Flammability Rating Oxygen Index: 23 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 11
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
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Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC Power Supply PECL Mode VEE = 0 V 7 to 0 V
VEE Power Supply NECL Mode VCC = 0 V −7 to 0 V
VI PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI � VCC
VI � VEE
6 to 0
−6 to 0
V
V
Iout Output Current Continuous
Surge
50
100
mA
mA
TA Operating Temperature Range −40 to +85 °C
Tstg Storage Temperature Range −65 to +150 °C
�JA Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SOIC−8
SOIC−8
190
130
°C/W
°C/W
�JC Thermal Resistance (Junction−to−Case) Standard Board SOIC−8 41 to 44 °C/W
�JA Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
�JC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W
�JA Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
SOIC−14
SOIC−14
150
110
°C/W
°C/W
�JC Thermal Resistance (Junction−to−Case) Standard Board SOIC−14 41 to 44 °C/W
�JA Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol Wave Solder Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
�JC Thermal Resistance (Junction−to−Case) (Note 1) DFN8 35 to 40 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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Table 4. PECL DC CHARACTERISTICS VCC = 5.0 V; VEE = 0.0 V +0.8 / −0.5 V (Note 2)
Symbol Characteristic
−40°C 25°C 85°C
UnitMin Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 13 19 25 13 19 25 13 19 25 mA
VOH Output HIGH Voltage (Note 3) 3950 4170 4610 3950 4170 4610 3950 4170 4610 mV
VOL Output LOW Voltage (Note 3) 3040 3410 3600 3040 3410 3600 3040 3410 3600 mV
AGC Automatic Gain Control Input 1690 1980 1690 1980 1690 1980 mV
VBIAS Bias Voltage (Note 4) 1650 1800 1650 1800 1650 1800 mV
VIL 1.5 1.35 1.2 V
VIH 2.0 1.85 1.7 V
IL Input Current −5.0 −5.0 −5.0 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Output parameters vary 1:1 with VCC.
3. 1.0 M� impedance.
4. This measurement guarantees the dc potential at the bias point for purposes of incorporating a varactor tuning diode at this point.
Table 5. NECL DC CHARACTERISTICS VCC = 0.0 V; VEE = −5.0 V +0.8 / −0.5 V (Note 5)
Symbol Characteristic
−40°C 25°C 85°C
UnitMin Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 13 19 25 13 19 25 13 19 25 mA
VOH Output HIGH Voltage (Note 6) −1050 −830 −399 −1050 −830 −399 −1050 −830 −399 mV
VOL Output LOW Voltage (Note 6) −1960 −1590 −1400 −1960 −1590 −1400 −1960 −1590 −1400 mV
AGC Automatic Gain Control Input −3310 −3020 −3310 −3020 −3310 −3020 mV
VBIAS Bias Voltage (Note 7) −3350 −3200 −3350 −3200 −3350 −3200 mV
VIL −3.5 −3.65 −3.8 V
VIH −3.0 −3.15 −3.3 V
IL Input Current −5.0 −5.0 −5.0 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Output parameters vary 1:1 with VCC.
6. 1.0 M� impedance.
7. This measurement guarantees the dc potential at the bias point for purposes of incorporating a varactor tuning diode at this point.
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GENERIC TEST CIRCUITS: Bypass to Supply Opposite GND
Figure 3. Typical Test Circuit with Alternate Tank Circuits
0.1�F CL
8 (10)
1 (12)
4 (3)
VCC
* Use high impedance probe (>1.0 M� must be
used).
** The 1200 � resistor and the scope termination
impedance constitute a 25:1 attenuator probe.
Coax shall be CT−070−50 or equivalent.
3 (1) 2 (14)
C L
4 (3)
VCC
3 (1) 2 (14)
VIN FOUT
Tank #1
8 (10)
1 (12)
*
Note 1 Capacitor for tank may be variable type.
(See Tank Circuit #3.)
