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1
2
3
4
8
7
6
5
RC
SS
COMP
FB
VDD
ISNS
GDRV
GND
D OR HKJ PACKAGE
(TOP VIEW)
TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
WIDE-INPUT-RANGE NONSYNCHRONOUS VOLTAGE-MODE CONTROLLER
Check for Samples: TPS40200-HT
1FEATURES SUPPORTS EXTREME TEMPERATURE
APPLICATIONS• Input Voltage Range 5.5 V to 52 V
• Controlled Baseline
• Output Voltage (700 mV to 87% VIN)
• One Assembly/Test Site
• 200-mA Internal P-Channel FET Driver
• One Fabrication Site
• Voltage Feed-Forward Compensation
• Available in Extreme (–55°C/210°C)
• Undervoltage Lockout Temperature Range (1)
• Programmable Fixed-Frequency
• Extended Product Life Cycle(35 kHz to 500 kHz) Operation
• Extended Product-Change Notification
• Programmable Short-Circuit Protection
• Product Traceability
• Hiccup Overcurrent Fault Recovery • Texas Instruments high temperature products
utilize highly optimized silicon (die) solutions• Programmable Closed-Loop Soft Start
with design and process enhancements to
• 700-mV 1% Reference Voltage
maximize performance over extended
• External Synchronization temperatures.
APPLICATIONS
• Down-Hole Drilling
• High Temperature Environments
(1) Custom temperature ranges available
DESCRIPTION
The TPS40200 is a flexible nonsynchronous controller with a built-in 200-mA driver for P-channel FETs. The
circuit operates with inputs up to 52 V, with a power-saving feature that turns off driver current once the external
FET has been fully turned on. This feature extends the flexibility of the device, allowing it to operate with an input
voltage up to 52 V, without dissipating excessive power. The circuit operates with voltage-mode feedback and
has feed-forward input-voltage compensation that responds instantly to input-voltage change. The integral
700-mV reference is trimmed to 2%, providing the means to accurately control low voltages. Clock frequency,
soft start, and overcurrent limit each are easily programmed by a single, external component. The part has
undervoltage lockout, and can be easily synchronized to other controllers or a system clock to satisfy sequencing
and/or noise-reduction requirements.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2009–2010, Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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50
60
70
80
90
100
0 0.5 1 1.5 2 2.5 3
LoadCurrent- A
E
ff
ic
ie
n
c
y
-
%
V =8V
V =12V
V =16V
IN
IN
IN
V =5V
OUT
1
2
3
4
8
7
6
5
VDD
ISNS
GDRV
GND
RC
SS
COMP
FB
TPS40200
R
SENSE
V
IN
V
OUT
R1 R2
L1
C2
D1
C1
C3
C4
C5
C6
R4
R3
R5
Q1
0.0
0.0
½ ½
1350 mm
½
½
13
50
m
m
|52 mm
|
52 mm
TPS40200-HT
SGLS400B –OCTOBER 2009–REVISED MAY 2010 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TYPICAL APPLICATION
Figure 1. 12-V to 5-V Buck Converter Figure 2. Typical Efficiency of Application Circuit 1
(Described in Application 1)With 94% Efficiency
BARE DIE INFORMATION(1)
BACKSIDE BOND PAD BOND PADDIE THICKNESS BACKSIDE FINISH POTENTIAL METALLIZATION COMPOSITION THICKNESS
15 mils. Silicon with backgrind GND Al-Cu (0.5%) 0.6 µm
(1) Bond pad over active circuitry
2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
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TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
Table 1. Bond Pad Coordinates in Microns
DISCRIPTION PAD NUMBER X min Y min X max Y max
RC 1 63.27 1124.01 164.07 1224.81
SS 2 61.20 922.77 162.00 1023.57
COMP 3 61.20 250.38 162.00 351.18
FB 4 70.20 74.16 171.00 174.96
GND 5 1193.94 91.44 1294.74 192.24
GDRV 6 1188.90 245.34 1289.70 346.14
ISNS 7 1189.80 978.30 1290.60 1079.10
