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TPCA8048-H TPCA8048-H 2009-07-02 1 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (U-MOSⅥ-H) TPCA8048-H Switching Regulator Applications Motor Drive Applications DC-DC Converter Applications • Small footprint due to a small and thin package ...

TPCA8048-H
TPCA8048-H 2009-07-02 1 TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (U-MOSⅥ-H) TPCA8048-H Switching Regulator Applications Motor Drive Applications DC-DC Converter Applications • Small footprint due to a small and thin package • High-speed switching • Small gate charge: QSW = 19 nC (typ.) • Low drain-source ON-resistance: RDS (ON) = 4.3 mΩ (typ.) • High forward transfer admittance: |Yfs| = 118 S (typ.) • Low leakage current: IDSS = 10 μA (max) (VDS = 60 V) • Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 1.0 mA) Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit Drain-source voltage VDSS 60 V Drain-gate voltage (RGS = 20 kΩ) VDGR 60 V Gate-source voltage VGSS ±20 V DC (Note 1) ID 35 Drain current Pulsed (Note 1) IDP 105 A Drain power dissipation (Tc = 25℃) PD 45 W Drain power dissipation (t = 10 s) (Note 2a) PD 2.8 W Drain power dissipation (t = 10 s) (Note 2b) PD 1.6 W Single-pulse avalanche energy (Note 3) EAS 88 mJ Avalanche current IAR 35 A Repetitive avalanche energy (Tc = 25℃) (Note 4) EAR 2.46 mJ Channel temperature Tch 150 °C Storage temperature range Tstg −55 to 150 °C Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). This transistor is an electrostatic-sensitive device. Handle with care. Unit: mm 8 5 1 4 0. 6 ± 0 .1 4.25 ± 0.2 0. 8 ± 0 .1 3. 5 ± 0 .2 1. 1 ± 0 .2 0. 16 6 ± 0 .0 5 0. 95 ± 0. 05 5.0 ± 0.2 S S 0.05 A 0.595 0.4 ± 0.1 6. 0 ± 0 .3 5. 0 ± 0 .2 1 4 0.15 ± 0.05 8 5 1.27 A 0.05 M JEDEC ⎯ JEITA ⎯ TOSHIBA 2-5Q1A Weight: 0.069 g (typ.) Circuit Configuration 8 6 1 2 3 7 5 4 1,2,3:SOURCE 4:GATE 5,6,7,8:DRAIN TPCA8048-H 2009-07-02 2 Thermal Characteristics Characteristic Symbol Max Unit Thermal resistance, channel to case (Tc = 25℃) Rth (ch-c) 2.78 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Rth (ch-a) 44.6 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Rth (ch-a) 78.1 °C/W Marking (Note 5) Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) Note 3: VDD = 24 V, Tch = 25°C (initial), L = 100 μH, RG = 25 Ω, IAR = 35 A Note 4: Repetitive rating: pulse width limited by maximum channel temperature Note 5: ※ Part number TPCA 8048-H * Weekly code: (Three digits) Week of manufacture (01 for the first week of the year, continuing up to 52 or 53) Year of manufacture (The last digit of the year) Lot No. (a) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (b) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) TPCA8048-H 2009-07-02 3 Electrical Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Gate leakage current IGSS VGS = ±20 V, VDS = 0 V ⎯ ⎯ ±100 nA Drain cutoff current IDSS VDS = 60 V, VGS = 0 V ⎯ ⎯ 10 μA V (BR) DSS ID = 10 mA, VGS = 0 V 60 ⎯ ⎯ Drain-source breakdown voltage V (BR) DSX ID = 10 mA, VGS = −20 V 45 ⎯ ⎯ V Gate threshold voltage Vth VDS = 10 V, ID = 1.0 mA 1.3 ⎯ 2.3 V VGS = 4.5 V, ID = 18 A ⎯ 4.8 7.1 Drain-source ON-resistance RDS (ON) VGS = 10 V, ID = 18 A ⎯ 4.3 6.6 mΩ Forward transfer admittance |Yfs| VDS = 10 V, ID = 18 A 59 118 ⎯ S Input capacitance Ciss ⎯ 5800 7540 Reverse transfer capacitance Crss ⎯ 210 315 Output capacitance Coss VDS = 10 V, VGS = 0 V, f = 1 MHz ⎯ 650 ⎯ pF Gate resistance rg VDS = 10 V, VGS = 0 V, f = 1 MHz ⎯ 1.0 1.5 Ω Rise time tr ⎯ 3.6 ⎯ Turn-on time ton ⎯ 13 ⎯ Fall time tf ⎯ 7.3 ⎯ Switching time Turn-off time toff Duty ≤ 1%, tw = 10 μs ⎯ 66 ⎯ ns VDD ≈ 48 V, VGS = 10 V, ID = 35 A ⎯ 90 ⎯ Total gate charge (gate-source plus gate-drain) Qg VDD ≈ 48 V, VGS = 5 V, ID = 35 A ⎯ 46 ⎯ Gate-source charge 1 Qgs1 ⎯ 16 ⎯ Gate-drain (“Miller”) charge Qgd ⎯ 12 ⎯ Gate switch charge QSW VDD ≈ 48 V, VGS = 10 V, ID = 35 A ⎯ 19 ⎯ nC Source-Drain Ratings and Characteristics (Ta = 25°C) Characteristic Symbol Test Condition Min Typ. Max Unit Drain reverse current Pulse (Note 1) IDRP ⎯ ⎯ ⎯ 105 A Forward voltage (diode) VDSF IDR = 35 A, VGS = 0 V ⎯ ⎯ −1.2 V R L = 1 .6 7Ω VDD ≈ 30 V 0 V VGS 10 V 4. 