3TT250NKM17B31524

BipSTACK © Infineon Technologies AG 2008 – All rights reserved Documentation and Operating Instructions Product: BipSTACK Application: Rectifiers and AC- Controllers Revision: Rev. 1.1 10. March 2009 © Infineon Technologie AG 2008 Page 2 CONTENTS 1 Introduction ........................................................................................................................ 4 2 The BipSTACK overview.................................................................................................. 5 2.1 BipSTACK – what is it?............................................................................................. 5 2.2 Appropriate use .......................................................................................................... 6 2.3 Difference: Stack – Block – Component.................................................................... 6 3 The BipSTACK in detail.................................................................................................... 7 3.1 BipSTACK Type designation .................................................................................... 7 3.1.1 Detailed designation according to DIN41762 (old) ........................................... 7 3.1.2 Standardised type designation (New)................................................................. 7 3.1.3 Sales name.......................................................................................................... 7 3.2 BipSTACK Datasheet ................................................................................................ 8 3.3 Connection topologies.............................................................................................. 11 3.3.1 B-Circuits ......................................................................................................... 11 3.3.2 M-Circuits ........................................................................................................ 11 3.3.3 W-Circuits ........................................................................................................ 11 3.3.4 Pulsed-Power.................................................................................................... 11 3.4 Mechanical construction .......................................................................................... 11 3.4.1 BipSTACK with semiconductor modules........................................................ 11 3.4.2 BipSTACK with disc cells ............................................................................... 12 3.4.3 Special notes for water cooling ........................................................................ 14 3.5 Control and sensors .................................................................................................. 16 3.5.1 Protection against over-voltages ...................................................................... 16 3.5.2 Temperature switch .......................................................................................... 17 3.5.3 Fuses and fuse monitoring................................................................................ 17 3.5.4 Trigger transformer .......................................................................................... 18 4 Selection of the suitable BipSTACK ............................................................................... 19 4.1 Calculatory basics .................................................................................................... 19 4.1.1 Temperatures.................................................................................................... 19 4.1.2 Frequencies....................................................................................................... 19 4.1.3 Power dissipation (losses) ................................................................................ 19 4.1.4 Form factor and current load............................................................................ 19 4.1.5 Over-voltages, blocking voltage ...................................................................... 20 4.1.6 Parallel connection ........................................................................................... 20 4.2 Standard BipSTACK-series ..................................................................................... 20 4.3 Request an offer ....................................................................................................... 21 4.4 Extent of customer specific BipSTACK offers........................................................ 21 5 Safety notices ................................................................................................................... 22 5.1 Transport and storage ............................................................................................... 22 5.1.1 Transport .......................................................................................................... 22 5.1.2 Storage.............................................................................................................. 22 5.2 Commissioning......................................................................................................... 22 © Infineon Technologie AG 2008 Page 3 5.2.1 Notes for installation ........................................................................................ 22 5.2.2 Installation and commissioning........................................................................ 22 5.3 Maintenance ............................................................................................................. 23 5.3.1 General notices for maintenance ...................................................................... 23 5.3.2 Exchange of fuses............................................................................................. 23 5.3.3 Exchange of components in air cooled stacks.................................................. 23 5.3.4 Exchange of components in water cooled stacks ............................................. 28 6 Appendix .......................................................................................................................... 30 6.1 Calculation table for typical circuit types ................................................................ 