VDD 8 1137.60 1148.49 1238.40 1249.29
Table 2. Test Pad Coordinates in Microns
DISCRIPTION PAD NUMBER X min Y min X max Y max
NC 1 189.00 27.18 256.50 94.68
NC 2 292.86 27.18 360.36 94.68
NC 3 396.72 27.18 464.22 94.68
NC 4 517.77 27.18 585.27 94.68
NC 5 757.71 27.27 825.21 94.77
Table 3. ORDERING INFORMATION (1)
TA PACKAGE (2) ORDERABLE PART NUMBER
–55°C to 175°C D TPS40200HD
KGD TPS40200SKGD1
–55°C to 210°C
HKJ TPS40200SHKJ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS40200-HT
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TPS40200-HT
SGLS400B –OCTOBER 2009–REVISED MAY 2010 www.ti.com
ELECTROSTATIC DISCHARGE (ESD) PROTECTION
MIN MAX UNIT
Human-Body Model 1500 V
CDM 1500 V
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
UNIT
VDD 52
Input voltage range RC, FB –0.3 to 5.5 V
SS –0.3 to 9
ISNS, COMP –0.3 to 9
Output voltage range V
GDRV (VIN – 10) to VIN
TJ Operating virtual junction temperature range –55 to 210 °C
Tstg Storage temperature range –55 to 210 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
VDD Input voltage 5.5 52 V
ELECTRICAL CHARACTERISTICS
–55°C < TA = TJ < 210°C, VDD = 12 V, fOSC = 100 kHz (unless otherwise noted)
TA = –55°C TO 125°C TA = 175°C (1) TA = 210°CPARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
Voltage Reference
FeedbackVFB 4.5 V < VDD < 52 V 675 696 710 689 760 800 675 729 753 mVvoltage
Gate Driver
Gate
driverIsrc 125 190 100 150 90 145 mApull-up
current
Gate
driverIsnk 200 260 130 250 100 220 mApull-down
current
Gate
driver VGATE = (VDD – VGDRV),VGATE 6 8 10 5.3 8 10 5.25 8 10 Voutput for 12 V < VDD < 52 V
voltage
Quiescent Current
Device fOSC = 300 kHz,
Iqq quiescent Driver not switching, 1.5 3 1.5 3 1.5 3 mA
current 5.5 V < VDD < 52 V
Undervoltage Lockout (UVLO)
TurnonVUVLO(on) 3.8 4.2 4.5 3.8 4.2 5 3.8 4.6 5.5threshold
V
TurnoffVUVLO(off) 4 4 4.6threshold
VUVLO(HYST) Hysteresis 110 160 275 80 140 275 75 117 275 mV
(1) For D package only.
4 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
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TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
ELECTRICAL CHARACTERISTICS (continued)
–55°C < TA = TJ < 210°C, VDD = 12 V, fOSC = 100 kHz (unless otherwise noted)
TA = –55°C TO 125°C TA = 175°C (1) TA = 210°CPARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
Soft Start
Internal
soft-startRSS(chg) 65 75 170 63 80 170 60 80 170 kΩpullup
resistance
Internal
soft-startRSS(dchg) 190 217 485 175 258 485 165 212 485 kΩpulldown
resistance
Soft-start
VSSRST reset 100 152 200 100 152 1000 100 150 1700 mV
threshold
Overcurrent Protection
Over-
VILIM current 35 100 150 35 108 150 35 108 150 mV
threshold
Over-
currentOCDF 2 2 %duty
cycle (2)
Over-
currentVILIM(rst) 90 105 200 90 110 200 90 110 200 mVreset
threshold
Oscillator
Oscillator
frequency 35 500 35 500 35 500
range (2)
fOSC RRC = 200 kΩ, kHz85 90 115 85 92 115 84 94 115CRC = 470 pFOscillator
frequency RRC = 68.1 kΩ, 255 280 345 255 274 345 255 270 345CRC = 470 pF
Frequency 12 V < VDD < 52 V –9 0 –9 0 –9 0
line %
4.5 V < VDD < 12 V –20 0 –20 0 –20 0regulation
RampVRMP 4.5 V < VDD < 52 V VDD÷10 VDD÷10 VDD÷10 Vamplitude
Pulse-Width Modulator
Minimum VDD = 12 V 360 500 445 900 525 980
controllabltMIN nse pulse VDD = 30 V 170 250 176 450 240 480
width
fOSC = 100 kHz, 93 98 93 98 93 100CL = 470 pFMaximumDMAX %duty cycle fOSC = 300 kHz, 87 96 87 96 87 96CL = 470 pF
Modulator
and
KPWM power- 8 10 12 8 10 12 8 10 12 V/V
stage dc
gain
Error Amplifier
Input biasIIB 100 250 130 440 680 1500 nAcurrent
(2) By design only. Not tested in production.