7 Ω ID = 18 A VOUT TPCA8048-H 2009-07-02 4 1 0.1 10 100 100 10 VGS = 4.5 V 10 1 10 100 0.1 1 25 100 Ta = −55°C 100 1 1000 10 0.1 0 0.3 0.5 0 ID = 35 A 2 4 6 8 9 18 0.2 10 0.4 0.1 0 0 1 2 3 5 80 Ta = −55°C 25 100 40 4 60 20 ID – VDS 2 0 0.8 VGS = 2.5 V 1.6 1.2 0.4 2.7 3 2.8 2.6 10 4.5 3.8 2.9 3.2 3.4 100 60 40 0 80 20 6 ID – VDS 0 0.2 0.4 0.6 0.8 VGS = 2.4 V 2.5 2.8 10 1 4.5 2.6 2.7 3 3.6 2.9 3.2 6 50 30 20 0 40 10 Drain-source voltage VDS (V) D ra in c ur re nt I D (A ) Drain current ID (A) RDS (ON) – ID D ra in -s ou rc e O N -r es is ta nc e R D S (O N ) ( m Ω) Drain current ID (A) ⎪Yfs⎪ – ID Fo rw ar d tra ns fe r a dm itt an ce |Y fs | ( S ) Drain-source voltage VDS (V) D ra in c ur re nt I D (A ) Gate-source voltage VGS (V) ID – VGS D ra in c ur re nt I D (A ) D ra in -s ou rc e vo lta ge V D S ( V ) Gate-source voltage VGS (V) VDS – VGS Common source Ta = 25°C Pulse test Common source VDS = 10 V Pulse test Common source Ta = 25°C Pulse test Common source Ta = 25°C Pulse test Common source Ta = 25°C Pulse test Common source VDS = 10 V Pulse test TPCA8048-H 2009-07-02 5 0 160 VDD = 48 V VDS = 48 V 12 24 80 12 4 16 0 40 120 8 20 12 24 50 30 20 0 40 10 0 0.5 1.5 −80 −40 0 40 80 120 160 2.5 1.0 2.0 10 0.1 100 1000 10000 1 10 100 Ciss Coss Crss 0 0.1 −0.2 1000 −0.6 −0.8 −1.2 VGS = 0 V 10 4.5 2 3 −0.4 10 100 1 1 −1.0 160 −40 0 40 80 120 −80 0 VGS = 10 V 6 VGS = 4.5 V 12 ID = 9, 18, 35 A 8 2 ID = 9, 18, 35 A 10 4 Drain-source voltage VDS (V) Capacitance – VDS C ap ac ita nc e C (p F) Drain-source voltage VDS (V) IDR – VDS D ra in re ve rs e cu rr en t I D R (A ) G at e th re sh ol d vo lta ge V th (V ) Ambient temperature Ta (°C) Vth – Ta Ambient temperature Ta (°C) RDS (ON) – Ta D ra in -s ou rc e O N -re si st an ce R D S (O N ) ( m Ω) Total gate charge Qg (nC) D ra in -s ou rc e vo lta ge V D S ( V ) Dynamic input/output characteristics G at e- so ur ce v ol ta ge V G S (V ) Common source Ta = 25°C Pulse test Common source VGS = 0 V f = 1 MHz Ta = 25°C Common source VDS = 10 V ID = 1 mA Pulse test Common source Pulse test Common source ID = 35 A Ta = 25°C Pulse test TPCA8048-H 2009-07-02 6 t =1 ms* VDSS max t =10 ms* 10 100 1000 0.1 10 1 1 100 0.01 0.1 1 0.001 10 100 1000 0.01 0.1 1 10 100 1000 (2) (1) (3) 0.1 3.0 2.0 0 1.5 2.5 1.0 0.5 0 40 80 120 160 (1) (2) Tr an si en t t he rm al im pe da nc e r th (° C /W ) Pulse width tw (s) rth – tw (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) (3) Tc = 25℃ Single - pulse D ra in c ur re nt I D (A ) Drain-source voltage VDS (V) Safe operating area ID max (Pulse) * * Single-pulse Ta = 25℃ Curves must be derated linearly with increase in temperature. Case temperature TC (°C) PD – Tc D ra in p ow er d is si pa tio n P D (W ) Ambient temperature Ta (°C) PD – Ta D ra in p ow er d is si pa tio n P D (W ) (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) t = 10 s 50 30 20 10 0 0 40 80 120 160 40 TPCA8048-H 2009-07-02 7 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (U-MOSⅥ-H) Circuit Configuration Absolute Maximum Ratings (Ta  25°C) Thermal Characteristics Marking (Note 5) Electrical Characteristics (Ta  25°C) Source-Drain Ratings and Characteristics (Ta ( 25°C) RESTRICTIONS ON PRODUCT USE
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