30 6.2 Request for a technical offer .................................................................................... 32 6.3 Reference table for water cooling ............................................................................ 37 6.4 Further associated documentation............................................................................ 38 6.5 Indices ...................................................................................................................... 39 6.5.1 Index of terms................................................................................................... 39 6.5.2 List of figures ................................................................................................... 40 6.6 Conditions of use...................................................................................................... 41 6.7 Contact ..................................................................................................................... 42 © Infineon Technologie AG 2008 Page 4 1 Introduction This is the documentation for the BipSTACK product group and it describes this with regard to its technical features. It provides all hints and descriptions relevant to application and selection of the BipSTACK suitable for the application, for the design-in as well as the safe installation and commissioning of the BipSTACKs in their completed version. Further technical information can be found in the datasheet of the individual BipSTACK. This takes precedence over this document. The documentation begins with the classification of the BipSTACKs within the world of power electronics. Then, building on the technical descriptions and the associated application options, all relevant details in dealing with the product family are described. Contained are amongst others: • Description of the various circuits • Description of the mechanical construction • Introduction of the protection concepts • Basics of power rating • Election of the suitable stacks • As well as an introduction of other technical descriptions provided by Infineon Please read this documentation completely before using an Infineon BipSTACK. Only in this way can a flawless application be guaranteed. Also observe all safety notes. Possibly other functions may be available, not described in this document. This fact, however, does not necessitate to provide such functions with a new controller or at the time of maintenance. The compliance of the document’s contents with the described hardware and software has been checked. Differences may still exist, however; a guarantee for total convergence can not be given. The information contained in this document is reviewed on a regular basis and changes required will be published with the next version. Recommendations for improvement are welcome. The document is subject to change without prior notice. Reproduction, circulation or use of this document or of its content is permitted only with written authorisation. Contravention will be sued for damages. All rights are reserved including those arising from registered patents, trade names or designs. © Infineon Technologie AG 2008 Page 5 2 The BipSTACK overview This section provides an overview over the BipSTACK product family and classifies the product group within power electronics in general. 2.1 BipSTACK – what is it? The name of the product group BipSTACK requires some explanation. It has developed historically. “Bip” stands for bipolar. Diodes and thyristors (SCRs) are part of the bipolar components. Strictly speaking, IGBTs would have to be classified too as bipolar components, the segregation, however, has grown historically and is purely of administrative nature. The term “Stack” signifies an assembly. This means merging of different components with the aim to prepare one or more semiconductor components for an application. In this way construction or circuitry is provides for measures such as cooling or over-voltage protection during switching. A BipSTACK consists of a diode or thyristor assembly which is equipped with extras necessary (but not sufficient) for operation. Figure 1: Example of a BipSTACK: 2B6C with input protection circuitry and busbars: This assembly consists of 12 thyristors clamped into heatsinks. It is connected in such a way that two independent B6C rectifier circuits result. A circuit input suppressor network each protects from over- voltage. Copper busbars provide the AC and DC connections for the customer application. © Infineon Technologie AG 2008 Page 6 2.2 Appropriate use The BipSTACK can be implemented universally. Typical applications are: • Rectifier in immobile drive systems • Softstarter • Wind energy turbine (typically synchronous generators) • Galvanizing and plating plants • Pulsed-Power applications (surge voltage systems, generation of high magnetic intensity, linear accelerator…) The power rating starts at around 100kVA The upper limit is defined by the maximum size of semiconductor (usually disk cells) as well as the possible parallel connection in the MW range. The BipSTACK may only be operated within the data and calculation sheet listed in this document and the operating and safety conditions (3.2 BipSTACK Datasheet) explained. Further, mounting and commissioning notes (section Safety notes) are to be observed. For damages resulting from ignoring these, solely the user is responsible. The electro-technical purpose of BipSTACKs is the explicit rectification or inversion of electrical energy. The currents and voltages arising herby (depending on application either or, or both) may not be exceeded continuously. Non-observance will jeopardize the operating safety. Only especially trained and instructed personnel may commission, operate and maintain BipSTACKs. 2.3 Difference: Stack – Block – Component Figure 2: Difference: Stack – Block - Component If components (diodes, thyristors) are mounted onto a heatsink, the resulting assembly is called a block or also a cooling block. If several cooling blocks are interconnected and clustered to a larger unit and a suppressor circuit wired to it, then this results in a stack. Only stacks will have connection busbars, suppressor networks, fuses and trigger transformers and such like. © Infineon Technologie AG 2008 Page 7 3 The BipSTACK in detail This section describes the technical details of the product group BipSTACKs. 3.1 BipSTACK Type designation Two different type designations are in existence. The one historically developed according to DIN41762, and the new one, based on standardised sizes. 3.1.1 Detailed designation according to DIN41762 (old) The designation according to DIN41762 is application specific. In the main it is based on the values of the rated operating points regarding current and voltage in continuous operation. The DIN designation is no longer continued at Infineon. Exclusively the type designation based on standardised sizes will have currency this is a type designation independent of the operating point (see section 3.1.2). However it may happen that at the time of introduction of the new type designation existing stacks the DIN-conform designation is still used (as described further down in the datasheet descriptions). 3.1.2 Standardised type designation (New) The standardised type designation is independent of the operating point. It describes the BipSTACK with regard to the relevant components. The type designation can be found on the nameplate and the datasheet, but has only informative purpose. In the datasheet DIN41762 is further used to express rated values. 1 2 T 1 3 2 9 N 2 2 K 0 0 8 B X X X 1 2 Number of switches T 1 3 2 9 N 2 2 Type designation of switches K 0 0 8 Heatsink (here K0.08F) B Circuit topology B B6C/B6U W W3C/W1C A (B6C)A(B6C) M M3/M6/M3.2 V Block (not stack) 0 0 Option for standard STACKs B 0 1 SEB (input protection) B 0 2 Snubber (suppressor) circuit B 0 3 Snubber plus cell fuse B 0 4 Snubber plus branch fuse B 0 5 SEB plus cell fuse B 0 6 SEB plus branch fuse X Add-Ons for Non-Standard Stacks 3.1.3 Sales name The sales name is the designation for selling the product and its description, similar to the standardised type designation but without the aid of application parameters. The sales name is relevant for ordering. © Infineon Technologie AG 2008 Page 8 1 2 T 1 3 2 9 N 0 0 8 B 2 5 2 6 8 Sales name 1 2 Number of components T 1 3 2 9 N Designation of the components 0 0 8 Heatsink (here Ko.08F) 0 0 5 K0,05F 0 0 2 4 K0,024W K E 0 1 KE01 B Circuit (here Bx) W W - circuit A Anti-parallel connection e.g. (B6C)A(B6C) M M - circuit V Cooling block – no circuit 2 5 2 6 8 internal stack ID-number The possible heatsinks are denoted only exemplarily here. 3.2 BipSTACK Datasheet 3.2.1.1 Headline The headline can be found on each page of the datasheet. 1. - Technical information points out that the document is a datasheet. This specifies technical data for the correct use. – BipSTACK tells you which product family is concerned. (related product families: ModSTACK™, PrimeSTACK, LightSTACK) - Listing of the type designation (see also section: “BipSTACK Type designation”) 3.2.1.2 Cover sheet 1. Type of the characterised product 2. Listing of the various configuration variants of the characterised stack along with the associated SAP number. The datasheet always describes the possible configuration variants. 3. Details regarding the circuit topology of the power section (B6C, W1C etc.) – Permitted load type – Cooling type – Possible area of application – Supervision / monitoring – Semicond. (Unit1): Listing the bipolar semiconductor components (Number of semiconductors) x (Type of semiconductors used) – Heatsink – Fuse – Required trigger pulse for SCRs – Which Standards and regulations does the BipSTACK fulfil. © Infineon Technologie AG 2008 Page 9 3.2.1.3 Electrical data (Definition according to DIN57558) 1. Type connection voltage RMS Value of the sine shaped connection voltage. The mains voltage may be exceeded by 10% continuously. Whilst the type rated current of the stack may not be exceeded. 2. Type DC-voltage Output DC-voltage (average value) of the controlled rectifier stacks, resulting at type connection voltage, type DC-current and full conduction angle. 3. Type DC-current (for rectifier stacks) Maximum average on-state current of the stack. This derived from the maximum 3 1 2 1 2 3 4 5 6 © Infineon Technologie AG 2008 Page 10 average on-state current of the components and the circuit. The in and outlet of the cooling air may not be obstructed. The maximum average on-state current of the components in controlled stacks is valid at full conduction mode and active load. Controlled rectifiers may be loaded with the type DC-current over the entire control range provided the DC-current is sufficiently filtered. Type AC-current (with AC-controllers) Analogously the same applies as for DC-current, however, the type current is given as the RMS value. The AC-controller stacks may be loaded with the type current over a wide area of conduction angle. 4. Permitted current load during cases of overload. The listed current value does not lead to an exceedance of the maximum permitted junction temperature. 5. Power loss at rated operating point. Included in the calculation are only the on-state losses; no switching losses (see also section 4.1 Calculative basics) 6. Permitted component data of the semiconductors used. 3.2.1.4 Cooling Two basically different heatsinks exist: air cooled and water cooled. Depending on the cooling method used for the BipSTACK, only one of the heatsinks and datasheet blocks will appear. 1. Permissible (air or water) inlet temperatures at which, when they are exceeded, a current derating has to be calculated. Additional specification of the Rthja (Junction – Ambient) of a thyristor (single switch). 3.2.1.5 Options (add-ons) Listing of the snubber and protective circuits integrated into the stack with their individually most important characteristic values. Examples are: 1. - Temperature switches (normally closed or normally open) – fuses - fans © Infineon Technologie AG 2008 Page 11 3.3 Connection topologies The following describes the most important circuit topologies offered by Infineon BipSTACK. Further down and in the addendum you will find additional information, particularly key figures and parameters. 3.3.1 B-Circuits B-Circuit (e.g.B2U, B6U, B6C) are brid