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 5
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10
100
1000
10000
100000
1000000
110 130 150 170 190 210 230
Continous TJ (°C)
E
s
ti
m
a
te
d
L
if
e
(H
o
u
rs
)
Electromigration Fail Mode
TPS40200-HT
SGLS400B –OCTOBER 2009–REVISED MAY 2010 www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
–55°C < TA = TJ < 210°C, VDD = 12 V, fOSC = 100 kHz (unless otherwise noted)
TA = –55°C TO 125°C TA = 175°C (1) TA = 210°CPARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
Open-loopAOL 60 80 60 80 60 80 dBgain (2)
Unity gain
GBWP bandwidth 1.5 3 2.5 2.5 MHz
(2)
Output VFB = 0.6 V,ICOMP(src) source 100 250 100 250 100 250 mACOMP = 1 V
current
Output VFB = 1.2 V,ICOMP(snk) sink 1.0 2.5 1 2.5 1 2.5 mACOMP = 1 V
current
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PACKAGE PARAMETER MIN TYP MAX UNIT
D qJC Junction-to-case thermal resistance 49 °C/W
Junction-to-case thermal resistance (to bottom of case) 5.7
HKJ qJC °C/WJunction-to-case thermal resistance (to top of case lid - as if formed dead bug) 13.7
Figure 3. TPS40200SKGD1 Operating Life Derating Chart
Notes:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package
interconnect life).
6 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
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COMP
FB
SS
ISNS
RC
Soft-Start
and
Overcurrent
E/A and SS
Reference
Enable E/A
700 mV
PWM
Logic
GDRV voltage
swing limited
to (V – 8 V)IN
VDD
GDRV
GND
+
–
+
Driver
OSC
UVLO
5
3
4
2
7
1
8
6
TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
DEVICE INFORMATION
Functional Block Diagram
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME NO.
Switching frequency-setting RC network. Connect capacitor from RC pin to GND pin and resistor from VIN
RC 1 I pin to RC pin. The device may be synchronized to an external clock by connecting an open-drain output to
this pin and pulling it to GND. The pulse width for synchronization should not be excessive.
Soft-start programming pin. Connect capacitor from SS to GND to program soft-start time. Pulling this pin
SS 2 I below 150 mV causes the output switching to stop, placing the device in a shutdown state. The pin also
functions as a restart timer for overcurrent events.
COMP 3 O Compensation. Error amplifier output. Connect control-loop compensation network from COMP to FB.
FB 4 I Feedback. Error amplifier inverting input. Connect feedback resistor network center tap to this pin.
GND 5 Device ground
GDRV 6 O Driver output for external P-channel MOSFET
ISNS 7 I Output voltage.
VDD 8 I System input voltage. Connect local bypass capacitor from VDD to GND.
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 7
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5 10 15 20 25 30 35 40 45 50 55
VDD (V)
0
0.5
1
1.5
2
2.5
3
I+
(
m
A
)
1.56
1.57
1.58
1.59
1.6
1.61
1.62
1.63
1.64
1.65
1.66
1.67
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
I D
D
(m
A
)
149
149.5
150
150.5
151
151.5
152
152.5
153
153.5
154
154.5
155
155.5
156
156.5
157
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
R
e
s
e
t
T
h
re
s
h
o
ld
(m
V
)
Turnon
Turnoff
3.8
4
4.2
4.4
4.6
4.8
5
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
U
V
L
O
(V
)
TPS40200-HT
SGLS400B –OCTOBER 2009–REVISED MAY 2010 www.ti.com
TYPICAL CHARACTERISTICS
QUIESCENT CURRENT
vs QUIESCENT CURRENT
TEMPERATURE vs
(VDD = 12 V) VDD
Figure 4. Figure 5.
SOFT-START THRESHOLD
vs UVLO TURNON AND TURNOFF
TEMPERATURE vs
(VDD = 12 V) TEMPERATURE
Figure 6. Figure 7.
8 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
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98
100
102
104
106
108
110
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
I L
IM
T
h
re
s
h
o
ld
(m
V
)
VDD=12V
VDD=5.5V
VDD=52V
80
85
90
95
100
105
110
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature(°C)
F
re
q
u
e
n
c
y
(k
H
z
)
R = 202 kW
C = 470 pF
5 10 15 20 25 30 35 40 45 50 55
VDD (V)
220
225
230
235
240
245
250
255
260
265
270
275
O
s
c
il
la
to
r
F
re
q
u
e
n
c
y
(
k
H
z
)
R = 68.1 k
C = 470 pF
T = 25°C
W
J
5 10 15 20 25 30 35 40 45 50 55
19.00
19.50
20.00
20.50
21.00
G
a
in
(
d
B
)
T = 25°C
J
VDD (V)
TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
TYPICAL CHARACTERISTICS (continued)
CURRENT-LIMIT THRESHOLD
vsOSCILLATOR FREQUENCY
TEMPERATUREvs
TEMPERATURE (VDD = 12 V)
Figure 8. Figure 9.
OSCILLATOR FREQUENCY POWER-STAGE GAIN
vs vs
VDD VDD
Figure 10. Figure 11.
