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NE5532 5532A SA5532 5532A TI

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NE5532 5532A SA5532 5532A TI ������� �������� ������� ������� �� �� ������ ����������� ���������� SLOS075H − NOVEMBER 1979 − REVISED MAY 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 � Equivalent Input Noise Voltage 5 nV/√Hz Typ at 1 kHz � Unity-Gain Bandwidth . . . 10 MHz Ty...

NE5532 5532A SA5532 5532A TI
������� �������� ������� ������� �� �� ������ ����������� ���������� SLOS075H − NOVEMBER 1979 − REVISED MAY 2004 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 � Equivalent Input Noise Voltage 5 nV/√Hz Typ at 1 kHz � Unity-Gain Bandwidth . . . 10 MHz Typ � Common-Mode Rejection Ratio . . . 100 dB Typ � High dc Voltage Gain . . . 100 V/mV Typ � Peak-to-Peak Output Voltage Swing 32 V Typ With VCC± = ±18 V and RL = 600 Ω � High Slew Rate . . . 9 V/µs Typ � Wide Supply-Voltage Range . . . ±3 V to ±20 V description/ordering information The NE5532, NE5532A, SA5532, and SA5532A are high-performance operational amplifiers combining excellent dc and ac characteristics. They feature very low noise, high output-drive capability, high unity-gain and maximum-output-swing bandwidths, low distortion, high slew rate, input-protection diodes, and output short-circuit protection. These operational amplifiers are compensated internally for unity-gain operation. These devices have specified maximum limits for equivalent input noise voltage. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP − P Tube of 50 NE5532P NE5532P PDIP − P Tube of 50 NE5532AP NE5532AP Tube of 75 NE5532D N5532 0°C to 70°C SOIC − D Reel of 2500 NE5532DR N5532 0°C to 70°C SOIC − D Tube of 75 NE5532AD N5532A Reel of 2500 NE5532ADR N5532A SOP − PS Reel of 2000 NE5532PSR N5532 SOP − PS Reel of 2000 NE5532APSR N5532A PDIP − P Tube of 50 SA5532P SA5532P PDIP − P Tube of 50 SA5532AP SA5532AP −40°C to 85°C Tube of 75 SA5532D SA5532−40°C to 85°C SOIC − D Reel of 2500 SA5532DR SA5532 SOIC − D Tube of 75 SA5532AD SA5532A Reel of 2500 SA5532ADR SA5532A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright  2004, Texas Instruments Incorporated��� ����� ��� ����������� �� �!��"�� �� �� #!$%������� &��"' ���&!��� ������� �� �#"����������� #"� �(" �"��� �� �")�� �����!�"��� ����&��& *������+' ���&!����� #���"����, &�"� ��� �"�"�����%+ ���%!&" �"����, �� �%% #����"�"��' 1 2 3 4 8 7 6 5 1OUT 1IN− 1IN+ VCC− VCC+ 2OUT 2IN− 2IN+ NE5532, NE5532A . . . D, P, OR PS PACKAGE SA5532, SA5532A . . . D OR P PACKAGE (TOP VIEW) Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 查询NE5532AD供应商 ������� �������� ������� ������� �� �� ������ ����������� ���������� SLOS075H − NOVEMBER 1979 − REVISED MAY 2004 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 schematic (each amplifier) OUT VCC− VCC+ 36 pF 37 pF 14 pF 7 pF 15 Ω 460 Ω 15 Ω IN+ IN− Component values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)� † Supply voltage (see Note 1): VCC+ 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC− −22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage, either input (see Notes 1 and 2) VCC±. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input current (see Note 3) ±10 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Notes 5 and 6): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . P package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . PS package 95°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC−. 2. The magnitude of the input voltage must never exceed the magnitude of the supply voltage. 3. Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some limiting resistance is used. 4. The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the maximum dissipation rating is not exceeded. 