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排阻CAT25 CAT25 - Thick Film Chip Resistor Arrays DIMENSIONS ARE: MM (INCHES) Features ■ Concave terminals ■ RoHS compliant* ■ 8 bit multiple applications ■ Smallest bussed chip array ■ E 24 Series from 10 ohms to 1 megohm Electrical Characteristics Environmental C...

排阻CAT25
CAT25 - Thick Film Chip Resistor Arrays DIMENSIONS ARE: MM (INCHES) Features ■ Concave terminals ■ RoHS compliant* ■ 8 bit multiple applications ■ Smallest bussed chip array ■ E 24 Series from 10 ohms to 1 megohm Electrical Characteristics Environmental Characteristics Parameters CAT25 Test Method Number of Resistors 8 Resistance Range E24 10 ohms to 1 megohm Resistance Tolerance 5 % JIS-C-5202.5.1 Power Rating/Resistor 62.5 mW Rating Temperature +70 °C T.C.R. +/-200 ppm/°C JIS-C-5202.5.2 Maximum Operating Voltage 25 V Operating Temperature -55 °C to +125 °C Specification Characteristics Test Method Short Time Overload +/-(3 % +0.1 ohm) JIS-C-5202.5.5 Load Life +/-(5 % +0.1 ohm) JIS-C-5202.7.10 Humidity Load Life +/-(3 % +0.1 ohm) JIS-C-5202.7.9 Resistance to Soldering Heat +/-(1 % +0.1 ohm) JIS-C-5202.6.4 Terminal Strength +/-(1 % +0.1 ohm) JIS-C-5202.6. Temperature Cycle +/-(2 % +0.1 ohm) JIS-C-5202.7.4 Vibration +/-(1 % +0.1 ohm) JIS-C-5202.6.3 Insulation Resistance 1000 megohms minimum JIS-C-5202.5.6 Dielectric Withstanding Voltage 50 VRMS JIS-C-5202.5.7 Lead Solderability >95 % JIS-C-5202.6.5 How To Order CA T 25 - 103 J A LF Product CA = Chip Array Pin Style T = Concave Model Resistance Value 103 = 10K ohms Tolerance J = 5 % Electrical Circuit A = 8 Resistors, Bussed Type Terminations LF = Tin-plated (RoHS compliant) 0.30 ± 0.20 (.012 ± .008) 103 0.25 ± 0.20(.010 ± .008) 0.55 ± 0.10 (.022 ± .004) 2.10 ± 0.20 (.083 ± .008) 4.00 ± 0.20 (.157 ± .008) 0.50 ± 0.20 (.020 ± .008) 0.35 ± 0.20 (.014 ± .008) 0.80 ± 0.10 (.032 ± .004) 0.25 ± 0.15 (.010 ± .006) DIA. 0.40 ± 0.20 (.016 ± .008) 0.80 (.032) 0.4 - 0.5 (.016 - .020) 2.8 - 3.0 (.110 - .118) 3.3 - 3.4 (.130 - .133) 4.8 - 5.2 (.190 - .205) 0.9 - 1.1 (.035 - .043) 3.2 - 3.5 (.125 - .138) Electrical Circuit Outline Drawing Land Pattern *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. *R oH S C OM PL IAN T For Standard Values Used in Capacitors, Inductors, and Resistors, click here. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. MaterialPackaging 12 (.472) embossed tape 4,000 pcs. per reel Substrate Alumina 96 Element Ruthenium Oxide Coating Glass Terminal AgPb, Plated Ni+SnPb REV. 02/08 CAT25 - Thick Film Chip Resistor Arrays Soldering Profile for RoHS Compliant Chip Resistors and Arrays 25 75 125 175 225 275 0 50 100 150 200 250 300 Time (seconds) Te m pe ra tu re (° C) 60 - 120 seconds 60 - 90 seconds 260 °C peak 190 °C 150 °C 220 °C Ramp Down 6 °C/second 255 °C Maximum of 20 seconds between +255 °C and +260 °C Ramp Up 3 °C/second maximum 10 seconds minimum <1> <1>
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