USB协议规范

Universal Serial Bus Micro-USB Cables and Connectors Specification Revision 1.01 April 4, 2007 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 2 Revision History Revision Issue Date Comment 0.6 1/30/2006 Revisions to all sections 0.7 3/24/2006 Added revised Micro-USB drawings to Rev.0.8 0.8 4/19/2006 Editorial changes and additions by Jan Fahllund (Nokia) 0.8b 4/26/2006 Corrections to the 0.8 version (based by comments from contributors) 0.9 6/7/2006 Corrections based on comments from the 0.8b version 1.0RC 8/2/2006 Added lubricant recommendation, LLRC delta change specified 1.01RC 11/10/2006 Editorial changes and addition based on Oct-06 USB-IF CCWG meeting. 1.02RC 12/10/2006 Shell material thickness tolerances changed so that material can be 0.25 mm or 0.3 mm; edited three pictures (Figure 4-10, 4-11 and 4- 12). 1.03RC 12/11/2006 Two pictures edited (Figure 4-8 and 4-9). In fig 4-8 max height to be 2.8mm MAX. In fig 4-9 R0.25mm MAX to be R0.30mm MAX. 1.0RC3 12/19/2006 For BoD approval 1.0 1/12/2007 Approved 1.0 1/22/2007 Cosmetic edits for publication 1.01 4/4/2007 Editorial corrections and additions to contributor list. Reinserted shell and plug material requirements as section 6.10. Clarified wording on Plating Recommendations. Copyright © 2007 USB Implementers Forum, Inc. (USB-IF). All rights reserved. A LICENSE IS HEREBY GRANTED TO REPRODUCE THIS SPECIFICATION FOR INTERNAL USE ONLY. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, IS GRANTED OR INTENDED HEREBY. USB-IF AND THE AUTHORS OF THIS SPECIFICATION EXPRESSLY DISCLAIM ALL LIABILITY FOR INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, RELATING TO IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. USB-IF AND THE AUTHORS OF THIS SPECIFICATION ALSO DO NOT WARRANT OR REPRESENT THATSUCH IMPLEMENTATION(S) WILL NOT INFRINGE THE INTELLECTUAL PROPERTY RIGHTS OF OTHERS. THIS SPECIFICATION IS PROVIDED "AS IS" AND WITH NO WARRANTIES, EXPRESS OR IMPLIED, STATUTORY OR OTHERWISE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED. NO WARRANTY OF MERCHANTABILITY, NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF FITNESS FOR ANY PARTICULAR PURPOSE, AND NOWARRANTY ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. IN NO EVENT WILL USB-IF OR USB-IF MEMBERS BE LIABLE TO ANOTHER FOR THE COST OF PROCURING SUBSTITUTE GOODS OR SERVICES, LOST PROFITS, LOSS OF USE, LOSS OF DATA OR ANY INCIDENTAL, CONSEQUENTIAL, INDIRECT, ORSPECIAL DAMAGES, WHETHER UNDER CONTRACT, TORT, WARRANTY, OR OTHERWISE, ARISING IN ANY WAY OUT OF THE USE OF THIS SPECIFICATION, WHETHER OR NOT SUCHPARTY HAD ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. All product names are trademarks, registered trademarks, or service marks of their respective owners. MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 3 Contributors Mark Rodda, (editor) Motorola Kevin Fang, Longwell Electronics Jan Fahllund, (editor) Nokia Morgan Jair, Main Super Co. Jim Koser, (CCWG Chairman), Foxconn Tom Kawaguchi, Matsushita Electric Works Glen Chandler, Advanced-Connectek (Acon) Ron Ward, Matsushita Electric Works Charles Wang, Advanced-Connectek (Acon) Satoshi Yamamoto, Matsushita Electric Works Toshinori Sasaki, Across Techno Yasuhiko Shinohara, Mitsumi Minoru Ohara, Allion Atsushi Nishio, Mitsumi Brad Brown, ATL Hitoshi Kawamura, Mitsumi Christopher Mattson, ATL Scott Sommers, Molex Marcus Darrington, ATL Kevin Delaney, Molex Jaremy Flake, ATL Technology Kieran Wright, Molex George Olear, Contech Research Padraig McDaid, Molex Roy Ting, Elka Mikko Poikselka, Molex Sophia Liu, ETC Sam Liu, Newnex Technology Corp. Bill Northey, FCI Richard Petrie, Nokia Tsuneki Watanabe, Foxconn Kai Silvennoinen, Nokia Jim Zhao, Foxconn Panu Ylihaavisto, Nokia David Ko, Foxconn Arthur Zarnowitz, Palm Jong Tseng, Foxconn Douglas Riemer, SMK Jack Lu, Foxlink Eric Yagi, SMK Tim Chang, Foxlink Abid Hussain, Summit Microelectronics Sathid Inthon, Fujikura Kaz Osada, Tyco Toshi Mimura, Fujijura Masaru Ueno, Tyco Alan Berkema, Hewlett-Packard Yoshikazu Hirata, Tyco Karl Kwiat, Hirose Ed Beeman, USB Implementers Forum Shinya Tono, Hirose Mark Paxson, USB Implementers Forum Kazu Ichikawa, Hirose Ryozo Koyama, Hirose Yousuke Takeuchi, Hirose Tsuyoshi Kitagawa, Hosiden Jim Eilers, Hosiden Kazuhiro Saito, JAE Ron Muir, JAE Mark Saubert, JAE Yasuhira Miya, JST Takahiro Diguchi, JST Yoichi Nakazawa, JST MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 4 Table of Contents 1 Introduction................................................................................................................................................6 1.1 General...............................................................................................................................................6 1.2 Objective of the Specification .............................................................................................................6 1.3 Intended Audience/Scope ..................................................................................................................6 1.4 Related Documents............................................................................................................................6 2 Acronyms and Terms................................................................................................................................7 3 Significant Features ..................................................................................................................................8 3.1 USB 2.0 Specification Compliance ....................................................................................................8 3.2 On-The-Go Device .............................................................................................................................8 3.3 Connectors .........................................................................................................................................8 3.4 Compliant Cable Assemblies .............................................................................................................8 3.5 Plug Overmolds ..................................................................................................................................9 4 Cables and Connectors ..........................................................................................................................10 4.1 