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首页 USB3.0协议规范(英文完整版)

USB3.0协议规范(英文完整版).pdf

USB3.0协议规范(英文完整版)

8号菜刀
2011-11-13 0人阅读 举报 0 0 暂无简介

简介:本文档为《USB3.0协议规范(英文完整版)pdf》,可适用于IT/计算机领域

UniversalSerialBusSpecificationHPIntelCorporationMicrosoftCorporationNECCorporationNXPSemiconductorsTexasInstrumentsIncorporatedRevisionJuly,UniversalSerialBusSpecification,RevisioniiRevisionHistoryRevisionCommentsIssueDateFirstconsolidatedreviewdraftOctober,UpdatestoChapters,,,,andNovember,AddedChapters,,andandAppendixesA,B,andCUpdatedChapters,,,,,,andDecember,MovedcontentintoChapterandAppendixCUpdatedallotherchaptersexceptAppendixesAandBApril,RCUpdatedallchaptersexceptChapterandAppendixesAandBJune,IncorporatedallapprovedSCRsJuly,INTELLECTUALPROPERTYDISCLAIMERTHISSPECIFICATIONISPROVIDEDTOYOU“ASIS”WITHNOWARRANTIESWHATSOEVER,INCLUDINGANYWARRANTYOFMERCHANTABILITY,NONINFRINGEMENT,ORFITNESSFORANYPARTICULARPURPOSETHEAUTHORSOFTHISSPECIFICATIONDISCLAIMALLLIABILITY,INCLUDINGLIABILITYFORINFRINGEMENTOFANYPROPRIETARYRIGHTS,RELATINGTOUSEORIMPLEMENTATIONOFINFORMATIONINTHISSPECIFICATIONTHEPROVISIONOFTHISSPECIFICATIONTOYOUDOESNOTPROVIDEYOUWITHANYLICENSE,EXPRESSORIMPLIED,BYESTOPPELOROTHERWISE,TOANYINTELLECTUALPROPERTYRIGHTSNOTE:THISISADRAFTSPECIFICATIONTheauthorsofthisdraftspecificationmaymakechangestoitatanytime,withoutnoticeProductdesignersshouldnotrelyonthespecification,andtheauthorsshallhavenoresponsibilitywhatsoeverforconflictsorincompatibilitiesarisingfromfuturechangesPleasesendcommentstousbfeedbackusborgForindustryinformation,refertotheUSBImplementersForumwebpageathttp:wwwusborgusbAllproductnamesaretrademarks,registeredtrademarks,orservicemarksoftheirrespectiveownersCopyright©,HP,IntelCorporation,MicrosoftCorporation,NECCorporation,NXPSemiconductors,andTexasInstrumentsIncorporatedAllrightsreservediiiAcknowledgementofUSBTechnicalContributionDedicationDedicatedtothememoryofBradHosler,theimpactofwhoseaccomplishmentsmadetheUniversalSerialBusoneofthemostsuccessfultechnologyinnovationsofthePersonalComputereraTheauthorsofthisspecificationwouldliketorecognizethefollowingpeoplewhoparticipatedintheUSBBusSpecificationtechnicalworkgroupsWewouldalsoliketoacknowledgethemanyothersthroughouttheindustrywhoprovidedfeedbackandcontributedtothedevelopmentofthisspecificationPromoterCompanyEmployeesAlanBerkemaHewlettPackardAnthonyHudsonHewlettPackardArthurZarnowitzHewlettPackardHuiminChenIntelCorporationBobDunstanIntelCorporationDanFroelichIntelCorporationBradHoslerIntelCorporationJohnHowardIntelCorporationRahmanIsmailIntelCorporationYunLingIntelCorporationAndyMartwickIntelCorporationSteveMcGowanIntelCorporationDuaneQuietIntelCorporationBradSaundersIntelCorporationMicahShellerIntelCorporationClintWalkerIntelCorporationJimWalshIntelCorporationKaiWangIntelCorporationRandyAullMicrosoftCorporationNathanShermanMicrosoftCorporationDavidWootenMicrosoftCorporationNobuyukiMizukoshiNECCorporationHajimeNozakiNECCorporationKenjiOgumaNECCorporationHockSeowNECCorporation"Peter"ChuTinTengNECCorporationUniversalSerialBusSpecification,RevisionivSocolConstantinNXPSemiconductorsLinusKerkNXPSemiconductorsMartinKleinNXPSemiconductorsGeertKnapenNXPSemiconductorsBartVertentenNXPSemiconductorsJulieNirchiTexasInstrumentsMitsuruShimadaTexasInstrumentsSueViningTexasInstrumentsContributorCompanyEmployeesGlenChandlerAconJohnChenAconRogerHouAconCharlesWangAconNormanWuAconStevenYangAconGeorgeYeeAconGeorgeOlearContechResearchSophiaLiuElectronicsTestingCenter,Taiwan(ETC)WilliamNortheyFCITomSultzerFCIGarryBiddleFoxconnKuanYuChenFoxconnJasonChouFoxconnGustavoDuenasFoxconnBobHallFoxconnJiayongHeFoxconnJimKoserFoxconnJoeOrtegaFoxconnAshRahejaFoxconnJamesSaboFoxconnPeiTsaoFoxconnKevinWalkerFoxconnTsunekiWatanabeFoxconnChongYiFoxconnTaroHishinumaHiroseElectricKazIchikawaHiroseElectricRyozoKoyamaHiroseElectricKarlKwiatHiroseElectricTadashiSakaizawaHiroseElectricShinyaTonoHiroseElectricEijiWakatsukiHiroseElectricvTakashiEharaJapanAviationElectronicsIndustryLtd(JAE)RonMuirJapanAviationElectronicsIndustryLtd(JAE)KazuhiroSaitoJapanAviationElectronicsIndustryLtd(JAE)HitoshiKawamuraMitsumiTakashiKawasakiMitsumiAtsushiNishioMitsumiYasuhikoShinoharaMitsumiTomLuMolexIncEdmundPohMolexIncScottSommersMolexIncJasonSquireMolexIncDatBaNguyenNTSNationalTechnicalSystemJanFahllundNokiaRichardPetrieNokiaPanuYlihaavistoNokiaAlvinCoxSeagateMartinFuruhjelmSeagateJulianGorfajnSeagateTechnologyLLCMarcHildebrantSeagateTechnologyLLCTonyPriborskySeagateTechnologyLLCSaleemMohammadSynopsys,IncDanielWeinladerSynopsys,IncThomasGrzysiewiczTycoElectronicsMasaakiIwasakiTycoElectronicsKazukiyoOsadaTycoElectronicsHiroshiShiraiTycoElectronicsScottShueyTycoElectronicsMasaruUenoTycoElectronicsUniversalSerialBusSpecification,RevisionviviiContentsAcknowledgementofUSBTechnicalContributionIntroductionMotivationObjectiveoftheSpecificationScopeoftheDocumentUSBProductComplianceDocumentOrganizationDesignGoalsRelatedDocumentsTermsandAbbreviationsSuperSpeedUSBArchitecturalOverviewUSBOverviewSuperSpeedArchitectureOverviewPhysicalLayerLinkLayerProtocolLayerHubsPowerManagementUSBSystemComparingSuperSpeedUSBtoUSBSystemLevelTopologyHostsHubsDevicesBusProtocolRobustnessErrorDetectionErrorHandlingUSBSpecificationChapterOverviewMechanicalPhysicalLayerLinkLayerProtocolLayerFrameworkLayerHubsHubArchitectureHubRepeaterForwarderArchitectureHubsandTransferstoPowerManagedLinksPerformanceandPowerEfficiencyUniversalSerialBusSpecification,RevisionviiiSuperSpeedPowerManagementLinkPowerManagementFunctionandDevicePowerManagementPlatformPMSupportSuperSpeedDataFlowModelImplementerViewpointsSuperSpeedUSBCommunicationFlowPipesSuperSpeedUSBProtocolOverviewDifferenceswithUSBComparingUSBandSuperSpeedUSBTransactionsComparingUSBandSuperSpeedUSBBusTopologyIntroductiontoSuperSpeedUSBPacketsGeneralizedTransferDescriptionDataBurstingINTransfersOUTTransfersPowerManagementandPerformanceControlTransfersControlTransferPacketSizeControlTransferBandwidthRequirementsControlTransferDataSequencesBulkTransfersBulkTransferPacketSizeBulkTransferBandwidthRequirementsBulkTransferDataSequencesBulkStreamsInterruptTransfersInterruptTransferPacketSizeInterruptTransferBandwidthRequirementsInterruptTransferDataSequencesIsochronousTransfersIsochronousTransferPacketSizeIsochronousTransferBandwidthRequirementsIsochronousTransferDataSequencesDeviceNotificationsReliabilityPhysicalLayerLinkLayerProtocolLayerEfficiencyMechanicalObjectiveSignificantFeaturesConnectorsUSBStandardAConnectorContentsixUSBStandardBConnectorUSBPowerBConnectorUSBMicroBConnectorUSBMicroABandUSBMicroAConnectorsCompliantCableAssembliesRawCablesConnectorMatingInterfacesUSBStandardAConnectorInterfaceDefinitionPinAssignmentsandDescriptionUSBStandardAConnectorColorCodeUSBStandardBConnectorInterfaceDefinitionPinAssignmentsandDescriptionUSBPowerBConnectorInterfaceDefinitionPinAssignmentsandDescriptionsUSBMicroBConnectorFamilyInterfacesDefinitionPinAssignmentsandDescriptionCableConstructionandWireAssignmentsCableConstructionWireAssignmentsWireGaugesandCableDiametersCableAssembliesUSBStandardAtoUSBStandardBCableAssemblyUSBStandardAtoUSBMicroBCableAssemblyUSBMicroAtoUSBMicroBCableAssemblyUSBMicroAtoUSBStandardBCableAssemblyCaptiveCablesCableAssemblyLengthElectricalRequirementsHighSpeedElectricalRequirementsRawCableMatedConnectorMatedCableAssembliesDCElectricalRequirementsLowLevelContactResistance(EIAB)DielectricStrength(EIA,Method)InsulationResistance(EIA,Method)ContactCurrentRating(EIA,Method)MechanicalandEnvironmentalRequirementsMechanicalRequirementsInsertionForce(EIA)ExtractionForce(EIA)DurabilityorInsertionExtractionCycles(EIA)CableFlexing(EIA,ConditionI)UniversalSerialBusSpecification,RevisionxCablePullOut(EIA,ConditionA)PeelStrength(MicroBConnectorFamilyOnly)AxesContinuityTest(USBMicroBConnectorFamilyOnly)WrenchingStrength(Reference,MicroBConnectorFamilyOnly)LeadCoPlanaritySolderabilityRoHSComplianceEnvironmentalRequirementsMaterialsImplementationNotesandDesignGuidesMatedConnectorDimensionsEMIManagementStackedConnectorsCaptiveCabl

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USB3.0协议规范(英文完整版)

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