5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 6. The package thermal impedance is calculated in accordance with JESD 51-7. ������� �������� ������� ������� �� �� ������ ����������� ���������� SLOS075H − NOVEMBER 1979 − REVISED MAY 2004 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions MIN MAX UNIT VCC+ Supply voltage 5 15 V VCC− Supply voltage −5 −15 V TA Operating free-air temperature range NE5532, NE5532A 0 70 °CTA Operating free-air temperature range SA5532, SA5532A −40 85 °C electrical characteristics, VCC± = +15 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS† NE5532, NE5532A SA5532, SA5532A UNITPARAMETER TEST CONDITIONS† MIN TYP MAX UNIT VIO Input offset voltage VO = 0 TA = 25°C 0.5 4 mVVIO Input offset voltage VO = 0 TA = Full range‡ 5 mV IIO Input offset current TA = 25°C 10 150 nAIIO Input offset current TA = Full range‡ 200 nA IIB Input bias current TA = 25°C 200 800 nAIIB Input bias current TA = Full range‡ 1000 nA VICR Common-mode input-voltage range ±12 ±13 V VOPP Maximum peak-to-peak output-voltage swing RL ≥ 600 Ω VCC± = ±15 V 24 26 VVOPP Maximum peak-to-peak output-voltage swing RL ≥ 600 Ω VCC± = ±18 V 30 32 V RL ≥ 600 Ω, TA = 25°C 15 50 AVD Large-signal RL ≥ 600 Ω, VO = ±10 V TA = Full range‡ 10 V/mVAVD Large-signal differential-voltage amplification RL ≥ 2 kΩ, TA = 25°C 25 100 V/mVdifferential-voltage amplification RL ≥ 2 kΩ, VO = ±10 V TA = Full range‡ 15 Avd Small-signal differential-voltage amplification f = 10 kHz 2.2 V/mV BOM Maximum-output-swing bandwidth RL = 600 Ω VO = ±10 V 140 kHzBOM Maximum-output-swing bandwidth RL = 600 Ω VCC± = ±18 V, VO = ±14 V 100 kHz B1 Unity-gain bandwidth RL = 600 Ω, CL = 100 pF 10 MHz ri Input resistance 30 300 kΩ zo Output impedance AVD = 30 dB, RL = 600 Ω, f = 10 kHz 0.3 Ω CMRR Common-mode rejection ratio VIC = VICR min 70 100 dB kSVR Supply-voltage rejection ratio (∆VCC±/∆VIO) VCC± = ±9 V to ±15 V, VO = 0 80 100 dB IOS Output short-circuit current 10 38 60 mA ICC Total supply curent VO = 0, No load 8 16 mA Crosstalk attenuation (VO1/VO2) V01 = 10 V peak, f = 1 kHz 110 dB † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. ‡ Full temperature ranges are: −40°C to 85°C for the SA5532 and SA5532A, and 0°C to 70°C for the NE5532 and NE5532A. ������� �������� ������� ������� �� �� ������ ����������� ���������� SLOS075H − NOVEMBER 1979 − REVISED MAY 2004 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 operating characteristics, VCC± = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS NE5532, SA5532 NE5532A, SA5532A UNITPARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT SR Slew rate at unity gain 9 9 V/µs Overshoot factor VI = 100 mV,RL = 600 Ω, AVD = 1, CL = 100 pF 10 10 % Vn Equivalent input noise voltage f = 30 Hz 8 8 10 nV/√HzVn Equivalent input noise voltage f = 1 kHz 5 5 6 nV/√Hz In Equivalent input noise current f = 30 Hz 2.7 2.7 pA/√HzIn Equivalent input noise current f = 1 kHz 0.7 0.7 pA/√Hz PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) NE5532AD ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR NE5532ADR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR NE5532AIP OBSOLETE PDIP P 8 None Call TI Call TI NE5532AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC NE5532APSR ACTIVE SO PS 8 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM NE5532D ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR NE5532DR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR NE5532IP OBSOLETE PDIP P 8 None Call TI Call TI NE5532P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC NE5532PSR ACTIVE SO PS 8 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SA5532AD ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SA5532ADR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SA5532AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SA5532D ACTIVE SOIC D 8 75 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SA5532DR ACTIVE SOIC D 8 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SA5532P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2005 Addendum-Page 1 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 18-Feb-2005 Addendum-Page 2 MECHANICAL DATA MPDI001A – JANUARY 1995 – REVISED JUNE 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 8 4 0.015 (0,38) Gage Plane 0.325 (8,26) 0.300 (7,62) 0.010 (0,25) NOM MAX 0.430 (10,92) 4040082/D 05/98 0.200 (5,08) MAX 0.125 (3,18) MIN 5 0.355 (9,02) 0.020 (0,51) MIN 0.070 (1,78) MAX 0.240 (6,10) 0.260 (6,60) 0.400 (10,60) 1 0.015 (0,38) 0.021 (0,53) Seating Plane M0.010 (0,25) 0.100 (2,54) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2005, Texas Instruments Incorporated WWW.ALLDATASHEET.COM Copyright © Each Manufacturing Company. All Datasheets cannot be modified without permission. This datasheet has been download from : www.AllDataSheet.com 100% Free DataSheet Search Site. 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