UNISONIC TECHNOLOGIES CO., LTD
75N75 Power MOSFET
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Copyright © 2005 Unisonic Technologies Co., Ltd. QW-R502-097,A
75Amps, 75Volts
N-CHANNEL POWER MOSTFET
DESCRIPTION
The UTC 75N75 is n-channel enhancement mode power field
effect transistors with stable off-state characteristics, fast
switching speed, low thermal resistance, usually used at telecom
and computer application.
FEATURES
* RDS(ON) = 12.5mΩ @VGS = 10 V
* Ultra low gate charge ( typical 90 nC )
* Fast switching capability
* Avalanche energy Specified
* Improved dv/dt capability, high ruggedness
SYMBOL
1.Gate
3.Source
2.Drain
TO-220
1
TO-252
TO- 2511
1
1
TO-220F
*Pb-free plating product number: 75N75L
ORDERING INFORMATION
Order Number Pin Assignment
Normal Lead Free Plating
Package
1 2 3
Packing
75N75-TA3-T 75N75L-TA3-T TO-220 G D S Tube
75N75-TF3-T 75N75L-TF3-T TO-220F G D S Tube
75N75-TM3-T 75N75L-TM3-T TO-251 G D S Tube
75N75-TN3-R 75N75L-TN3-R TO-252 G D S Tape Reel
75N75-TN3-T 75N75L-TN3-T TO-252 G D S Tube
Note: Pin Assignment: G: Gate D: Drain S: Source
75N75L-TA3-T
(1)Packing Type
(2)Package Type
(3)Lead Plating
(1) T: Tube, R: Tape Reel
(2) TA3: TO-220, TF3: TO-220F, TM3: TO-251,
TN 3: TO-252
(3) L: Lead Free Plating, Blank: Pb/Sn
75N75 Power MOSFET
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ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL RATINGS UNIT
Drain to Source Voltage VDSS 75 V
TC = 25℃ 75 A Continuous Drain Current
TC = 100℃
ID 56 A
Drain Current Pulsed (Note 1) IDM 300 A
Gate to Source Voltage VGS ±20 V
Single Pulsed (Note 2) EAS 900 mJ Avalanche Energy
Repetitive (Note 1) EAR 300 mJ
Peak Diode Recovery dv/dt (Note 3) dv/dt 15 V/ns
TC = 25℃ 220 W Total Power Dissipation
Derating above 25℃ PD 1.4 W/℃
Junction Temperature TJ +150 ℃
Storage Temperature TSTG -55 ~ +150 ℃
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
THERMAL DATA
PARAMETER SYMBOL MIN TYP MAX UNIT
Thermal Resistance Junction-Ambient θJA 62.5 ℃/W
Thermal Resistance Junction-Case θJC 0.8 ℃/W
Thermal Resistance Case-Sink θCS 0.5 ℃/W
ELECTRICAL CHARACTERISTICS (TC = 25℃, unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Off Characteristics
Drain-Source Breakdown Voltage BVDSS VGS = 0 V, ID = 250 µA 75 V
Breakdown Voltage Temperature
Coefficient
BV△ DSS/△TJ ID = 1mA, Referenced to 25℃ 0.08 V/℃
VDS = 75 V, VGS = 0 V 20 µA
Drain-Source Leakage Current IDSS VDS = 75 V, VGS = 0 V,
TJ = 150℃ 250 µA
Gate-Source Leakage Current VGS = 20V, VDS = 0 V 100 nA
Gate-Source Leakage Reverse
IGSS VGS = -20V, VDS = 0 V -100 nA
On Characteristics
Gate Threshold Voltage VGS(TH) VDS = VGS, ID = 250 µA 2.0 4.0 V
Static Drain-Source On-State
Resistance
RDS(ON) VGS = 10 V, ID = 48 A 12.5 15 mΩ
Dynamic Characteristics
Input Capacitance CISS 3300 pF
Output Capacitance COSS 530 pF
Reverse Transfer Capacitance CRSS
VGS = 0 V, VDS = 25 V
f = 1MHz
80 pF
Switching Characteristics
Turn-On Delay Time tD(ON) 12 ns
Rise Time tR 79 ns
Turn-Off Delay Time tD(OFF) 80 ns
Fall Time tF
VDD = 38V, ID =48A,
VGS=10V, (Note 4, 5)
52 ns
Total Gate Charge QG 90 140 nC
Gate-Source Charge QGS 20 35 nC
Gate-Drain Charge (Miller Charge) QGD
VDS = 60V, VGS = 10 V
ID = 48A, (Note 4, 5) 30 45 nC
75N75 Power MOSFET
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ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Source-Drain Diode Ratings and Characteristics
Continuous Source Current IS 75
Pulsed Source Current ISM
300
A
Diode Forward Voltage VSD IS = 48A, VGS = 0 V 1.4 V
Reverse Recovery Time trr 90 ns
Reverse Recovery Charge Qrr
IS = 48A, VGS = 0 V
dIF / dt = 100 A/µs 300 µC
Note 1. Repeativity rating: pulse width limited by junction temperature
2. L=0.24mH, IAS=48A, RG=20Ω, Starting TJ=25℃
3. ISD≤48A, di/dt≤300A/µs, VDD≤BVDSS, Starting TJ=25℃
4. Pulse Test: Pulse Width≤300µs,Duty Cycle≤2%
5. Essentially independent of operating temperature.
75N75 Power MOSFET
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TEST CIRCUITS AND WAVEFORMS
Same Type
as D.U.T.