Note 2 Use high impedance probe (> 1 M� ).Test Point
FOUT
Tank #2
Tank Circuit Option #1, Varactor Diode
Tank Circuit Option #2, Fixed LC
L = Micro Metal torroid #T20−22, 8 turns #30
Enameled Copper wire (@ 40 nH)
C = MMBV609
L = Micro Metal torroid #T20−22, 8 turns #30
Enameled Copper wire (@ 40 nH)
C = 3.0−35pF Variable Capacitance (@ 10 pF)
0.1 �F 0.1 �F
0.1 �F 0.1 �F
8 pin (14 pin) Lead Package
8 pin (14 pin) Lead Package
**
5 (5)6 (7) 7 (8)
VEE
0.1 �F 0.1 �F0.01 �F100 �F
5 (5)6 (7) 7 (8)
VEE
0.1 �F 0.1 �F0.01 �F100 �F
1 K�
50%
ta
tb
VP-P
PRF = 1.0MHz
Duty Cycle (Vdc) -
ta
tb
Figure 4. Output Waveform
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OPERATION THEORY
Figure 5 illustrates the simplified circuit schematic for the
MC100EL1648. The oscillator incorporates positive feedback
by coupling the base of transistor Q6 to the collector of Q7. An
automatic gain control (AGC) is incorporated to limit the
current through the emitter−coupled pair of transistors (Q7 and
Q6) and allow optimum frequency response of the oscillator.
In order to maintain the high quality factor (Q) on the oscillator,
and provide high spectral purity at the output, transistor Q4 is
used to translate the oscillator signal to the output differential
pair Q2 and Q3. Figure 16 indicates the high spectral purity
of the oscillator output (pin 4 on 8−pin SOIC). Transistors
Q2 and Q3, in conjunction with output transistor Q1,
provide a highly buffered output that produces a square
wave. The typical output waveform can be seen in Figure 4.
The bias drive for the oscillator and output buffer is provided
by Q9 and Q11 transistors. In order to minimize current, the
output circuit is realized as an emitter−follower buffer with
an on chip pull−down resistor RE.
Figure 5. Circuit Schematic
AGCVEETANKBIASVEE
VCC VCC
Q4
Q3 Q2
Q1
Q5
D1
Q8
Q7 Q6
Q9
Q10Q11
D2
OUTPUT
800 � 1.36 K�
1.6 K�
3.1 K� 660 � 167 �
400 �
330 �
16 K� 82 � 400 � 660 � 510 �
2 (14) 3 (1)
4 (3)
1 (12) 5 (5)8 (10)7 (8) 6 (7) 8 pin (14 pin) Lead Package
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Figure 6. Low Frequency Plot
Figure 7. High Frequency Plot
0.1�F
1200*
CL
8 (10)
1 (12)
4 (3) SIGNAL
UNDER
TEST
10�F0.1�F
3(1)2 (14)
Tank #3
L = Micro Metal torroid #T20−22, 8 turns #30
Enameled Copper wire (@ 40 nH)
C = 3.0−35 pF Variable Capacitance (@ 10 pF)
* The 1200 � resistor and the scope termination
impedance constitute a 25:1 attenuator probe.
Coax shall be CT−070−50 or equivalent.
0.1�F
1200*
CL
8 (10)
1 (12)
4 (3) SIGNAL
UNDER
TEST
10�F0.1�F
3(1)2 (14)
Tank #3
L = Micro Metal torroid #T20−22, 8 turns #30
Enameled Copper wire (@ 40 nH)
C = 3.0−35 pF Variable Capacitance (@ 10 pF)
* The 1200 � resistor and the scope termination
impedance constitute a 25:1 attenuator probe.
