TL/F/5120
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January 1988
MM54HC138/MM74HC138
3-to-8 Line Decoder
General Description
This decoder utilizes advanced silicon-gate CMOS technol-
ogy, and is well suited to memory address decoding or data
routing applications. The circuit features high noise immuni-
ty and low power consumption usually associated with
CMOS circuitry, yet has speeds comparable to low power
Schottky TTL logic.
The MM54HC138/MM74HC138 has 3 binary select inputs
(A, B, and C). If the device is enabled these inputs deter-
mine which one of the eight normally high outputs will go
low. Two active low and one active high enables (G1, G2A
and G2B) are provided to ease the cascading of decoders.
The decoder’s outputs can drive 10 low power Schottky TTL
equivalent loads, and are functionally and pin equivalent to
the 54LS138/74LS138. All inputs are protected from dam-
age due to static discharge by diodes to VCC and ground.
Features
Y Typical propagation delay: 20 ns
Y Wide power supply range: 2V–6V
Y Low quiescent current: 80 mA maximum (74HC Series)
Y Low input current: 1 mA maximum
Y Fanout of 10 LS-TTL loads
Connection and Logic Diagrams
Dual-In-Line Package
TL/F/5120–1
Order Number MM54HC138
or MM74HC138
Truth Table
Inputs
Outputs
Enable Select
G1 G2* C B A Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7
X H X X X H H H H H H H H
L X X X X H H H H H H H H
H L L L L L H H H H H H H
H L L L H H L H H H H H H
H L L H L H H L H H H H H
H L L H H H H H L H H H H
H L H L L H H H H L H H H
H L H L H H H H H H L H H
H L H H L H H H H H H L H
H L H H H H H H H H H H L
*G2eG2AaG2B
Hehigh level, Lelow level, Xedon’t care
TL/F/5120–2
C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
Absolute Maximum Ratings (Notes 1 & 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (VCC) b0.5 to a7.0V
DC Input Voltage (VIN) b1.5 to VCCa1.5V
DC Output Voltage (VOUT) b0.5 to VCCa0.5V
Clamp Diode Current (IIK, IOK) g20 mA
DC Output Current, per pin (IOUT) g25 mA
DC VCC or GND Current, per pin (ICC) g50 mA
Storage Temperature Range (TSTG) b65§C to a150§C
Power Dissipation (PD)
(Note 3) 600 mW
S.O. Package only 500 mW
Lead Temp. (TL) (Soldering 10 seconds) 260§C
Operating Conditions
Min Max Units
Supply Voltage (VCC) 2 6 V
DC Input or Output Voltage 0 VCC V
(VIN, VOUT)
Operating Temp. Range (TA)
MM74HC b40 a85 §C
MM54HC b55 a125 §C
Input Rise or Fall Times
VCCe2.0V(tr, tf) 1000 ns
VCCe4.5V 500 ns
VCCe6.0V 400 ns
DC Electrical Characteristics (Note 4)
TAe25§C
74HC 54HC
Symbol Parameter Conditions VCC TA
eb40 to 85§C TAeb55 to 125§C Units
Typ Guaranteed Limits
VIH Minimum High Level 2.0V 1.5 1.5 1.5 V
Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
VIL Maximum Low Level 2.0V 0.5 0.5 0.5 V
Input Voltage** 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
VOH Minimum High Level VINeVIH or VIL
Output Voltage lIOUTls20 mA 2.0V 2.0 1.9 1.9 1.9 V
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
VINeVIH or VIL
lIOUTls4.0 mA 4.5V 4.2 3.98 3.84 3.7 V
lIOUTls5.2 mA 6.0V 5.7 5.48 5.34 5.2 V
VOL Maximum Low Level VINeVIH or VIL
Output Voltage lIOUTls20 mA 2.0V 0 0.1 0.1 0.1 V
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
VINeVIH or VIL
lIOUTls4.0 mA 4.5V 0.2 0.26 0.33 0.4 V
lIOUTls5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
IIN Maximum Input VINeVCC or GND 6.0V g0.1 g1.0 g1.0 mA
Current
ICC Maximum Quiescent VINeVCC or GND 6.0V 8.0 80 160 mA
Supply Current IOUTe0 mA
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package: b12 mW/§C from 65§C to 85§C; ceramic ‘‘J’’ package: b12 mW/§C from 100§C to 125§C.
