SMD OP07A

REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make change to 1.5 and add subgroup 4 to device class V and group E section as specified in table IIA. - ro 99-07-30 R. MONNIN B Drawing updated to reflect current requirements. – gt 03-02-20 R. MONNIN REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43216 http://www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY RAYMOND MONNIN AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 98-10-08 MICROCIRCUIT, LINEAR, RADIATION HARDENED, ULTRA-LOW OFFSET VOLTAGE OPERATIONAL AMPLIFIER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-98639 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E498-02 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 98639 01 V G X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) \ / (see 1.2.3) \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 OP07A Radiation hardened, single ultra low offset operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage (VS).......................................................................................... ±22.0 V dc Input voltage (VIN)............................................................................................ ±22.0 V dc 2/ Differential input voltage .................................................................................. ±30 V dc Internal power dissipation (PD) ........................................................................ 500 mW Output short circuit duration ............................................................................ Indefinite Lead temperature (soldering, 10 seconds)...................................................... +300°C Junction temperature (TJ) ................................................................................ +150°C Storage temperature range ............................................................................. -65°C to +150°C Thermal resistance, junction-to-case (θJC) ...................................................... See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA): Cases G and H............................................................................................. +150°C/W Case P ......................................................................................................... +119°C/W Case 2.......................................................................................................... +110°C/W 1.4 Recommended operating conditions. Supply voltage range (VS)................................................................................ ±4.5 V dc to ±20 V dc Ambient operating temperature range (TA)...................................................... -55°C to +125°C 1.5 Radiation features. Maximum total dose available (dose rate = 50 – 300 rads (Si)/s) ................... 100 krads 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings). MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For supply voltage less than ±22 V, the absolute maximum input voltage is equal to the supply voltage. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIO 2/ 4 01 -25 +25 µV 5,6 -60 +60 M,D,P,L,R 3/ 4 -400 +400 Input offset voltage temperature sensitivity ∆VIO / ∆t 4/ 5,6 01 -0.6 +0.6 µV/°C Input bias current +IIB 1 01 -2 +2 nA 2,3 -4 +4 -IIB 1 -2 +2 2,3 -4 +4 IIB M,D,P,L,R 3/ 1 -125 +125 Input offset current IIO 1 01 -2 +2 nA 2,3 -4 +4 M,D,P,L,R 3/ 1 -25 +25 Power supply rejection 4/ ratio +PSRR +VS = +20 V to +5 V, -VS = -15 V 4 01 -10 10 µV/V 5,6 -20 20 -PSRR +VS = +15 V, -VS = -20 V to -5 V 4 -10 10 5,6 -20 20 PSRR VS = ±4.5 V to ±20 V 4 -10 10 5,6 -20 20 Common mode 4/ rejection ratio CMRR VCM = ±13 V 4 01 110 dB 5,6 106 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Adjustment short circuit 4/ current +VIO ADJ VCM = 0 V 1 01 0.5 mV -VIO ADJ -0.5 Output short circuit current +IOS t ≤ 25 ms 4/ 5/ 1,2 01 -65 mA 3 -70 -IOS 1,2 65 3 70 Supply current IS VCM = 0 V 1 01 4 mA 2,3 5 M,D,P,L,R 3/ 1 4 Output voltage swing 4/ (minimum) VOP RL = 1 kΩ 1,2,3 01 -10 10 V RL = 2 kΩ -12 12 Open loop voltage gain (single ended) +AVS VOUT = 0 V to +10 V, RL = 2 kΩ 4 01 300 V / mV 5,6 200 -AVS VOUT = 0 V to -10 V, RL = 2 kΩ 4 300 5,6 200 AVS VOUT = ±10 V, RL = 2 kΩ 4 100 M,D,P,L,R 3/ Slew rate 4/ +SR, -SR VIN = ±5 V, AV = 1 4 01 .08 V / µs See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input noise voltage 4/ density En fO = 10 Hz 4 01 18 nV √Hz fO = 100 Hz 14 fO = 1 kHz 12 Low frequency input 4/ noise voltage Enpp fO = 0.1 Hz to 10 Hz 4 01 0.6 µVPP 1/ ±VS = ±15 V and VCM = 0 V. 2/ Due to the inherent warm-up drift of device type 01, testing shall occur no sooner than five minutes after application of power. 3/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, and R of irradiation. However, this device is only tested at the "R" level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C. 4/ This parameter is not tested to post irradiation. 5/ Continuous short circuit limits are considerably less than the indicated test limits since maximum power dissipation cannot be exceeded. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines G and P H 2 Terminal number Terminal symbol 1 VIO TRIM NC NC 2 -INPUT VIO TRIM VIO TRIM 3 +INPUT -INPUT NC 4 -VS +INPUT NC 5 NC -VS -INPUT 6 OUTPUT NC NC 7 +VS OUTPUT +INPUT 8 VIO TRIM +VS NC 9 --- VIO TRIM NC 10 --- NC -VS 11 --- --- NC 12 --- --- NC 13 --- --- NC 14 --- --- NC 15 --- --- OUTPUT 16 --- --- NC 17 --- --- +VS 18 --- --- NC 19 --- --- NC 20 --- --- VIO TRIM NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 2. Radiation exposure circuit. STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98639 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Subgroups (in accordance with MIL-PRF-38535, table III) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) 1 1 1 Final electrical parameters (see 4.2) 1,2,3,4 1/ 1,2,3,4 1/ 1,2,3,4 1/ 2/ Group A test requirements (see 4.4) 1,2,3,4,5,6 1,2,3,4,5,6 1,2,3,4,5,6 Group C end-point electrical parameters (see 4.4) 1 1 1 2/ Group D end-point electrical parameters (see 4.4) 1 1 1 Group E end-point electrical parameters (see 4.4) --- --- 1,4 1/ PDA applies to subgroup 1. 2/ See table IIB for delta measurement parameters. TABLE IIB. 240 hour burn-in and group C end-point electrical parameters. (TA = +25°C) Parameter Device type Limits Delta Units Min Max Min Max VIO 01 -135 +135 -75 +75 µV +IIB 01 -5 +5 -1 +1 nA -IIB 01 -5 +5 -1 +1 nA 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM