ADS2011-Webcast-2

Joe Civello ADS Product Manager Agilent Technologies Welcome © Agilent Technologies 2011 Agenda Page 2 • RF & microwave market trends & how Agilent EEsof is investing its R&D • Multi-technology design with ADS 2011 - demo • New capabilities for all RF & microwave engineers – Circuit design & simulation - demo – EM modeling (Momentum and FEM) - demo – Load Pull for improved PA matching network design - demo – Layout - demo – And more … Complete MMIC/Module ADS Desktop Design Page 3 RF & Microwave Market Trends Increasing Complexity & Integration • Commercial wireless and Aerospace/Defense Industries are rapidly moving from single packaged MMICs, to larger, more complex ICs in multi-chip RF modules • Today’s flows combine multiple, poorly integrated tools, which are not able to address multiple technology design and verification • The IC, laminate, package, and PCB system need to be designed together, interactively • Electro-magnetic interactions between substrates need to be modeled Page 4 ADS 2011: The IC/Module/Package/PCB Design Solution Realizing the Multi-Technology Vision Multi-Technology Circuit Design • Multiple die (IC and IPD) • Multiple substrates (die, laminate, LTCC, package, PCB) • Multiple process design kits (PDKs) – GaAs (HBT, pHEMT), GaN, SiGe, Si … Integrated Electro-Magnetic Solvers • Multi-Technology EM simulation – Full 3D EM Simulation • Finite Element Simulator • Parameterized Solid Models of Components • Multi-layer 3D Planar EM simulation • Easy EM simulation for the every engineer Mounted on Board Multiple ICs Multiple Technologies On Laminate & Packaged Page 5 Designing Across Multiple Technologies Page 6 The Multi-Technology Challenge LNA GaAs Mixer SiGe RF Module Laminate Layer Defs AEL Cust Single Technology Space Traditional Design Tools • Designed to handle one type of design – IC, Module, or PCB • Have a single technology definition space Page 7 True Multi-Technology Management LNA GaAs Mixer SiGe RF Module Laminate Lam:Components Lam:Material Prop Lam:Layer Defs Lam:AEL Cust SiGe:Components SiGe:Material Prop SiGe:Layer Defs SiGe:AEL Cust GaAs:Components GaAs:Material Prop GaAs:Layer Defs GaAs:AEL Cust ADS 2011 Multi-technology Environment New Library construct maintains separate technology definition areas • No namespace collisions • No layer mapping needed • No PDK conflicts Page 8 Multi-Technology Design & Library Management Page 9 Multi-Technology Circuit Simulation • Simulate critical circuits across multiple technologies • Design closer to the margins • Detect and solve issues before manufacturing Page 10 Module Laminate Mixer SiGe LNA GaAs Native Physical Multi-Substrate Support • Easily add one or more pre-defined substrates – IC in a package, IC in a module, module on a board, etc. • Unlimited levels of technology stacking – i.e. IC on a module on a PCB • Supports flip chips, wire bonding, and backside mounting • No modification of layers required • Directly modify any of the designs – No flattening required • Works with all the ADS tools – Layout, 3D Visualization, Momentum and FEM, etc. Easy to combine multiple substrates Page 11 New graphical substrate editor Page 12 ADS Integrated 3D EM Flow Momentum & FEM in ADS, 3D EM Components & EMPro/FDTD link EMPro PlatformADS Platform FDTD SimulatorFEM SimulatorMomentum Simulator Parameterized 3D EM Components Layout CAD Data Multi-Technology EM Simulation Capabilities & Vision • Discover coupling effects prior to fabrication • More effectively optimize design elements for final packaging • More easily make design trade-offs • Help diagnose and solve performance problems Page 13 + = 3D view FEMMomentum + Package IC IC Multi-technology EM Simulation Improved RF Circuit Design and Simulation Page 14 Views Easily Manage Models & Design Representations • Cells represent a single design object • Cell Views provide multiple representations of that design object – Different schematic variants, behavioral, measured, layout, EM data views, etc. – User defined • Simplifies schematics • Easily select simulation model • Explore design variants Cell name Views Page 15 Dynamic Simulation Model Selection Design, by its nature, is evolutionary. Selecting model type and accuracy is key to this. This makes it simple and virtually instantaneous. • Easily select the model to use for simulation – Tradeoff speed vs. accuracy • Works on one or more selected components • Current active model is shown on the schematic • Easily create a model priority list to work on entire design hierarchy Page 16 Major Improvements to Load Pull From load pull to design in a few clicks • New load pull data controller – Handles Maury load pull data • Direct, instant loading of load pull data – Handles multiple files – Easier review of data • Immediately simulate matching