CAT25 - Thick Film Chip Resistor Arrays
DIMENSIONS ARE: MM
(INCHES)
Features
■ Concave terminals
■ RoHS compliant*
■ 8 bit multiple applications
■ Smallest bussed chip array
■ E 24 Series from 10 ohms to 1 megohm
Electrical Characteristics
Environmental Characteristics
Parameters CAT25 Test Method
Number of Resistors 8
Resistance Range E24 10 ohms to 1 megohm
Resistance Tolerance 5 % JIS-C-5202.5.1
Power Rating/Resistor 62.5 mW
Rating Temperature +70 °C
T.C.R. +/-200 ppm/°C JIS-C-5202.5.2
Maximum Operating Voltage 25 V
Operating Temperature -55 °C to +125 °C
Specification Characteristics Test Method
Short Time Overload +/-(3 % +0.1 ohm) JIS-C-5202.5.5
Load Life +/-(5 % +0.1 ohm) JIS-C-5202.7.10
Humidity Load Life +/-(3 % +0.1 ohm) JIS-C-5202.7.9
Resistance to Soldering Heat +/-(1 % +0.1 ohm) JIS-C-5202.6.4
Terminal Strength +/-(1 % +0.1 ohm) JIS-C-5202.6.
Temperature Cycle +/-(2 % +0.1 ohm) JIS-C-5202.7.4
Vibration +/-(1 % +0.1 ohm) JIS-C-5202.6.3
Insulation Resistance 1000 megohms minimum JIS-C-5202.5.6
Dielectric Withstanding Voltage 50 VRMS JIS-C-5202.5.7
Lead Solderability >95 % JIS-C-5202.6.5
How To Order
CA T 25 - 103 J A LF
Product
CA = Chip Array
Pin Style
T = Concave
Model
Resistance Value
103 = 10K ohms
Tolerance
J = 5 %
Electrical Circuit
A = 8 Resistors, Bussed Type
Terminations
LF = Tin-plated (RoHS compliant)
0.30 ± 0.20
(.012 ± .008)
103 0.25 ± 0.20(.010 ± .008)
0.55 ± 0.10
(.022 ± .004)
2.10 ± 0.20
(.083 ± .008)
4.00 ± 0.20
(.157 ± .008)
0.50 ± 0.20
(.020 ± .008)
0.35 ± 0.20
(.014 ± .008)
0.80 ± 0.10
(.032 ± .004)
0.25 ± 0.15
(.010 ± .006)
DIA.
0.40 ± 0.20
(.016 ± .008)
0.80
(.032)
0.4 - 0.5
(.016 - .020)
2.8 - 3.0
(.110 - .118)
3.3 - 3.4
(.130 - .133)
4.8 - 5.2
(.190 - .205)
0.9 - 1.1
(.035 - .043)
3.2 - 3.5
(.125 - .138)
Electrical Circuit
Outline Drawing Land Pattern
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
*R
oH
S C
OM
PL
IAN
T
For Standard Values Used in Capacitors,
Inductors, and Resistors, click here.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MaterialPackaging
12
(.472) embossed tape
4,000 pcs. per reel
Substrate Alumina 96
Element Ruthenium Oxide
Coating Glass
Terminal AgPb, Plated Ni+SnPb
REV. 02/08
CAT25 - Thick Film Chip Resistor Arrays
Soldering Profile for RoHS Compliant Chip Resistors and Arrays
25
75
125
175
225
275
0 50 100 150 200 250 300
Time (seconds)
Te
m
pe
ra
tu
re
(°
C)
60 - 120 seconds
60 - 90
seconds
260 °C peak
190 °C
150 °C
220 °C
Ramp Down
6 °C/second
255 °C
Maximum of 20 seconds between
+255 °C and +260 °C
Ramp Up
3 °C/second maximum
10 seconds minimum
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