排阻封装尺寸

YAGEO CORPORATION SMD RESISTORS SCHEMATICS Thick Film Chip Resistors Network YC Series [ For 8Pin/4R ] APPLICATIONS Telecommunication Equipment Lap-Top and Note-Book Computer R1=R2=R3=R4 0.6±0.1 0. 3± 0. 15 1 2 3 4 8 7 6 5 R1 R2 R3 R4 YC12 YC16 YC32 DIMENSIONS YC12 YC16 0.65±0.05 0. 3± 0. 15 2.0±0.2 0.45±0.1 0.5±0.050.45±0.05 0. 2± 0. 15 1. 0± 0. 15 0. 3± 0. 15 0.3±0.05 YC32 0.9±0.15 3.2±0.2 1.1±0.15 1.27±0.05 0. 5± 0. 2 0. 5± 0. 15 3. 2± 0. 2 0.6±0.1 0.8±0.05 0.5±0.15 3.2±0.2 5.08±0.2 Unit : mm YC12 YC16 YC32 1. 6± 0. 15 21 Note : ELECTRICAL CHARACTERISTICS STYLE YC12 YC16 YC32 Power Rating at 70°C 1/16W 1/8W Operating Temp. Range -55ºC to +125ºC Maximum Working Voltage 50V 200V Maximum Overload Voltage 100V 400V Dielectric Withstand Voltage 100V 500V Number of Resistors 4 Resistance Range 10Ω ~ 1MΩ Temperature Coefficient ±200ppm/ºC Resistance Tolerance ±5% ENVIRONMENTAL CHARACTERISTICS PERFORMANCE TEST TEST METHOD APPRAISE Temperature Coefficient MIL-STD-202F, Method 304 -55°C to +125°C by Type Thermal Shock MIL-STD-202F, Method 107 5 Cycles, -55°C to +125°C (Step by Step 2min.) ± (1%+0.05Ω) Low Temperature Operation MIL-R-55342D, Para.4.7.4 One Hour at -65°C Followed by 45 Minutes RCWV ± (1%+0.05Ω) Short Time Overload MIL-R-55342D, Para.4.7.5 2.5 Times RCWV for 5 Seconds ± (2%+0.05Ω) Insulation Resistance MIL-STD-202F, Method 302 RCOV for 1 Minute >10GΩ Dielectric Withstand Voltage MIL-STD-202F, Method 301 R.M.S. for 1 Minute by Type Resistance to Soldering Heat MIL-STD-202F, Method 210C Soldered to Test Board at 260ºC for 10 Seconds ± (1%+0.05Ω) Moisture Resistance MIL-STD-202F, Method 106F 42Cycles.Total 1000 Hours ± (2%+0.05Ω) Life MIL-STD-202F, Method 108A 1000 Hours at 70°C RCWV Intermittent ± (3%+0.10Ω) Solderability MIL-STD-202F, Method 208G 230°C for 5 Seconds >95% Coverage Bending Strength JIS-C-5202, Para.6.1.4 Unit Mounted in Center of 90mm Board Length, ± (1%+0.05Ω) Deflected 1mm in Either Direction for 5 Seconds 20 YAGEO CORPORATION SMD RESISTORS YC17 Thick Film Chip Resistors Network YC Series [ For 9Pin/8R 10Pin/8R ] DIMENSIONS APPLICATIONS Telecommunication Equipment Lap-Top and Note-Book Computer SCHEMATICS YC15/17 YC35 YC15 YC35 0.9±0.15 1.27±0.05 0.6±0.1 3. 2± 0. 2 6.4±0.2 0. 5± 0. 15 0. 5± 0. 15 Unit : mm T 10 9 8 7 6 1 2 3 4 5 L T 1 2 3 4 5 1 2 3 4 5 10 9 8 7 6 10 9 8 7 6 0.35±0.05 0.64±0.05 0.6±0.1 1. 6± 0. 15 3.2±0.2 0. 35 ±0 .1 5 0. 4± 0. 1 R1=R2=R3=R4=R5=R6=R7=R8 R8 R7 R6 R5 R1 R2 R3 R4 R8 R7 R6 R5 R1 R2 R3 R4 R8 R7 R6 R5 R1 R2 R3 R4 1.1±0.15 YC15 YC35 0.45±0.05 1 2 3 4 5 10 9 8 7 6 R1 R2 R3 R4 R8 R7 R6 R5 YC17 0. 