Introduction.......................................................................................................................................10 4.2 Micro-Connector Mating ...................................................................................................................10 4.3 Color Coding.....................................................................................................................................11 4.4 Device, Cable and Adapter Delays ..................................................................................................11 4.5 Compliant Usage of Connectors and Cables...................................................................................12 4.5.1 Cables.................................................................................................................................12 4.5.2 Overmolds...........................................................................................................................12 4.5.3 Mechanical Interfaces.........................................................................................................12 4.5.4 Surface mount standard version drawings .........................................................................12 4.5.5 DIP-type and Midmount-type receptacles ..........................................................................12 4.5.6 Connector Keying ...............................................................................................................12 4.5.7 Right Angle Plugs ...............................................................................................................12 4.5.8 Adapters..............................................................................................................................13 4.6 Drawings...........................................................................................................................................13 5 Electrical Compliance Requirements ....................................................................................................33 5.1 Data Rates Beyond USB 2.0 (480Mb/s -->).....................................................................................33 5.2 Low Level Contact Resistance.........................................................................................................33 5.3 Contact Current Rating.....................................................................................................................33 5.3.1 Signal Contacts Only (2, 3, and 4)......................................................................................33 5.3.2 With Power Applied Contacts (1 and 5)..............................................................................33 6 Mechanical Compliance Requirements.................................................................................................34 6.1 Operating Temperature Range ........................................................................................................34 6.1.1 Option I ...............................................................................................................................34 6.1.2 Option II ..............................................................................................................................34 6.2 Insertion Force..................................................................................................................................34 6.3 Extraction Force ...............................................................................................................................34 6.4 Plating...............................................................................................................................................34 6.4.1 Option I ...............................................................................................................................35 6.4.2 Option II ..............................................................................................................................35 6.5 Solderability ......................................................................................................................................35 6.6 Peel Strength (Reference Only) .......................................................................................................35 6.7 Wrenching Strength (Reference Only) .............................................................................................35 6.8 Lead Co-Planarity.............................................................................................................................35 6.9 RoHS Compliance............................................................................................................................36 6.10 Shell & Latch Materials.....................................................................................................................36 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 5 Figures Figure 4-1 Micro-A to Micro-B Cable ..............................................................................................................14 Figure 4-2 Standard-A to Micro-B Cable .........................................................................................................15 Figure 4-3 Micro-A to Captive Cable...............................................................................................................16 Figure 4-4 Micro-A Plug Overmold, Straight...................................................................................................17 Figure 4-5 Micro-B Plug Overmold, Straight...................................................................................................18 Figure 4-6 Micro-A Plug Interface ...................................................................................................................19 Figure 4-7 Micro-B Plug Interface ...................................................................................................................20 Figure 4-8 Micro-A/B Plug Interface (Cut-section)..........................................................................................21 Figure 4-9 Micro-AB receptacle interface ........................................................................................................22 Figure 4-10 Micro-B receptacle interface........................................................................................................23 Figure 