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vpx背板 VP X B ac kp la ne s Ov er vi ew By preserving the VMEbus 6U mechanical form factor and through- mapping of the current VMEbus signals to the MultiGig connectors, the VITA 46 technology brings several features to reality while maintaining abilit...

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VP X B ac kp la ne s Ov er vi ew By preserving the VMEbus 6U mechanical form factor and through- mapping of the current VMEbus signals to the MultiGig connectors, the VITA 46 technology brings several features to reality while maintaining ability to inter-operate with existing VME technology boards. VPX provides vastly increased high-speed serial I/O support for such needs as digital video, mass storage interconnects (e.g. SATA) and FPGA interconnects (e.g. RocketIO). There is also support for high-speed switched serial fabrics with performance up to 10 Gbps and cost-reducing two-level maintenance by providing an Electrostatic Discharge (ESD) protection mechanism and board covers. VPX also supports distributed switching that eliminates the need for dedicated switch card slots and allows for VITA 42 mezzanine sites with high speed I/O. VPX (VITA 46) BACKPLANES Elma Bustronic is the leader in VITA 46/48 VPX products. Our experts developed the industry’s first VPX backplane and pro- posed the first VME pinouts to the VITA 46 subcommittee. Since then, Elma has developed various VPX configurations with and without legacy VME64x slots. VPX presents design challenges with higher layer-count backplanes, and more demanding power and cooling requirements. We tackle these problems with signal integrity analysis, thermal simulation and testing. With 480 pins per slot with up to 186 differential pairs, there is an incredible amount of I/O to route through the backplane. Additionally, VPX uses high-speed differential serial signals that can switch well in excess of 3.0 GHz. The VITA 46 spec acknowledges that the backplane may require up to 16 routing layers, and a huge 36- layer overall PCB stackup. The result could be long via stubs which can degrade the signal. To alleviate this, Elma Bustronic performs simulations to optimize the signal quality of the design and minimize the negative stub effects. One key method is to take the performance requirements, which typically would be 3.125 GBps or 6.250 GBps and route the backplane to minimize the layer count. Reducing the layer count can shorten the stubs, thus reducing the stub effect. In some cases, a high-grade laminate will need to be used even in smaller (fewer slot) backplanes. For example, the five-slot VPX backplane uses an FR-408 low-dielectric material to enhance performance. 3U VPX Backplanes 3U VPX uses a twisted ring topology. For GigE per VITA 46.20, a switch slot is optional in conjunction with the fat pipe (x4) and thin pipe (x2) twisted ring routing. 6U VPX Backplanes 6U VPX can utilize various topologies with mesh configurations more common. The VMEbus can optionally be implemented and many configurations have legacy VME64x slots. For Connector details, see VXS backplanes. 62 VPX Backpanes - 3U VPX (VITA 46) BACKPLANES - 3U FEATURES ■ Compliant to the latest VITA 46 Specification ■ High-speed Multi-gig connector in mesh topology ■ Uses the rugged 3U-160 Eurocard form factor ■ Twisted Ring routing topology ■ Switch slot for centralized switching per VITA 46.20 ■ Provides built in ESD ground protection in every slot ■ RoHS compliant versions optional ■ 6U versions also available Mechanical Specifications Slots: 6 Height: 3U Multi-Gig RT-2 7-row P0 connectors Board Specifications 12-layer board 2 oz. copper power and ground PCB .169” thick ORDER INFORMATION Slots Height Order Number 6 3U 1900001754-0000 VITA 46.0 is the core document for VPX and applies to all of the subsidary documents. Therefore because our backplanes meet the requirements of VITA 46.0 they are designed to support all of the subsidary documents for sRIO, PCI Express, Ethernet or Infiniband. Note that VITA 46.1 and 46.20 specify additional signals that are not present in a backplane unless specifically mentioned in it’s description. The 3U VPX backplane offer much less potential I/O channels than 6U VPX. However, steps have been taken to ensure the architecture offers enough flexibility and functionality. For example, a popular system configuration for 3U VPX is 4 x 4 trans- port channels for the card-to-card topology and the remaining 16 bi-directional channels used for rear panel IO. However, with 2 fabric connectors offering 32 differential bi-directional channels (64 links total) 3U VPX has more than enough connec- tivity for most applications. Utilizing a twisted-ring topology versus a mesh topology allows for more I/O pins