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 9
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VDD=5.5V
VDD=12V
18
18.5
19
19.5
20
20.5
21
21.5
22
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
G
a
in
(d
B
)
VDD=52V
18
18.5
19
19.5
20
20.5
21
21.5
22
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
G
a
in
(d
B
)
VDD=24V
VDD=12V
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
2.8
3
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature(°C)
V
ra
m
p
(V
)
VDD=36V
VDD=52V
3
3.2
3.4
3.6
3.8
4
4.2
4.4
4.6
4.8
5
5.2
5.4
5.6
5.8
6
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature(°C)
V
ra
m
p
(V
)
TPS40200-HT
SGLS400B –OCTOBER 2009–REVISED MAY 2010 www.ti.com
TYPICAL CHARACTERISTICS (continued)
POWER-STAGE GAIN POWER-STAGE GAIN
vs vs
TEMPERATURE TEMPERATURE
Figure 12. Figure 13.
MODULATOR RAMP AMPLITUDE MODULATOR RAMP AMPLITUDE
vs vs
TEMPERATURE TEMPERATURE
Figure 14. Figure 15.
10 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
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0
1
2
3
4
5
6
V
(V
)
R
A
M
P
5 10 15 20 25 30 35 40 45 50 55
VDD (V)
T = 25°C
J
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
I B
(m
A
)
0
50
100
150
200
250
300
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
O
u
tp
u
t
C
u
rr
e
n
t
(µ
A
)
0
0.5
1
1.5
2
2.5
3
3.5
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
O
u
tp
u
t
C
u
rr
e
n
t
(m
A
)
TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
TYPICAL CHARACTERISTICS (continued)
FEEDBACK AMPLIFIER INPUT BIAS CURRENT
vsMODULATOR RAMP AMPLITUDE
TEMPERATUREvs
VDD (VDD = 12 V)
Figure 16. Figure 17.
COMP SOURCE CURRENT COMP SINK CURRENT
vs vs
TEMPERATURE TEMPERATURE
Figure 18. Figure 19.
Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 11
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7
7.2
7.4
7.6
7.8
8
8.2
8.4
5 10 15 20 25 30 35 40 45 50 55
VDD (V)
V
(V
)
G
A
T
E
V = 25°C
J
5.4
5.6
5.8
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
V
G
A
T
E
(V
)
VDD=52V
VDD=24V
680
700
720
740
760
780
800
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
V
F
B
(m
V
)
VDD = 12 V
VDD = 5.5 V
700
710
720
730
740
750
760
770
780
-65 -40 -15 10 35 60 85 110 135 160 185 210
Temperature (°C)
V
F
B
(m
V
)
TPS40200-HT
SGLS400B –OCTOBER 2009–REVISED MAY 2010 www.ti.com
TYPICAL CHARACTERISTICS (continued)
GATE DRIVE VOLTAGE
vs GATE DRIVE VOLTAGE
TEMPERATURE vs
(VDD = 12 V) VDD
Figure 20. Figure 21.
REFERENCE VOLTAGE REFERENCE VOLTAGE
vs vs
TEMPERATURE TEMPERATURE
Figure 22. Figure 23.
12 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated
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105.0CR
1
f
RCRC
SW
´´
=
A750
R
V
RC
IN
m£
TPS40200-HT
www.ti.com SGLS400B –OCTOBER 2009–REVISED MAY 2010
GENERAL INFORMATION
Overview
The TPS40200 is a nonsynchronous controller with a built-in 200-mA driver, designed to drive high-speed
P-channel FETS up to 500 kHz. Its small size combined with complete functionality makes the part both versatile
and easy to use.
The controller uses a low-value current-sensing resistor in series with the input voltage and the power FET
source connection to detect switching current. When the voltage drop across this resistor exceeds 100 mV, the
part enters a hiccup fault mode at approximately 2% of the operating frequency.
The part uses voltage feedback to an error amplifier that is biased by a precision 700-mV reference.
Feed-forward compensation from the input keeps the pulse-width modulator (PWM) gain constant over the full
input voltage range, eliminating the need to change frequency compensation for different input voltages.
The part also incorporates a soft-start feature where the output follows a slowly rising soft-start voltage,
preventing output-voltage overshoot.
Programming the Operating Frequency
The operating frequency of the controller is determined by an external resistor, RRC, that is connected from the
RC pin to VDD and a capacitor attached from the RC pin to ground. This connection, and the two oscillator
comparators inside the IC, are shown in Figure 24. The oscillator frequency can be calculated from the following
equation:
(1)
Where:
fSW = Clock frequency
RRC = Timing resistor value (in Ω)
CRC = Timing capacitor value (in F)
RRC must be kept large enough that the current through it does not exceed 750 mA when the internal switch(shown in Figure 24) is discharging the timing capacitor. This condition may be expressed by:
(2)
Synchronizing the Oscillator
Figure 24 shows the functional diagram of the TPS40200 oscillator. When synchronizing the oscillator to an
external clock, RC must be pulled below 150 mV for 20 ns or more. The external clock frequency must be higher
than the free-running frequency of the converter as well. When
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