4-11 Micro-AB Receptacle Design ......................................................................................................24 Figure4-12 Micro-B Receptacle Design..........................................................................................................25 Figure 4-13 Micro-A Plug Blockage ................................................................................................................26 Figure 4-14 Micro-B Plug Blockage ................................................................................................................27 Figure 4-15 Micro-A Plug, Side Right Angle ...................................................................................................28 Figure 4-16 Micro-A Plug, Down Right Angle .................................................................................................29 Figure 4-17 Micro-B Plug, Side Right Angle ...................................................................................................30 Figure 4-18 Micro-B Plug, Down Right Angle .................................................................................................31 Figure 4-19 Adapter, Standard-A receptacle to Micro-A plug.........................................................................32 Tables Table 4-1. Plugs Accepted By Receptacles....................................................................................................10 Table 4-2. Micro-A Plug Pin Assignments ......................................................................................................10 Table 4-3. Color Coding for Plugs and Receptacles ......................................................................................11 Table 4-4. Maximum Delay for Micro-Connector and Cable ..........................................................................11 Table 4-5. Maximum Delay for Standard Connector Cable............................................................................11 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 6 1 Introduction 1.1 General USB has become a popular interface for exchanging data between cell phone and portable devices. Many of these devices have become so small it is impossible to use standard USB components as defined in the USB 2.0 specification. In addition the durability requirements of the Cell Phone and Portable Devices market exceed the specifications of the current interconnects. Since Cell Phones and other small Portable Devices are the largest market potential for USB, this specification is addressing this very large market while meeting all the requirements for electrical performance within the USB 2.0 specification. 1.2 Objective of the Specification The purpose of this document is to define the requirements and features of a Micro-USB connector that will meet the current and future needs of the Cell Phone and Portable Devices markets, while conforming to the USB 2.0 specification for performance, physical size and shape of the Micro-USB interconnect. This is not a stand-alone document. Any aspects of USB that are not specifically changed by this specification are governed by the USB 2.0 Specification and USB On-The-Go Supplement. 1.3 Intended Audience/Scope Cell phone and Portable Devices have become so thin that the current Mini-USB does not fit well within the constraints of future designs. Additional requirements for a more rugged connector that will have durability past 10,000 cycles and still meet the USB 2.0 specification for mechanical and electrical performance was also a consideration. The Mini-USB could not be modified and remain backward compatible to the existing connector as defined in the USB OTG specification. 1.4 Related Documents USB 2.0 USB OTG Supplement MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 7 2 Acronyms and Terms This chapter lists and defines terms and abbreviations used throughout this specification. A-Device A device with a Type-A plug inserted into its receptacle. The A-device supplies power to VBUS and is host at the start of a session. If the A- device is On-The-Go, it may relinquish the role of host to an On-The-Go B-device under certain conditions, Application A generic term referring to any software that is running on a device that can control the behavior or actions of the USB port(s) on a device. B-Device A device with a Type-B plug inserted into its receptacle. The B-device is a peripheral at the start of a session. If the B-device is OTG, it may be granted the role of host from an OTG A-device. DIP-type A connector with contact and shield solder tails that are soldered through the printed circuit board FS Full Speed (max 12Mb/s) Higher than HS (480Mb/s ---> 5 Gb/s) HS High Speed (max 480 Mb/s) Host A physical entity that is attached to a USB cable and is acting in the role of the USB host as defined in the USB Specification, Revision 2.0. This entity initiates all data transactions and provides periodic Start of Frames. HNP Host Negotiation Protocol ID Identification. Denotes the pin on the Micro connectors that is used to differentiate a Micro-A plug from a Micro-B plug. LS Low Speed (max 1,5 Mb/s) Midmount-type A connector that is mounted in a cut-out in the printed circuit board between the top and bottom surfaces. OTG On-The-Go OTG device A device with the host and peripheral capabilities Peripheral A physical entity that is attached to a USB cable and is currently operating as a “device” as defined in the USB Specification, Revision 2.0. The Peripheral responds to low level bus requests from the Host. PCB Printed circuit board USB Universal Serial Bus USB-IF USB Implementers Forum MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 8 3 Significant Features This section identifies the significant features of the Micro-USB specification. The purpose of this section is not to present all the technical details associated with each major feature, but rather to highlight its existence. Where appropriate, this section references other parts of the document where further details can be found. 3.1 USB 2.0 Specification Compliance Any device with Micro-USB features is first and foremost a USB peripheral that is compliant with the USB 2.0 specification. 3.2 On-The-Go Device Any OTG Micro-USB device shall conform to the OTG requirements as set forth in the On-The-Go Supplement to the USB 2.0 Specification. 3.3 Connectors The USB 2.0 specification defines the fol