Coax shall be CT−070−50 or equivalent.FR
E
Q
U
E
N
C
Y
(
M
H
z)
CAPACITANCE (pF)
25
20
15
10
5
0
0 300 500 1000 2000 10000
Measured Frequency (MHz)
Calculated Frequency (MHz)
F
R
E
Q
U
E
N
C
Y
(
M
H
Z
)
CAPACITANCE (pF)
100
80
60
40
20
0
0 0.2 0.3 300
30
Measured Frequency (MHz)
Calculated Frequency (MHz)
8 pin (14 pin) Lead Package
8 pin (14 pin) Lead Package
5 (5)6 (7) 7 (8)
VEE
0.1 �F 0.1 �F0.01 �F100 �F
5 (5)6 (7) 7 (8)
VEE
0.1 �F 0.1 �F0.01 �F100 �F
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FIXED FREQUENCY MODE
The MC100EL1648 external tank circuit components are
used to determine the desired frequency of operation as
shown in Figure 8, tank option #2. The tank circuit
components have direct impact on the tuning sensitivity, IEE,
and phase noise performance. Fixed frequency of the tank
circuit is usually realized by an inductor and capacitor (LC
network) that contains a high Quality factor (Q). The plotted
curve indicates various fixed frequencies obtained with a
single inductor and variable capacitor. The Q of the
components in the tank circuit has a direct impact on the
resulting phase noise of the oscillator. In general, when the
Q is high the oscillator will result in lower phase noise.
Figure 8. Fixed Frequency LC Tank
F
R
E
Q
U
E
N
C
Y
(
M
H
z)
CAPACITANCE (pF)
470
370
270
170
70
−30
0.3 300 500 1000 2000 10000
Measured Frequency (MHz)
Calculated Frequency (MHz)
570
0
0.1 �F CL
8 (10)
1 (12)
4 (3)
VCC
3 (1) 2 (14)
Test
Point
FOUT
Tank #2
5 (5)6 (7) 7 (8)
VEE
0.1 �F 0.1 �F0.01 �F100 �F
0.1 �F 0.1 �F
Note 1 Capacitor for tank may be variable type.
(See Tank Circuit #3.)
Note 2 Use high impedance probe (> 1 M� ).
L = Micro Metal torroid #T20−22, 8 turns #30
Enameled Copper wire (@ 40 nH)
C = 3.0−35 pF Variable Capacitance (@ 10 pF)
8 pin (14 pin) lead package
QL ≥ 100
Only high quality surface−mount RF chip capacitors
should be used in the tank circuit at high frequencies. These
capacitors should have very low dielectric loss (high−Q). At
a minimum, the capacitors selected should be operating at
100 MHz below their series resonance point. As the desired
frequency of operation increases, the values of the tank
capacitor will decrease since the series resonance point is a
function of the capacitance value. Typically, the inductor is
realized as a surface−mount chip or a wound coil. In
addition, the lead inductance and board inductance and
capacitance also have an impact on the final operating point.
The following equation will help to choose the appropriate
values for your tank circuit design.
f0 �
1
2� LT * CT�
Where LT = Total Inductance
CT = Total Capacitance
Figure 9 and Figure 10 represent the ideal curve of
inductance/capacitance versus frequency with one known
tank component. This helps the designer of the tank circuit
to choose desired value of inductor/capacitor component for
the wanted frequency. The lead inductance and board
inductance and capacitance will also have an impact on the
tank component values (inductor and capacitor).
Figure 9. Capacitor Value Known (5 pF)
Inductance vs. Frequency with 5 pF Cap
5
10
15
20
25
30
35
40
45
50
0
700 1000 1300 160400
FREQUENCY (MHz)
IN
D
U
C
TA
N
C
E
(
nH
)
Figure 10. Inductor Value Known (4 nH)
Capacitance vs. Frequency with 4 nH Inductance
5
10
15
20
25
30
35
40
45
50
0
700 1000 1300 160400
FREQUENCY (Hz)
C
A
P
A
C
IT
A
N
C
E
(
F
)
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VOLTAGE CONTROLLED MODE
The tank circuit configuration presented in Figure 11,
Voltage Controlled Varactor Mode, allows the VCO to be
tuned across the full operating voltage of the power supply.
Deriving from Figure 6, the tank capacitor, C, is replaced
with a varactor diode whose capacitance changes with the
voltage applied, thus changing the resonant frequency at
which the VCO tank operates as shown in Figure 3, tank
option #1. The capacitive component in Equation 1 also
needs to include the input capacitance of the device and
other circuit and parasitic elements.