Note 4: For a power supply of 5V g10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
with this supply. Worst case VIH and VIL occur at VCCe5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and
IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
**VIL limits are currently tested at 20% of VCC. The above VIL specification (30% of VCC) will be implemented no later than Q1, CY’89.
2
AC Electrical Characteristics VCCe5V, TAe25§C, CLe15 pF, tretfe6 ns
Symbol Parameter Conditions Typ
Guaranteed
Units
Limit
tPLH Maximum Propagation 18 25 ns
Delay, Binary Select to any Output
tPHL Maximum Propagation 28 35 ns
Delay, Binary Select to any Output
tPHL, tPLH Maximum Propagation 18 25 ns
Delay, G1 to any Output
tPHL Maximum Propagation 23 30 ns
Delay G2A or G2B to
Output
tPLH Maximum Propagation 18 25 ns
Delay G2A or G2B to
Output
AC Electrical Characteristics CLe50 pF, tretfe6 ns (unless otherwise specified)
TAe25§C
74HC 54HC
Symbol Parameter Conditions VCC TA
eb40 to 85§C TAeb55 to 125§C Units
Typ Guaranteed Limits
tPLH Maximum Propagation 2.0V 75 150 189 224 ns
Delay Binary Select to 4.5V 15 30 38 45 ns
any Output Low to High 6.0V 13 26 32 38 ns
tPHL Maximum Propagation 2.0V 100 200 252 298 ns
Delay Binary Select to any 4.5V 20 40 50 60 ns
Output High to Low 6.0V 17 34 43 51 ns
tPHL, tPLH Maximum Propagation 2.0V 75 150 189 224 ns
Delay G1 to any 4.5V 15 30 38 45 ns
Output 6.0V 13 26 32 38 ns
tPHL Maximum Propagation 2.0V 82 175 221 261 ns
Delay G2A or G2B to 4.5V 28 35 44 52 ns
Output 6.0V 22 30 37 44 ns
tPLH Maximum Propagation 2.0V 75 150 189 224 ns
Delay G2A or G2B to 4.5V 15 30 38 45 ns
Output 6.0V 13 26 32 38 ns
tTLH, tTHL Output Rise and 2.0V 30 75 95 110 ns
Fall Time 4.5V 8 15 19 22 ns
6.0V 7 13 16 19 ns
CIN Maximum Input 3 10 10 10 pF
Capacitance
CPD Power Dissipation (Note 5) 75 pF
Capacitance
Note 5: CPD determines the no load dynamic power consumption, PDeCPD VCC2 faICC VCC, and the no load dynamic current consumption, ISeCPD VCC faICC.
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Physical Dimensions inches (millimeters)
Order Number MM54HC138J or MM74HC138J
NS Package Number J16A
Order Number MM74HC138N
NS Package Number N16E
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant support device or system whose failure to perform can
into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life
failure to perform, when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can effectiveness.
be reasonably expected to result in a significant injury
to the user.
National Semiconductor National Semiconductor National Semiconductor National Semiconductor
Corporation Europe Hong Kong Ltd. Japan Ltd.
1111 West Bardin Road Fax: (a49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309
Arlington, TX 76017 Email: cnjwge@ tevm2.nsc.com Ocean Centre, 5 Canton Rd. Fax: 81-043-299-2408
Tel: 1(800) 272-9959 Deutsch Tel: (a49) 0-180-530 85 85 Tsimshatsui, Kowloon
Fax: 1(800) 737-7018 English Tel: (a49) 0-180-532 78 32 Hong Kong
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Italiano Tel: (a49) 0-180-534 16 80 Fax: (852) 2736-9960
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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