30 ±0 .1 5 23 Note : ELECTRICAL CHARACTERISTICS STYLE YC15 YC17 YC35 Power Rating at 70°C 1/32W 1/16W Operating Temp. Range -55ºC to +125ºC (Derated to 0 Load at +125ºC) Maximum Working Voltage 25V 50V Maximum Overload Voltage 50V 100V Dielectric Withstand Voltage 50V 100V Number of Resistors 8 Resistance Range 33Ω ~ 100KΩ 10Ω ~ 330KΩ Temperature Coefficient ±200ppm/ºC Resistance Tolerance ±5% 22 ENVIRONMENTAL CHARACTERISTICS PERFORMANCE TEST TEST METHOD APPRAISE Temperature Coefficient MIL-STD-202F, Method 304 -55°C to +125°C ±200ppm/ºC Thermal Shock MIL-STD-202F, Method 107 5 Cycles, -55°C to +125°C (Step by Step 2min) ± (1%+0.05Ω) Low Temperature Operation MIL-R-55342D, Para.4.7.4 One Hour at -65°C Followed by 45 Minutes RCWV ± (1%+0.05Ω) Short Time Overload MIL-R-55342D, Para.4.7.5 2.5 Times RCWV for 5 Seconds ± (2%+0.05Ω) Insulation Resistance MIL-STD-202F, Method 302 RCOV for 1 Minute >10GΩ Dielectric Withstand Voltage MIL-STD-202F, Method 301 R.M.S. for 1 Minute by Type Resistance to Soldering Heat MIL-STD-202F, Method 210C Soldered to Test Board at 260ºC for 10 Seconds ± (1%+0.05Ω) Moisture Resistance MIL-STD-202F, Method 106F 42Cycles. Total 1000 Hours ± (2%+0.05Ω) Life MIL-STD-202F, Method 108A 1000 Hours at 70°C RCWV Intermittent ± (3%+0.1Ω) Solderability MIL-STD-202F, Method 208G 230°C for 5 Seconds >95% coverage Bending Strength JIS-C-5202, Para.6.1.4 Unit Mounted in Center of 90mm Board Length, Deflected 1mm in Either ± (1%+0.05Ω) Direction for 5 Seconds YAGEO CORPORATION SMD RESISTORS Thick Film Chip Resistors Network YC Series [ For 16Pin/8R ] APPLICATIONS Telecommunication Equipment Lap-Top and Note-Book Computer SCHEMATICS YC24 DIMENSIONS 0.45±0.05 0.3±0.05 0.5±0.05 0.45±0.1 1. 6± 0. 15 4.0±0.2 0. 4± 0. 15 0. 3± 0. 15 Unit : mm 1 2 3 4 5 6 7 8 R1=R2=R3=R4=R5=R6=R7=R8 R1 R2 R3 R4 R5 R6 R7 YC24 16 15 14 13 12 11 10 9 R8 25 Note : ELECTRICAL CHARACTERISTICS STYLE YC24 Power Rating at 70°C 1/16W Operating Temp. Range -55ºC to + 125ºC (Derated to 0 Load at + 125ºC) Maximum Working Voltage 50V Maximum Overload Voltage 100V Dielectric Withstand Voltage 100V Number of Resistors 8 Resistance Range 10Ω ~ 1MΩ Temperature Coefficient ±200ppm/ºC Resistance Tolerance ±5% 24 ENVIRONMENTAL CHARACTERISTICS PERFORMANCE TEST TEST METHOD APPRAISE Temperature Coefficient MIL-STD-202F, Method 304 -55°C to +125°C ±200ppm/ºC Thermal Shock MIL-STD-202F, Method 107 5 Cycles, -55°C to +125°C (Step by Step 2min.) ± (1%+0.05Ω) Low Temperature Operation MIL-R-55342D, Para.4.7.4 One Hour at -65°C Followed by 45 Minutes RCWV ± (1%+0.05Ω) Short Time Overload MIL-R-55342D, Para.4.7.5 2.5 Times RCWV for 5 Seconds ± (2%+0.05Ω) Insulation Resistance MIL-STD-202F, Method 302 RCOV for 1 Minute >10GΩ Dielectric Withstand Voltage MIL-STD-202F, Method 301 R.M.S. for 1 Minute by Type Resistance to Soldering Heat MIL-STD-202F, Method 210C Soldered to Test Board at 260ºC for 10 Seconds ± (1%+0.05Ω) Moisture Resistance MIL-STD-202F, Method 106F 42Cycles. Total 1000 Hours ± (2%+0.05Ω) Life MIL-STD-202F, Method 108A 1000 Hours at 70°C RCWV Intermittent ± (3%+0.1Ω) Solderability MIL-STD-202F, Method 208G 230°C for 5 Seconds >95% Coverage Bending Strength JIS-C-5202, Para.6.1.4 Unit Mounted in Center of 90mm Board Length, ± (1%+0.05Ω) Deflected 1mm in Either Direction for 5 Seconds