Figure 11. Voltage Controlled Varactor Mode
50
70
90
110
130
150
170
190
0 2 4 6 8 10
F
R
E
Q
U
E
N
C
Y
(
M
H
z)
Vin, INPUT VOLTAGE (V)
Figure 12. Plot 1. Dual Varactor MMBV609,
VIN vs. Frequency
C L
4 (3)
VCC
3 (1) 2 (14)
VIN
FOUT
Tank #1
8 (10)
1 (12)
*
0.1 �F 0.1 �F
5 (5)6 (7) 7 (8)
VEE
0.1 �F 0.1 �F0.01 �F100 �F
**
1 K�
*Use high impedance probe (>1.0 Meg� must be used).
**The 1200 � resistor and the scope termination imped-
ance constitute a 25:1 attenuator probe. Coax shall be
CT−070−50 or equivalent.
L = Micro Metal torroid #T20−22, 8 turns #30
Enameled Copper wire (@ 40 nH)
C = MMBV609
8 pin (14 pin) lead package
When operating the oscillator in the voltage controlled
mode with Tank Circuit #1 (Figure 3), it should be noted that
the cathode of the varactor diode (D), pin 8 (for 8 lead
package) or pin 10 (for 14 lead package) should be biased at
least 1.4 V above VEE.
Typical transfer characteristics employing the
capacitance of the varactor diode (plus the input capacitance
of the device, about 6.0 pF typical) in the voltage controlled
mode is shown in Plot 1, Dual Varactor MMBV609 Vin vs.
Frequency. Figure 6, Figure 7, and Figure 8 show the
accuracy of the measured frequency with the different
variable capacitance values. The 1.0 k� resistor in Figure 11
is used to protect the varactor diode during testing. It is not
necessary as long as the dc input voltage does not cause the
diode to become forward biased. The tuning range of the
oscillator in the voltage controlled mode may be calculated
as follows:
f max
f min
�
CD(max)� CS�
CD(min)� CS�
Where
f min �
1
2� � L(CD(max)� CS ��
Where
CS = Shunt Capacitance (input plus external
capacitance)
CD = Varactor Capacitance as a function of bias
voltage
Good RF and low−frequency bypassing is necessary on
the device power supply pins. Capacitors on the AGC pin
and the input varactor trace should be used to bypass the
AGC point and the VCO input (varactor diode),
guaranteeing only dc levels at these points. For output
frequency operation between 1.0 MHz and 50 MHz, a 0.1 �F
capacitor is sufficient. At higher frequencies, smaller values
of capacitance should be used; at lower frequencies, larger
values of capacitance. At high frequencies, the value of
bypass capacitors depends directly on the physical layout of
the system. All bypassing should be as close to the package
pins as possible to minimize unwanted lead inductance.
Several different capacitors may be needed to bypass
various frequencies.
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WAVE−FORM CONDITIONING − SINE OR SQUARE WAVE
The peak−to−peak swing of the tank circuit is set
internally by the AGC pin. Since the voltage swing of the
tank circuit provides the drive for the output buffer, the AGC
potential directly affects the output waveform. If it is desired
to have a sine wave at the output of the MC100EL1648, a
series resistor is tied from the AGC point to the most
negative power potential (ground if positive volt supply is
used, −5.2 V if a negative supply is used) as shown in
Figure 13. At frequencies above 100 MHz typical, it may be
desirable to increase the tank circuit peak−to−peak voltage
in order to shape the signal into a more square waveform at
the output of the MC100EL1648. This is accomplished by
tying a series resistor (1.0 k� minimum) from the AGC to
the most positive power potential (+5.0 V if a positive volt
supply is used, ground if a −5.2 V supply is used). Figure 14
illustrates this principle.
Figure 13. Method of Obtaining a Sine−Wave Output
10
12
7 8
3
5
Output
+5.0Vdc
1 1
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