and ability to use mezzanines like XMC. A full mesh topology over 3U VPX would simply take up the vast majority of available pins. The most common configuration for 3U VPX cards is two x4 10-Gigabit channels at the top of the J1 connector. The remain- ing channels in J1 together with those in the J2 leave 24 XAUI capable bi-directional ports that can be utilized entirely for rear panel IO. Traditionally, a channel comprised of one or two bi-directional links is referred to as a “thin pipe.” A channel comprised of four bi-directional links is referred to as a “fat pipe.” The 24 thin pipe channels remaining can be used by a PMC or XMC mezzanine or simply allow the 3U VPX modules to interface with external equipment, networks, displays or storage systems. The VPX Gigabit Ethernet Control Plane per VITA 46.20 adds a GigE switch, providing a separate star or dual star network for out-of-band communication. This can be particularly important for system management, software and firmware upgrades, and initiating new processes on specific boards. 63 VP X B ac kp la ne s - 3 U VPX (VITA 46) BACKPLANES - 3U 64 VPX (VITA 46) BACKPLANES - 6U Mechanical Specifications Slots: 5 Height: 6U Multi-Gig RT-2 7-row P0 connectors Board Specifications 20-layer board 2 oz. copper power and ground PCB FR-4 or equivalent PCB .169” thick ORDER INFORMATION Slots Height Order Number 5 6U 1900001710-0000R5 VITA 46.0 is the core document for VPX and applies to all of the subsidiary documents. Therefore because our backplanes meet the requirements of VITA 46.0 they are designed to support all of the subsidiary documents for sRIO, PCI Express, Ethernet or Infi niband. Note that VITA 46.1 and 46.20 specify additional signals that are not present in a backplane unless specifi cally mentioned in its description. While maintaining backward compatibility with legacy VME technology via preservation of the VMEbus 6U mechanical form factor and through-mapping of the current VMEbus signals to the VITA 46 connectors, the VITA 46 technology brings the following features to reality while maintaining ability to inter-operate with existing VME technology boards: • Vastly increased high-speed serial I/O support for such needs as digital video, mass storage interconnects (e.g. SATA) and FPGA interconnects (e.g. RocketIO) • Support for high-speed switched serial fabrics with performance up to 10 Gbps • Support for cost-reducing two-level maintenance by providing an Electrostatic Discharge (ESD) protection mechanism and board covers • Support of distributed switching that eliminates the need for dedicated switch card slots • Support for VITA 42 mezzanine sites with high speed I/O VPX Backpanes - 6U 65 FEATURES ■ Compliant to the latest VITA 46 Specification ■ High-speed Multi-gig connector in mesh topology ■ Rugged Eurocard form factor in 6U height ■ Offers a highly flexible interconnect scheme that can support a either differential or single ended signaling ■ Supports redundant meshes, pipeline topologies and a cluster computing ■ Provides built in ESD ground protection in every slot ■ Hybrid versions with legacy VME64x connector available ■ 3U versions also available ■ Signal Integrity analysis report available upon request VPX (VITA 46) BACKPLANES - 6U VPX Connectivity Chart VP X B ac kp la ne s - 6 U 66 52 VXS BACKPLANES The VXS backplane was a Motorola-backed effort by VITA to bring switched serial fabrics to VME. Part of the “VME Renaissance”, the VITA 41.0 specifica- tion for VXS was ratified by ANSI in 2006. VXS adds a high-speed connector over P0 of a VME64x backplane for serial data traffic. Designers have the flex- ibility of plugging in standard VME64x cards for parallel bus only, integrate new payload and switch cards for parallel bus and switch fabric transport or switch fabric transport only. The VXS spec allows for four differential serial pairs per direction link over P0, and supports up to two such ports on each VMEbus card. Backwards Compatibility One important consideration for VME as it has evolved over the years is its backwards compatibility. From three row 16 bit, 40 Mbytes/sec to 32- bit (3U) and 64-bit (6U) (80 Mbytes/sec) to five row VME64x (160Mbytes/sec), VME has always had increased performance along with compatibility to previous specifications. VXS is no exception. The VXS design starts with a standard VME64x backplane design and implements a high speed fabric by replacing the existing P0 connector with the Multi-Gig 7 Row connector and adding hub slots fully populated with the new connector. However, the backplane is backwards compatible to VME64x/VME, allowing standard VME and VME64x cards (without the P0 connector) to be used in the system. Backwards compatibility is an immensely important issue. Here are some of the key reasons to maintain it: ■ Preservation of investment in a technology ■ Reuse of existing cards/components with ability to upgrade ■ Working on a proven, tested platform ■ Multiple vendors/choices of legacy platform ■ Less risk of obsolescence - as new compatible products are available in roadmap. Signal Integrity At higher clock speeds, the PCB requires cleaner signal transmission without compromising the stability of the system. Signal integrity issues such as reflections, cross talk, frequency dependent transmission line loss and dispersion can significantly lead to poorer system performance propagating through the interconnect. As VXS is a relatively new speci- fication, we first measured the impedance of the PCB. Depending on the configuration, routing a VXS backplane with superior performance can be challenging. In the higher slot sizes, the number and length of the traces can have an effect on the signal integrity. Particularly with larger back- plane the number of traces and lack of physical space, it takes creative and intelligent routing schemes from an experi- enced designer. Avoiding undesirable stubs for upper layer backplane traces presents some tough choices. One option would be to have these worse case vias back-drilled -- a costly fabrication process which removes the unused portion of the plated via structure below the layer at which the signal is terminated. Another possibility is to minimize the length of via stubs by choosing a laminate with a lower dielectric constant as Elma Bustronic did with its 12 and 20-slot Dual Star Backplanes. VXS Backpanes Overview 67 VX S Ba ck pla ne s Ov er vi ew VXS BACKPLANES The modules have 6, 8, or 10 rows of signal contacts with 20.3, 25.4, or 30.5 centerline spac- ing (profile size). A right–angle plug module having 7 rows with 20.3 centerline spacing is also available for Tier 2 only to accommodate special applications used by the VMEbus International Trade Association (VITA). TYCO MultiGig RT CONNECTOR SPECIFICATIONS Temperature Range: -55˚C to 105˚C Housing Material: Liquid Crystal Polymer (LCP) Thermoplastic Rating: 94 V-0 Contact Material (Signal & Ground): Phosphor Bronze underplated with Nickel Contact Material (Contact Areas): Plated with Gold Contact Material (Tails): Plated with Tin-Lead or Tin Alignment Posts Material: Brass Wire plated with Nickel Guide Assembly Material: Zinc Alloy Die Casting with plated Chromate TYCO MultiGig RT CONNECTOR PERFORMANCE Insertion Loss: Under 1 dB insertion loss up to 2 Ghz Insertion Loss: Under 3 dB insertion loss up to 5 Ghz Connector Impedance: 93 and 102 ohms (250ps signal rise time, 10-90%) Differential Propagation Delay: 180-269 ps Intrapair Skew: < 10 Pair -to- Pair Skew: < 30 Noise: <3% (Simultaneous attack by all adjacent pairs; 250 ps rise time, 10-90%) Multi-Gig RT-2 Connector 68 Mechanical Specifications Slots: 5 (other sizes available) Height: 7U 160-pin, class II VME connectors Multi-Gig RT-2 P0 connectors Board Specifications 10-layer board 2 oz. copper power and ground PCB UL recognized 94V-0 PCB FR-4 or equivalent PCB .125” thick FEATURES ■ Conforms to VITA 41.0 VXS backplane specifications ■ Switched serial traffic over P0 of VME64x backplane ■ High-speed Multi-Gig RT-2 connector for up to 6.4 Gbps traffic over P0 ■ Compatible with VME64x standard line cards. ■ Single Star, Dual Star, Mesh, and Hybrid versions available ■ Various configurations of payload slots, switch cards slots, etc. ORDER INFORMATION Total Slots Switch Card Slots Payload slots Width Height Order Number 5 1 4 VXS w/1 Legacy VME64x 4.063 11.716 101VXSS705 10 1 7 VXS w/2 Legacy VME64x 8.021 10.32 101VXSS610 VXS Backplanes - Star About VXS The 5-slot and 10-slot VXS backplanes from Elma Bustronic come in a Single Star confi guration with one hub slot. With a 7U height (5-slot), the backplane offers plenty of power bugs for +3.3V, +5V, +/- 12V, V I/O and Ground. All Elma Bustronic VXS backplanes are designed to be compliant to the latest VITA 41 specifi cations. The 5-slot has 4 payload slots and one switch slot. Each payload slot (slots 1 to 4) has two fabric channels (a and b) which connect in a point to point topology to the switch slot. The 10-slot has 7 payload slots, 2 legacy VME64x slots, and one switch slot. The 7-row MultiGig connector in the P0 position of each payload slot also has pins assigned to rear I/O. I/O communication can be implemented via a rear transition module (FRU) or via front panel connectors. Switch Board Power 1 Connector Blade Signal 1 VPC 2 +5V 3 +5V 4 +5V 5 GND 6 GND Rated at 10A per contact @ 95 C. 54 VXS Backpanes - Star 69 VXS Backplanes - Star 55 Drawing of 5-slot Star VXS backplane. Port Mapping VX S Ba ck pla ne s - S ta r 70 Mechanical Specifications Slots: 8, 12, 18, 20 