L
VDDDriver
VGS
RG
-
VDS
D.U.T. +
* dv/dt controlled by RG
* ISD controlled by pulse period
* D.U.T.-Device Under Test
P. W.
Period
D=VGS
(Driver)
ISD
(D.U.T.)
IFM, Body Diode Forward Current
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
Body Diode Forward Voltage Drop
VDD
10V
VDS
(D.U.T.)
-
+
VGS=
P.W.
Period
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
Fig. 1B Peak Diode Recovery dv/dt Waveforms
75N75 Power MOSFET
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TEST CIRCUITS AND WAVEFORMS (Cont.)
VGS
D.U.T.
RG
10V
VDS
RL
VDD
VDS 90%
10%
VGS
tD(ON)
tR
tD(OFF)
tFPulse Width ≤ 1μs
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit Fig. 2B Switching Waveforms
50kΩ
0.3μF
DUT
VDS
Same Type
as D.U.T.
10V0.2μF
12V
Charge
QGS QGD
QG
VGS
1mA
VG
Fig. 3A Gate Charge Test Circuit Fig. 3B Gate Charge Waveform
D.U.T.
RD
10V
VDS
L
VDD
tp IAS
tp Time
BVDSS
Fig. 4A Unclamped Inductive Switching Test Circuit Fig. 4B Unclamped Inductive Switching Waveforms
75N75 Power MOSFET
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TYPICAL CHARACTERISTICS
102
101
100
10110-1 100
Drain-Source Voltage, VDS (V)
D
ra
in
C
ur
re
nt
, I
D
(A
)
On-State Characteristics
102
101
100
2
Gate-Source Voltage, VGS (V)
D
ra
in
C
ur
re
nt
, I
D
(A
)
Transfer Characteristics
4 6 8 103 5 7 9
V GS
Top: 15V
10 V
8 V
7 V
6 V
5 .5V
5V
Bottorm : 4.5V
4.5V
Note:
1. VDS=25V
2. 20µs Pulse Test
15
0℃
25
℃
11
0D
ra
in
-S
ou
rc
e
O
n-
R
es
is
ta
nc
e,
R
D
S(
O
N)
(m
Ω
)
Drain Current, ID (A)
30 70 80
12
13
14
15
On-Resistance Variation vs. Drain
Current and Gate Voltage
102
101
100
0.2
Source-Drain Voltage, VSD (V)
R
ev
er
se
D
ra
in
C
ur
re
nt
, I
SD
(A
)
Reverse Drain Current vs. Allowable Case
Temperature
1.60.4 0.6 0.8 1.0 1.2 1.410 50 100
*Note:
1. VGS=0V
2. 250µs Test
25℃
150℃
VGS=10V
20 40 60 90
4000
0
5
Drain-Source Voltage, VDC (V)
C
ap
ac
ita
nc
e
(p
F
)
Capacitance Characteristics
(Non-Repetitive)
1000
2000
10 0
G
at
e-
to
-S
ou
rc
e
V
ol
ta
ge
, V
G
S
(V
)
Total Gate Charge, QG (nC)
5 15 20 25
8
10
12
Gate Charge Characteristics
10
6
4
2
0
25
6000
CISS
COSS
3000
5000
15 20 30 35
*Note:
1. VGS=0V
2. f = 1MHzCRSS
30 35 40 45
VDS=60V
VDS=38V
*Note: ID=48A
CISS=CGS+CGD (CDS=shorted)
COSS=CDS+CGD
CRSS=CGD
75N75 Power MOSFET
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TYPICAL CHARACTERISTICS(Cont.)
-100
D
ra
in
-S
ou
rc
e
B
re
ak
do
w
n
V
ol
ta
ge
,
B
V
D
SS
(N
or
m
al
iz
ed
)
Junction Temperature, TJ (℃)
-50 50 200
*Note:
1. VGS=0V
2. ID=250µA
100 150
1.2
Breakdown Voltage Variation vs.
Junction Temperature
0
1.1
1.0
0.9
0.8 D
ra
in
-S
ou
rc
e
O
n-
R
es
is
ta
nc
e,
R
D
S(
O
N)
,
(N
or
m
al
iz
ed
)
-100 50 100 150
3.0
On-Resistance Variation vs.
Junction Temperature
0
2.0
1.0
0.5
0.0
1.5
2.5
Junction Temperature, TJ (℃)
*Note:
1. VGS=10V
2. ID=3.5A
-50 200
10
1
0.1
Drain-Source Voltage, VD (V)
D
ra
in
C
ur
re
nt
,
I D
,(A
)
Maximum Safe Operating
1
100
D
ra
in
C
ur
re
nt
, I
D
(A
)
Case Temperature, TC (℃)
75 100 150
70
Maximum Drain Current vs. Case
Temperature
0
1255025
20
50
10 100 1000
DC
Operation in This
Area by RDS(ON)
*Note:
1. Tc=25℃
2. TJ=150℃
3.Single Pulse
10ms 1ms
100µs
10
30
40
60
0.01
Square Wave Pulse Duration, t1 (sec)
Th
er
m
al
R
es
po
ns
e,
Z
θ
JC
(t)
11E-5
1
0.1
0.1 10
0.01
Transient Thermal Response Curve
0.02
0.1
0.2
1E-4 1E-3 0.01
*Note:
1. ZθJC (t) = 0.88℃/W Max.
2. Duty Factor , D=t1/t2
3. TJ -TC=PDM×ZθJC (t)
Single pulse
D=0.5
0.05
75N75 Power MOSFET
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UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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