network – Easier design optimization, including improved discrete optimization – Automatic interpolation of scattered measurement data • Automatically display performance parameters Fast, Easy, Intuitive Page 17 Making EM Simulation Part of Everyone’s Design Flow Page 18 New Graphical Layer Definition • Graphical, unified entry of layer and stackup data – Defines layers and properties for Layout, Momentum, and FEM • Easy drag and drop operations – Easily select and modify properties • Simpler, faster, and less error prone Page 19 New Streamlined EM Setup Making EM Work for Everyone • Single dialog replaces 8 – Easily navigate & review the setup options • Same setup for Momentum, Momentum RF, & FEM – Easy to try different solvers on the same design • Setup is automatically saved and can be reused for other EM simulations Previous EM Setup ADS 2011 Page 20 Reusing Saved EM Setup Configurations Making EM Work for Everyone • Makes it possible for non-experts to create accurate EM models • Big productivity improvement for all users • Easier to experiment with different setup options Foundry PDK EM Expert Packaged With ADS Design Engineer Designer’s own setups Saves Mouse Clicks (30 down to 3) Use saved setups on new work Page 21 New Integrated EM Port Viewer/Editor Features of new Port Editor • Copy a value and paste to multiple ports • New filtering – Quickly find ports by attributes – Filter on one or multiple attributes • Automatic port generation • Automatic port re- sequencing Page 22 Auto Multi-port Editor Combined Multi-port Viewer & Editor Single port Editor Preprocessor Mesher (2nd generation ) Solver New Momentum 2nd Generation Mesher • Increased accuracy, robustness and performance – Fast floating-point interval arithmetic • Improved mesh quality – Avoids slivers – Improved handling of small and wide shapes – New algorithm for edge mesh and overlap extraction • Reduced mesh complexity – New quadrangles rectangle NEW quadrilateral triangle Page 23 OLD NEW Example: PDN impedance Freq sweep 0-3 GHz Matrix size: 17.501 2005 2008 2010 solve time load time solve time load time load time 2003 Release Load Solve Storage 2005A 2008U1 2011 dense (N2) direct (N3) dense (N2) dense (N2) iterative (NpN2) dense (N2) dense (N2) direct (NlogN)1.5 sparse (NlogN) sparse (NlogN) direct (NlogN)1.5 sparse(NlogN) 2003A Momentum Solver – 5 years of (R)evolution Page 24 * Performance will vary dependent on complexity, frequency and other factors Expanded Bondwire Support • New, fast analysis of bondwires in Momentum – Automatically modeled as part of Momentum simulation – Calculates self and mutual inductance – FEM provides the most accurate analysis • Bondwires work for both Momentum and FEM – Easily create the bondwire in Layout – Full parametric control of bondwire profile • Jedec Bondwire – Follows the JEDEC standard parameters • Shape Bondwire – More flexible control of the bondwire profile • Bondwires now have edit handles Page 25 Set parameters Create and edit in 2D Render in 3D Layout Page 26 Layout Usability: Object Handles • Directly work on objects – quick & efficient • Objects with handles – Arcs, Circles, Polylines, Polygons, Rectangles, Text – Transmission Lines, Paths, Wires, Traces, Annotations, Wire Labels, Rulers, Dimension Lines • Infrastructure available for end user customization – Add handles to pdk components and design kits – Customizable behavior Page 27 Layout Command Line & Toolbar • Command line provides efficient keyboard entry for common functions • User can add their own functions to the command line • The toolbar provides single click operations for frequently used features – Set vertex selection on/off, control pin-number display and align shapes Page 28 Layout Command Line - Current Functions Page 29 Performance w/ & w/o package Accurately predict real performance QFN Designer Predict Packaged Performance in Minutes Page 30 Quickly synthesize complex package, combine with IC & PCB data Configure QFN package And much more … Page 31 Data Display Improvements • Improved Smith Chart graphics – Better display of chart values – Better overall look and data granularity • Set color for a group of traces – Easier interpretation of sweeps • Improved Data Display Template Browser – Real time quick search – Direct editing of template properties – Save As and Delete from the Browser Page 32 Other 2011 Improvements – Circuit Simulation • Linear Simulation Speedup - up to 10X – For fully-linear circuits with swept, tuned, or optimized simulations • Improved Transmission line models (including multi-layer library) – More accurate broad-band skin effect calculation – New, advanced method of calculating surface roughness loss – More accurate calculation of Power/Ground Plane loss • Output simulator results in Matlab format – New controller makes it possible to filter the output • New models supported – NXP SiMKit 3.4, PSP 102.3.4 and 103.1.1, Mextram 504.8, BSIMSOI 4.3.0, BSIM 4.6.5, HiSIM_HV 1.2.0, MOSVAR 1.1, R3, PSPICE diode • Support for Verilog A now included as part of ADS Core for use with all simulators Page 33 Other 2011 Improvements • Desktop LVS Viewer can now display Calibre errors • Backside component support • Allegro/ADS link (IFF for Allegro) now included in shipping product • New entry mode for circles and rectangles – Use CTRL key and first point will be the center of the shape • New Array Reference (AREFs) objects to Layout – Much more memory efficient way to create large arrays of objects • Advanced Model Composer (AMC) models can now be created with FEM • Layout connectivity engine is up to 40X faster than previous releases • Layout layers can now have sub-layers (purposes) – Can visually distinguish different objects drawn on a layer Page 34 Signal Integrity/Power Integrity • Power Integrity with Momentum – Unique capability for PI analysis on split power/ground plane PCBs – Accurate modeling of multi-GHz effects – Easy setup with SI/PI Analysis tool • IBIS AMI simulation support – Fast, accurate SERDES models for ‘what if…?’ channel simulation • More accurate modeling of high frequency effects in PCB transmission lines (multi layer models library and Momentum) – Surface roughness of copper traces – MLM causal dielectric loss algorithm now added to Momentum also Page 35 Improved Accuracy for Conductor Models New Multi-level Hemispherical Model Available in Momentum and Circuit Simulation Closer correlation to measured data Hammerstad Hemispherical NEW Multi-level 2 4 6 8 10 12 14 160 -5 -4 -3 -2 -1 -6 0 freq, GHz Measured Data Agilent 5500 Atomic Force Microscope • More accurately reflects conductor surface • Can use AFM measurements to set params Page 36 Support for International Character Set • Can create annotations / documentation with international characters • Provided in schematic and data display Page 37 ADS 2011 Summary • ADS 2011 new capabilities for multi-technology RF design • ADS 2011 makes electromagnetic simulation easier for all designers • New circuit and electromagnetic simulation technologies increase performance and usability • New physical design capabilities to make ADS Layout more powerful • IBIS-AMI simulation support & new Signal Integrity/Power Integrity wizard for split Power/Ground planes Agilent EEsof EDA “Innovative Solutions, Breakthrough Results” Page 38 Questions? Page 39 For More Information Page 40 Agilent ADS 2011 Web page (new feature details) www.agilent.com/find/eesof-ads2011 ADS 2011 on YouTube www.youtube.com/user/AgilentEEsof ADS 2011 Overview (Quick Start Video, Multi-technology Tutorials, …) www.agilent.com/find/eesof-ads2011-overview You can find more webcasts www.agilent.com/find/eesof-innovations-in-eda www.agilent.com/find/eesof-webcasts-recorded You are invited Amolak Badesha Senior Application Expert Agilent Technologies Page 41 Page 42 Innovations in EDA Webcast Series: Multi-Technology RF Design Using the New Advances in ADS 2011 ADS 2011: The IC/Module/Package/Board Design Solution Joe Civello ADS Product Manager Agilent EEsof EDA July 2009 Agilent EEsof EDA Overview Welcome Agenda Complete MMIC/Module ADS Desktop Design RF & Microwave Market Trends ADS 2011: The IC/Module/Package/PCB Design Solution�Realizing the Multi-Technology Vision Designing Across Multiple Technologies The Multi-Technology Challenge True Multi-Technology Management Multi-Technology Design & Library Management Multi-Technology Circuit Simulation Native Physical Multi-Substrate Support Slide Number 12 Multi-Technology EM Simulation�Capabilities & Vision Improved RF Circuit Design and Simulation Views�Easily Manage Models & Design Representations Dynamic Simulation Model Selection Major Improvements to Load Pull�From load pull to design in a few clicks Making EM Simulation �Part of Everyone’s Design Flow New Graphical Layer Definition New Streamlined EM Setup�Making EM Work for Everyone� Reusing Saved EM Setup Configurations� Making EM Work for Everyone New Integrated EM Port Viewer/Editor New Momentum 2nd Generation Mesher Momentum Solver – 5 years of (R)evolution Expanded Bondwire Support Layout Layout Usability: Object Handles Layout Command Line & Toolbar Layout Command Line - Current Functions QFN Designer�Predict Packaged Performance in Minutes And much more … Data Display Improvements Other 2011 Improvements – Circuit Simulation Other 2011 Improvements Signal Integrity/Power Integrity Improved Accuracy for Conductor Models�New Multi-level Hemispherical Model�Available in Momentum and Circuit Simulation Support for International Character Set ADS 2011 Summary Questions? For More Information You are invited Slide Number 42