机箱机柜标准

Standards Summary 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 2 2 Introduction to the Standards Summary Why is Schroff committed to standards and modular concepts? Commercial electronic devices are investments with relatively long life cycles, where high reliability and availability are predominant requirements. In order to keep the cost low and at the same time maintain a very high quality level, standard designs with predefined performance levels are indispensable. Subracks, cases and cabinets are structural parts of any equipment. The standards philosophy allows short development time and fast market introduction for these products without expensive development, testing and validation procedures. Are standard product platforms as flexible and cost effective as proprietary designs? If a certain product with relatively high quantities and a long, steady lifecycle is demanded, most likely a proprietary design will be favorable. But for most electronics markets the required investments are too high for proprietary designs, if we consider all development and sourcing costs realistically. Standard product platforms typically consist of a modular concept which provides a wide variety of off-the-shelf products. Contents of the standards summary This standards summary is the third release with updated contents. The purpose of this document is to inform designers and project engineers about the most important mechanical standards of the globally developed and approved IEC standards in a very condensed manner. Users are encouraged to look up more detailed information on IEC's Website or in other printed sources. 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 3 3 Michael Thompson USA Principal Engineer Paul Mazura Germany Vice President Product Development and Standardization Akio Shimada Japan Manager Marketing and Standardization Keith Reynolds UK Technical Manager The Schroff commitment to standards Since 1978 Schroff is actively participating in the standardization of "Mechanical Structures for Electronic Equipment" in the global IEC organization. As an international company with global customers we feel responsible for the progress in standardization by implementing latest technologies and converting them into standard product platforms. Members of the Schroff Group are working closely to the most innovative markets where the requirements are emerging and are developing answers within the global Schroff team of experts. That is the way we work in both directions: Listen to the local markets and develop global concepts with a strategic view. 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 4 Standardization Summary - a Guide Through International Standards for Electronic Packaging 4 VME, CPCI and ATCA In addition to IEC standards there are application specifications created by specific market user groups. Examples are VME, created by VITA (VME International Trade Association) or CPCI and ATCA, created by PICMG (PCI-International Computer Manufacturing Group). Details of VME and CPCI have been incorporated into the latest IEC standards (IEC 60297-3-101 up to -103) which opens new features for the general use in other applications. ATCA (Advanced Telecommunication Computing Architecture) represents the implementation of an 8 U Eurocard form factor into a 19", resp. a 23" wide chassis. Board level products of ATCA will not fit into IEC standardized subracks due to deviating dimensional details. ETS standards ETS standards have been created by ETSI (European Telecommunication Standardization Institute) for the European Telecommunication installations. ETS standards are closely related to IEC standards with specific focus on telecom requirements. While the cited IEC standards in the table above deal with the structural properties of the equipment design, the ETS is also specifying the working conditions. Scope of the standards summary This standardization summary will present the main contents of the relevant standards with the intention to create better understanding of the correlations and application aspects. For the full contents the IEC Web site will provide all necessary information. IEC standards The globalization of the commercial electronics market creates a demand for internationally valid standards. Time-to-market and development expenses of an electronic device force application engineers to use off-the-shelf products rather than design proprietary packaging solutions. Recently developed Electronic Packaging standards comprise dimensional specifications and - on a higher level - the criteria for physical integrity, electromagnetic compatibility and thermal management. With regard to such comprehensive market requirements the technical subcommittee 48D of the International Electrotechnical Commission (IEC) created a whole new series of standards. Dimensional Physical Seismic Electromagnetic Thermal Compatibility Integrity Durability Compatibility Management IEC 60297-1 IEC 61587-1 IEC 61587-2 IEC 61587-3 IEC 62194, Ed.1 IEC 60297-2 IEC 61969-3 IEC 60297-3-101 IEC 60297-3-102 IEC 60297-3-103 IEC 61969-2-1 IEC 61969-2-2 IEC 60917-2-X 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 5 wangyang 附注 IEC60297-1（1986，第3版） 482.6mm（19in）系列机械结构 尺寸 手机海报尺寸公章尺寸朋友圈海报尺寸停车场尺寸印章尺寸 第1部分：面板和机架。 IEC60297-2（1982，第1版） 482.6mm（19in）系列机械结构尺寸第2部分：机柜和机架结构间距。 IEC60297-3（1992，第2版）482.6mm（19in）系列机械结构尺寸第3部分：插箱及其插件。 IEC60297-4（1999，第2版）电子设备机械结构 482.6mm（19in）系列机械结构尺寸第4部分：插箱及其插件——附加尺寸； IEC60297-5-100（2001，第1版）电子设备机械结构第5～100部分：插箱及其插件——设计总则。 IEC60297-5-101（2001，第1版）电子设备机械结构第5～101部分：插箱及其插件——插/拔把手。 IEC60297-5-102（2001，第1版）电子设备机械结构第5～102部分：插箱及其插件——电磁屏蔽防护。 IEC60297-5-103（2001，第1版）电子设备机械结构第5～103部分：插箱及其插件——静电放电防护。 IEC60297-5-104（2001，第1版）电子设备机械结构第5～104部分：插箱及其插件——插入键。 IEC60297-5-105（2001，第1版）电子设备机械结构第5～105部分：插箱及其插件——定位和/或接地销。 规定 关于下班后关闭电源的规定党章中关于入党时间的规定公务员考核规定下载规定办法文件下载宁波关于闷顶的规定 了增加定位和/或接地销功能（其功能与IEC297-5-102的屏蔽功能有关）的插箱及其插件的互换性尺寸。 IEC60297-5-107（2001，第1版）电子设备机械结构第5～107部分：插箱及其插件——后插式插件。规定了增加后插式插件功能的插箱及其插件的互换性尺寸。 Mechanical Structures for Electronic Equipment 5 1.00 6 1.00 6 1.01 7 1.02 8 1.03 9 1.04 10 1.05 11 1.06 12 1.07 13 1.08 14 1.09 15 1.10 16 1.11 17 1.12 18 1.13 19 2.00 20 2.00 20 2.01 21 2.02 22 2.03 23 3.00 24 3.00 24 4.00 26 4.00 26 4.01 27 4.02 28 4.03 29 4.04 29 5.00 30 5.00 30 6.00 31 6.00 31 6.01 31 6.02 32 7.00 33 7.00 33 8.00 34 8.00 34 9.00 35 9.00 35 Design guide for subracks and associated plug-in units Overview of the 482,6 mm (19") standard series, IEC 60297-3-101 Basic subrack dimensions Guide rail dimensions Printed boards Connectors and backplanes Subrack depth mounting dimensions Subrack front mounting dimensions Dimensions of subrack associated plug-in units Subrack/front panel shielding interface dimensions Subrack/plug-in unit electrostatic discharge provisions (ESD) Subrack/plug-in unit keying and alignment pin Subrack dimensions for the 25 mm standard series, IEC 60917-2-2 Subrack dimensions for ETS 300 119-4 (European Telecom Standards) Design guide for indoor cabinets Cabinet dimensions for the 482,6 mm (19") standard series, IEC 60297-2 Cabinet dimensions for ETS 300 119-3 (European Telecom Standards) Cabinet dimensions for the 25 mm standard series, IEC 60917-2-1 Outdoor enclosures Climatic and physical tests for subracks and cabinets in accordance to IEC 61587-1, -2, -3 Climatic tests Static load and dynamic tests for subracks and cabinets in accordance to IEC 61587-1 Environmental requirements for outdoor enclosures in accordance to IEC 61969-3 Seismic tests in accordance to IEC 61587-2 Electromagnetic shielding performance tests Safety requirements Safety requirements, IEC 60950 IP degrees of protection Thermal management VME and CPCI Advanced TCA - PICMG 3.0 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 6 6 1.00 Design Guide for subracks and associated plug-in units 1.00 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 7 7 1.01 Overview of the 482,6 mm (19") standard series IEC 60297-3-101 Width: The overall width behind the mounting flanges (incl. screws) shall be max. 449 mm. The subrack aperture width is subdivided by a modular pitch of 1 HP = 5,08 mm (2/10"). Height: The subrack total height is defined by a multiple of a unit of 1 U = 44,45 mm (1 3/4"). 19" system dimensions and definitions The width over the mounting flanges is 482,6 mm (19"), which created the term 19" system. Depth: The subrack total depth is not explicitly specified by the standard. The individual dimensions depend on the board depth, rear connector tails or rear input/output plug-in units. A slot is a multiple of horizontal pitches and may be different in specific applications. A board type plug-in unit consists of a printed board fitted with a front panel and a connector. The subrack aperture dimensions on the front are mirrored to the rear in case of rear mounted plug- in units. A box type plug-in unit is typically housing bulky components or multiples of boards. 2 1 Board type plug-in unit 2 Box type plug-in unit 1 Figure 1 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 8 8 Height: 1 U = 44,45 mm. Nominal: (44,45 - 0,8) ± 0,4 3 U = (3 x 44,45 - 0,8) ± 0,4 = 132,55 ± 0,4 Note: The height dimension 100,2 + 0,5 is derived from the printed board height dimension and a min. tolerance of 0,2 mm. The max. tolerance of 0,2 + 0,5 = 0,7 mm includes the clearance tolerance of the subrack horizontal members. Width: 482,6 mm ± 0,4. Mounting grid for front panels: 5,08 mm. Subrack aperture: > 84 x 5,08 mm 1.02 Basic subrack dimensions Subrack front view for 3 U, 6 U and 9 U First pitch line Printed board Guide rail Figure 2 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 9 1.03 Guide rail dimensions Printed board thickness is in general 1,6 mm. Thicker boards are possible but need to be agreed between contracting parties. If two part connectors are used the increased thickness shall be opposite to the reference plane of the board (Ref. plane = ref. to first pitch line). 9 1 Guide rail for plug-in units as per IEC 60297-3-101. 2 Mirrored to version 1. Used for rear I/O or on right hand position. 3 Guide rail with off-set position (board shifted by 2,54 mm). 4 Guide rail with keying and alignment pin receptacle as per IEC 60297-3-103 (see also 1.11). Pitch lines Figure 3 Figure 4 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 10 10 Dimensions: The printed board dimensions are defined as the base of the "Eurocard" form factor (H = 100 x D = 160 mm). Height: The height increments are in accordance to the units of the subrack (1 U = 44,45 mm). The table shows the most popular board formats. 1.04 Printed boards The printed board dimensions are specified in IEC 60297-3-101. The figure below shows a typical 6 U board. Thickness: The thickness of a board is, if nothing specifically required, 1,6 mm. Thicker boards should be agreed between user and vendor with respect to the accessories concerned, e. g. guide rails. IEC 60297-3-101 as the relevant standard for 19" based subracks deals with two part connectors of the series IEC 60603-2, IEC 61076-4-113 and IEC 61076-4-101. Other connectors may influence the board or subrack depth dimensions. Fixing points for printed board holder Ø 2,7 Heigth H +0/-0,3 Depth D +0/-0,3 80 3 U = 100 100 6 U = 233,35 160 9 U = 366,7 220 280 Printed board Figure 5 Table 1 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 11 1.05 Connectors and backplanes 11 The connectors of the above described IEC series fit on the backplane within the same slot width but with different reference dimensions of the contact grids to the pitch line. The contact grid in figure 6a is 2,54 mm and 2 mm in figure 6b. Typical applications for the IEC 60603-2 and IEC 61076-4-113 series are VME 64 and 64X. IEC 61076-4-101 series connectors are used for Compact PCI. The formula for H1: n x U - 4,8. Example for 3 U = 3 x 44,45 - 4,8 = 128,55. The formula for H2: n x U - 10,85 = 3 x 44,45 - 10,85 = 122,5. Reference lines for fixing points of the backplanes to the subrack First position of the connectors of IEC 60603-2 and 61076-4-113 series (contact row b) First position of the connectors of IEC 61076-4-101 series Pitch linePitch line Front view Figure 6 Figure 6a Figure 6b 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 12 12 1.06 Subrack depth mounting dimensions Inspection dimensions for the subrack rear depth DR from the rear attachment plane to the backplane attachment Application example VME The formula for connectors type IEC 60603-2 and 61067-4-113 is: DR = printed board depth + 22,48 (e. g. 80 + 22,48 = 102,48). Application example CPCI The formula for connectors type IEC 61067-4-101 is: DR = printed board depth + 20 (e. g. 80 + 20 = 100). Inspection dimensions for the subrack front depth D from the front attachment plane to the backplane attachment The formular for connectors type IEC 60603-2 and 61067-4-113 (application example VME) is the same as for connectors type IEC 61076-4-101 (application example CPCI): D = printed board depth + 15,6 (e. g. 160 + 15,6 = 175,6). Inspection dimensions for the shroud DS from the rear front panel attachment to the bottom of the shroud Application example VME The formula for connectors on the rear plug-in unit type IEC 60603-2 (inverted version) is: DS = printed board depth + 10,28 (e. g. 80 + 10,28 = 90,28). Application example VME 64 extension The formula for connectors type IEC 61076-4-113 is: DS = printed board depth + 12,78. Application example CPCI The formula for connectors type IEC 61067-4-101 is: DS = printed board depth + 12,14. The max. thickness of the backplane should not exceed 6 mm. Front plug-in unit Rear plug-in unit Shroud Figure 7 Explanations for the rear arrangement of plug-in units For I/O interface the rear plug-in units are fitted with the inverted versions of the cited connector types. This allows the plug-in function to be directly on the tails of the front connectors protruding from the backplane. The shroud is used as a mechanical support to align the rear plug-in function and to protect the tails from damage. 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 13 1.07 Subrack front mounting dimensions 13 Subrack front design alternatives For the subrack front design two options are applicable: Horizontal members with or without injector/extractor receptacle. For details see IEC 60297-3-101 and IEC 60297-3-102. Side view section; mounting dimensions and pitch linesSide view section; front attachment area Injector/extractor handle Horizontal member with receptacle for injector/extractor Fixing points for front panels Pitch lines = n x 5,08 Figure 8 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 14 14 1.08 Dimensions of subrack associated plug-in units Plug-in units Subrack related plug-in units are the sub- assemblies of a subrack. There are principally two versions: The printed board type and the box type plug-in units. The printed board type plug-in unit consists of a printed board as the carrier of the circuitry and the electronic components including the connector and a front panel. The box type plug-in unit usually consists of a metal housing in which one or more printed boards may be located. The front panel and the connector positioning follows the same dimensional rules as those applying to the printed board type plug-in units. The drawings above illustrate the dimensional rules of the front panels within the pitch lines of a subrack and the reference fixing points for printed boards at the rear of a front panel. Detail X is the only standardized fixture but may be replaced by individual fasteners if agreed between vendor and user. Front panel front view Front panel side view Pos. for fixing screwsPitch Line Fixing Points for Printed Boards Detail X Screw M 2,5 Figure 9 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 15 1.09 Subrack/front panel shielding interface dimensions 15 Subrack/front panel shielding Shielding measures against high frequency interference are defined by standardized dimensions on the front area only. Other areas of a subrack are not critical regarding the compatibility of plug-in units and are therefore left to individual measures. If rear plug-in units are used the dimensions of the front area should be mirrored. Missing dimensions see IEC 60297-3-101. Front panel top view cross section Vertical shielding gasket Uncompressed gasket Front panel attachment plane Uncompressed gasket Horizontal member Conductive vertical surface Figure 10 Figure 11 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 16 16 1.10 Subrack/plug-in unit electrostatic discharge provisions (ESD) Electrostatic discharge IEC 60297-3-101 describes an optional method of electrostatic discharge. It is a contact clip which can be placed into the guide rails, close to the front of the subrack. Usually the guide rails are made of insulating material and if prepared accordingly by the vendor, the same guide rails will mostly accept the ESD clip even when retrofitted. For the proper function the clip has to connect to grounded parts of the subrack and to conductive sections on the printed board. In order to avoid discharge sparks a discharge resistor should be used on the printed board. Side view cross section: front attachment area Guide rail *) ESD contact overlapping area Figure 12 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 17 1.11 Subrack/plug-in unit keying and alignment pin 17 Keying and alignment pin IEC 60297-3-103 describes an arrangement of keying and alignment between the plug-in unit front panel and the subrack. This method of keying was chosen for the standard instead of connector related solutions for the benefit of maximum design freedom on the backplane. The alignment pin is designed for the correct positioning of EMC shielded front panels and in specific applications as a discharge pin between the front panel and the subrack. For both solutions, keying and alignment, caution is needed when chosing the subrack and the front panels since retrofitting might become very costly. Guide rails with keying and alignment pin chambers Alignment pin Keying pin can be rotated in four positions Figure 13 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 18 Subrack front view for 6 SU, 12 SU and 18 SUFirst pitch line Printed board Guide rail 18 1.12 Subrack dimensions for the 25 mm series, IEC 60917-2-2 Metric Equipment Practice In the mid 80's the standardization within IEC generated a new equipment standard based on the vision of a true three dimensional structure with a homogeneous metric system grid. The envisaged benefits were mainly CAD-CAM oriented and general design improvements with regard to some weak points in the existing 19" standard. As a result the IEC 60917 series was developed, comprising cabinet and subrack application dimensions and also general rules for further equipment standard developments. The main system grid is 25 mm with subdivisions of 2,5 and 0,5 mm. Figure 14 67393_Schroff.qk4 23.09.2004 9:01 Uhr Seite 19 1.13 Subrack dimensions for ETS 300 119-4 (European Telecom Standards) 19 Subracks of the ETS standard In the early 90's the European Telecommunications Standardization Institute developed the ETS 300 119 series for their specific technical needs and also for better coordination between the developments of equipment within the joining countries. The contents of the mechanical specifications take care of the compatibility of subrack type equipment and the installation requirements for racks and cabinets. The ETS standard represents an excerpt of the 25 mm metric standard (IEC 60917 series) for compatibility reasons on subrack level but it leaves out more details as for subrack related plug-in units. The ETS standard also allows for adaptation between metric and 19" subracks. Subrack front view Subrack top view Figure 15 67393_Schrof