slots (other sizes available) Height: 6U (8, 18-slot), 7U (12, 20-slot) 160-pin, class II VME connectors Multi-Gig RT-2 7-row P0 connectors Board Specifications 10-layer (8-slot), 12-layer (12-slot), 18-layer (18, 20-slot) board PCB UL listed 94V-0 PCB FR-4 or Nelco 4000-13SI PCB .147” (8-slot), .160” (12-slot), .157” (18, 20-slot) thick FEATURES ■ Conforms to VITA 41.0 VXS backplane specifications ■ Switched serial traffic over PO of VME64x backplane ■ High-speed Multi-Gig RT-2 connector for up to 6.4 Gbps signals over P0 ■ Compatible with VME64x standard line cards. ■ Single Star, Dual Star, Mesh, and Hybrid versions available ■ Various configurations of payload slots, switch cards slots, etc. ■ High-performance laminate materials also available VXS Backplane - Dual Star About VXS The VXS backplane is an effort by VITA to bring switched serial fabrics to VME. Part of the “VME Renaissance”, the VITA 41.0 core specification for VXS has been ratified. VXS adds a high-speed connector over P0 of a VME64x backplane for serial data traffic. Designers will have the flexibility of plugging in standard VME64x cards for parallel bus only, integrate new payload and switch cards for parallel bus and switch fabric transport or switch fabric transport only. The VXS spec allows for four differential serial pairs per direction link over P0, and supports up to two such ports on each VMEbus card. The subsets of VITA 41 include InfiniBand (VITA 41.1) and Rapid I/O (VITA 41.2) and may include GigaBit Ethernet (VITA 41.3), PCI Express (VITA 41.4) and StarFabric (VITA 41.5). Elma Bustronic has performed Signal Integrity studies and simulation on its VXS backplane design. The result is high- performance in the most cost-effective design. With intelligent routing studies, we are able to decrease the layer count -- keeping costs and board thicknesses low. Elma Bustronic incorporates a controlled-impedance stripline design and offers VXS backplanes in 6U and 7U heights and various configurations. Switch Board Power 1 Connector Blade Signal 1 VPC 2 +5V 3 +5V 4 +5V 5 GND 6 GND Rated at 10A per contact @ 95 C. Switch Board Sideboard Connectors Connector Part Designation Description P1 T1-M08-R6 Tier 1, monolithic, 0.8” pitch, right angle 56 VXS Backpanes - Dual Star 71 VXS Backplane - Dual Star ORDER INFORMATION Total Slots Switch Card Slots Payload slots Width Height Order Number 8 2 6 6.36 10.32 101VXSD608 12 2 10 9.60 11.71 101VXXD712 18 2 16 10.19 10.32 101VXSD618 20 2 18 16.00 11.71 101VXSD720 57 Drawing of 20-slot Dual Star VXS backplane. VX S Ba ck pla ne s - D ua l S ta r 72 VXS Backplane - Dual Star 58 Port Mapping for the 8, 12 and 20 slot VXS Dual Star Backplanes VXS Backpanes - Dual Star 73 Mechanical Specifications Slots: 5 (other sizes available) Height: 7U 160-pin, class II VME connectors Multi-Gig RT-2 P0 connectors Board Specifications 10-layer board 2 oz. copper power and ground PCB UL listed 94V-0 PCB FR-4 or equivalent PCB .125” thick FEATURES ■ Conforms to VITA 41.0 VXS backplane specifications ■ Switched serial traffic over P0 of VME64x backplane ■ High-speed Multi-Gig RT-2 connector for up to 6.4 Gbps signals over P0 ■ Point-to-point switchless mesh doesn’t require switch cards ■ Single Star, Dual Star, Dual-Dual Star, Mesh, and Replicated versions available ■ Two standard VME64x slots VXS Backplane - Mesh 59 About VXS The 5-slot switchless mesh VXS backplane allows the direct connection of up to 3 node cards without the requirement for a switch card. This unique arrangement could be used to develop and test communication between end-point cards, support small system needs and allow the demonstration of VXS node cards prior to the availability of switch silicon. As a VXS switch card is inherently compliant with a particular data transport protocol, this backplane can be used to test multiple data transport protocol end-point designs without the need to invest in multiple switch card types. Because Serial Rapid IO silicon is not expected until later in 2005 this is a good solution to allow the market to move ahead today. This implementation takes advantage of the fact that VXS payload cards have two fabric channels that allow them to communicate with either fabric switch A or fabric switch B. With the interconnect paths “wired” into the back- plane, each card in a three card set, could each communicate directly with the the two cards without the need for a separate fabric switch. ORDER INFORMATION Total Slots Switch Card Slots Payload slots Width Height Order Number 5 0 3+2 4.063 11.716 101VXSM705 VX S Ba ck pla ne s - M es h 74 VXS Backplane - Mesh 60 VXS Backpanes - M esh 75 CompactPCI Express, PXI Express 76 61 Mechanical Specifications Slots: 4 slots
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