rohs豁免_new0611

成就中国最优秀民族检测品牌 原与您携手共创永攀高峰 关于RoHS指令豁免项目 Exempted Items of RoHS Directive I 欧盟委员会决议2002/95/EC正式公布的RoHS指令之豁免项 II. Exempted items published in EU Commission official journal 1 Mercury in compact fluorescent lamps not exceeding 5 mg per lamp. 1 小型荧光灯中的汞，汞含量不超过5mg/灯。 2 Mercury in straight fluorescent lamps for general purposes not exceeding: 2 普通用途直荧光灯中的汞，汞含量不超过： · Halophosphate 10 mg; 盐磷酸盐 10mg. · Triphosphate with normal lifetime 5 mg; 普通寿命的三磷酸盐5mg · Triphosphate with long lifetime 8 mg. 长寿命的三磷酸盐8mg 3 Mercury in straight fluorescent lamps for special purposes. 3.特殊用途直荧光灯中的汞 4 Mercury in other lamps not specifically mentioned in this Annex. 4.本附录未明确提出的其他灯具中的汞 5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. 5.阴极射线管，电子元件以及荧光管的玻璃中的铅 6 Lead as an alloying element in: 6.铅作为合金元素在： · Steel containing up to 0.35 % lead by weight; 钢里，铅的重量含量不超过0.35 % · Aluminium containing up to 0.4 % lead by weight; 铝里，铅的重量含量不超过0.4% · Copper alloy containing up to 4 % lead by weight. 铜合金里，铅的重量含量不超过4% 7 · Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead). 7. 用于高温融化焊料中的铅（即：锡铅焊料合金中铅含量超过85%） · Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for 成就中国最优秀民族检测品牌 原与您携手共创永攀高峰 telecommunication. 用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网络 基础设施设备中焊料中的铅。 · Lead in electronic ceramic parts (e.g. piezoelectronic devices). 电子陶瓷产品中的铅（如：高压电子装置） 8 Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations. 根据修改关于限制特定危险物质和与制品销售和使用的第76/796/EEC号指令的91/338/EEC 号指令禁止以外的镉电镀。 9 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators. 在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。 9a DecaBDE in polymeric applications. 9a 应用于聚合物中的DecaBDE（十溴二苯醚） 9b Lead in lead-bronze bearing shells and bushes. 9b 用于铅铜合金轴承和衬套中的铅。 11 Lead used in compliant pin connector systems. 11 顺应针连接器系统中的铅。 12 Lead as a coating material for the thermal conduction module c-ring. 12 用于热传导模块C-环的被覆 材料 关于××同志的政审材料调查表环保先进个人材料国家普通话测试材料农民专业合作社注销四查四问剖析材料 中的铅。 13 Lead and cadmium in optical and filter glass. 13 用于光学及滤波器玻璃中的铅和镉。 14 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight. 14 微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之间）。 15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 15．集成 电路 模拟电路李宁答案12数字电路仿真实验电路与电子学第1章单片机复位电路图组合逻辑电路课后答案 倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。 2006年4月21日，欧盟委员会增加了RoHS指令的豁免项目，由原来的15条增加到20条。新增项 目主要针对铅元素，内容如下： 16. Lead in linear incandescent lamps with silicate coated tubes. 16．用于带有硅酸盐灯管的线型白炽灯中的铅。 成就中国最优秀民族检测品牌 原与您携手共创永攀高峰 17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications. 17．用在专业复印领域高强度放电灯(HID)做激发介质中的卤素铅。 18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb). 18．放电管的荧光粉中作为催化剂的铅（铅的重量小于等于1%）可以豁免，当放电管用于含有 磷元素（如BSP (BaSi2O5:Pb)）的日晒灯时，以及用于重氮印刷、平板印刷、捕虫、光化学、 固化 工艺 钢结构制作工艺流程车尿素生产工艺流程自动玻璃钢生产工艺2工艺纪律检查制度q345焊接工艺规程 等等专业领域的灯具时。 19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL). 19．小型节能灯中作为主要汞合金的特定的PbBiSn-Hg 和PbInSn-Hg中的铅，以及作为辅助汞合 金的PbSn-Hg中的铅。 20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD). 20． LCD 的平板荧光灯前后基板键合时所用玻璃中的铅。 欧盟委员会 2006 年 10 月 12 日豁免决议——2006/690/EC,2006/691/EC,2006/692/EC 欧盟委员会近期修订了欧盟指令 2002/95/EC 附录关于铅和镉应用的豁免规定、水晶玻璃中 铅的豁免规定，以及六价铬应用的豁免规定，具体内容如下： 21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass. 21、用在硅硼玻璃 表 关于同志近三年现实表现材料材料类招标技术评分表图表与交易pdf视力表打印pdf用图表说话 pdf 面瓷釉上的印刷油墨中的铅和镉； 22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems. 22、在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅； 23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames. 23、小螺距零部件表面处理中的铅（螺距不超过 0.65mm 且带镍铁边框的连接器，以及螺距不超 过 0.65mm 且带铜边框的连接器不在豁免之内） 成就中国最优秀民族检测品牌 原与您携手共创永攀高峰 24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. 24、通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅； 25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. 25、等离子显示屏（PDP）及表面传导式电子发射显示器（SED）构件中所用的氧化铅，特别是 在玻璃前后绝缘层中所用的氧化铅、总线电极中的氧化铅、黑条（彩色显像管）中的氧化铅、 地址电极中的氧化铅、阻挡层肋柱的氧化铅、密封玻璃料中的氧化铅，以及封装玻璃中的氧化 铅、环状玻璃中的氧化铅、印墨中的氧化铅； 26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps. 26、黑蓝灯（BLB）玻璃封装中的氧化铅； 27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.’ 27、用作高性能扬声器（用在长时间操作 125 分贝以上的音响系统）的传感器中焊料的铅合金。 28. Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007. 28、用于防腐或屏蔽电磁干扰，用在特定仪器设备中（欧盟指令 2002/96/EC 第三类规定的 IT 和通讯设备）的金属片或金属扣件上的防腐涂层中的六价铬。这项豁免将于 2007 年 7 月 1 日停 止。 29. Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3 and 4) of Council Directive 69/493/EEC (*). 29、水晶玻璃中铅含量的限定依照欧盟指令 69/493/EEC 附件Ⅰ(第 1、2、3、4 类)。 注: 若中文译文与英文原文意思上不一致, 以英文原文为准 Remark: If the Chinese translation contradicts the English text, the English text will prevail. Prepared by CTI CTI制造